Abstract: The present invention provides a structure of package comprising a substrate with a die through hole and a contact through holes structure formed there through, wherein a terminal pad is formed under the contact through hole structure and a contact pad is formed on a upper surface of the substrate. A die having a micro lens area is disposed within the die through hole by adhesion. A wire bonding is formed on the die and the substrate, wherein the wire bonding is coupled to the die and the contact pad. A protective layer is formed to cover the wire bonding. A transparent cover is disposed on the die within the die through hole by adhesion to expose the micro lens area. Conductive bumps are coupled to the terminal pads.

Abstract: The present invention provides an image sensor module structure comprising a substrate with a die receiving cavity formed within an upper surface of the substrate and conductive traces within the substrate and a die having a micro lens disposed within the die receiving cavity. A dielectric layer is formed on the die and the substrate, a re-distribution conductive layer (RDL) is formed on the dielectric layer, wherein the RDL is coupled to the die and the conductive traces and the dielectric layer has an opening to expose the micro lens. A lens holder is attached on the substrate and the lens holder has a lens attached an upper portion of the lens holder. A filter is attached between the lens and the micro lens. The structure further comprises a passive device on the upper surface of the substrate within the lens holder.

Abstract: The present invention provides a semiconductor device package having pseudo chips structure comprising a first substrate with die receiving through holes formed thereon; a first die having first bonding pads and a second die having second bonding pads disposed within the die receiving through holes, respectively; an adhesion material formed in the gap between the first and second die and sidewalls of the die receiving though holes of the first substrate; redistribution lines formed to couple the first contact pads formed on the first substrate to the first bonding pads and the second bonding pads, respectively; and a protection layer formed on the redistribution lines, the first die, the second die and the first substrate.

Abstract: A chip package including a multilayer substrate, an adhesive core layer and a chip is provided. The multilayer substrate has a plurality of material layers. The adhesive core layer is disposed on the multilayer substrate. The chip is disposed in the adhesive core layer. The chip has an active surface exposed outside the adhesive core layer. The chip includes a plurality of bonding pads disposed on the active surface and a plurality of metal conductive bodies electrically connected to the bonding pads respectively.

Abstract: A composition comprising a synthetic growth factor analogue comprising a non-growth factor heparin binding region, a linker and a sequence that binds specifically to a cell surface receptor and an osteoconductive material where the synthetic growth factor analogue is attached to and can be released from the osteoconductive material and is an amplifier/co-activator of osteoinduction.

Abstract: The present invention provides a separating process of a semiconductor device package of wafer level package. The method comprises a step of etching a substrate to form recesses. Then a buffer layer is formed on the first surface of the substrate, wherein the buffer layer is filled with the corresponding recesses to form infillings on adjacent the semiconductor device package. Dicing the wafer into individual package along substantial center of said infillings, the step may avoid the roughness on the edge of each die and also decrease the cost of the separating process.

Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.

Abstract: The method of forming image sensor protection comprises attaching a glass on a tape and scribing the glass with lines to define cover zones on the glass, the glass is then break by a rubber puncher followed by forming glue on the edge of the cover zones. The glass is bonded on a wafer with an image sensor to align the cover zones to a micron lens area of the image sensor, and then the tape is removed from the wafer, thereby forming glass with cover zones on the image sensor.

Abstract: A method and an apparatus for detecting, locating, and quantifying explosive materials and devices, and naturally occurring and man-made dangerous or hazardous biological and chemical materials and devices in ducts or piping systems, or other fluid flow systems in buildings such as residential, office, industrial, and power plants, transportation systems such as ships, airplanes, subways, and trains, and various types of infrastructure such as dams, tunnels, or bridges, and in the rooms, compartments, enclosures, containers, or difficult to access areas in these buildings, transportation systems, and structures. The preferred embodiment of this detection and location method uses a conservative tracer and one or more interactive tracers that are injected into the duct or area to be searched at one location and then monitored at the same or another location in the duct or area.

Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.

Abstract: The present invention discloses an image sensor module and forming method of wafer level package. The image sensor module comprises a metal alloy base, a wafer level package, a lens holder, and flexible printed circuits (F.P.C.). The wafer level package having a plurality of image sensor dice and a plurality of solder balls is attached to the metal alloy base. A plurality of lens are placed in the lens holder, and the lens holder is located on the image sensor dice. The lens holder is placed in the flexible printed circuits (F.P.C.), and the flexible printed circuits (F.P.C.) has a plurality of solder joints coupled to the solder balls for conveniently transmitting signal of the image sensor dice. Moreover, the image sensor dice may be packaged with passive components or other dice with a side by side structure or a stacking structure.

Abstract: The present invention provides an efficient test method and system for testing the IC package, such as BGA types of packages. With the present invention, manufacturer can have an easier way in testing various types of packages, including newer types. Manufacturer also can get the testing outcome which is more accurate. Furthermore, the present invention helps the manufacturer achieve a significant improvement in an IC packaging process.

Abstract: The present invention provides a 3D electronic packaging unit having a conductive supporting substrate that can achieve multi-chip stacking through the signal contacts on the both sides of the unit. The packaging unit can be batched manufactured on wafers or substrates, and thus reduce the manufacturing cost of each individual packaging unit; moreover, the conductive supporting substrate can be utilized to provide signal transmission of the electronic elements, and the supporting substrate can be used as a ground terminal for the carried electronic elements to enhance electric performance of the electronic elements. The supporting substrate is also a good thermal conductor that can release effectively heat energy generated by the electronic elements and accumulated inside the package to the outside of the package along the substrate to enhance reliability of the packaging structure.

Abstract: A wound dressing, method of making, and method of use, utilizing a polymeric film having complexed thereto by hydrophobic interaction a construct including a polyanion covalently bonded to a hydrophobic prosthetic moiety, with one or more bioactive molecules directly complexed to the polyanion. The polyanion may be heparin or a heparin-activity molecule. The prosthetic group may include a hydrophobic silyl-containing moiety. Bioactive molecules include adhesive molecules, growth factor molecules, and therapeutic molecules, including antibiotics.

Abstract: A structure of package comprises a die placed on printed circuit board. A glass substrate is adhered on an adhesive film pattern to form an air gap area between the glass substrate and the chip. Micro lens are disposed on the chip. A lens holder is fixed on printed circuit board. The glass substrate can prevent the micro lens from particle contamination.

Abstract: The present invention discloses a structure of wafer level packaging. The structure comprises a first patterned isolation layer, a conductive layer and a second patterned isolation layer. The first patterned isolation layer is formed with a passivation layer of an IC (Integrated Circuit). The conductive layer is configured to have a curved or winding conductive pattern. The second patterned isolation layer is formed over the conductive layer to have a plurality of openings, and contact metal balls can be formed on the openings to electrically couple to a print circuit board.

Abstract: Provided is a rotary bar screen device. The device includes a driving motor, an up/down pair of driving and driven sprockets, left and right transfer chains, a plurality of screen buckets, a removal unit, and a slide plate. The driving motor is provided over a support frame, and transmits a driving force. The driving and driven sprockets are driven by the driving force. The left and right transfer chains connect the driving and driven sprockets with each other while circulatively moving. The plurality of screen buckets are provided between the left and right transfer chains. The removal unit is provided between the left and right driving sprockets. The slide plate guides the foreign materials dropping from the screen buckets.

Abstract: The method includes a step of picking and placing standard good dice on a base for obtaining an appropriate and wider distance between dice than the original distance of dice on a wafer. The method of the chip-size package comprises the steps of separating dice on a wafer and picking and placing the dice on a base and filling a first material layer on the base into a space among the dice on the base. A dielectric layer with first openings is patterned to expose a portion of a conductive line of the dice. A conductive material is filled into the first openings and on the dielectric layer. Subsequently, a second material layer is formed to have a second openings exposing the conductive material and then welding solder balls on the second openings.

Abstract: An apparatus nails a plurality of cross members to an underlying stringer to produce a pallet. The carriage moves in a continuous motion without stopping over the cross members until the cross members are nailed to the stringer. The carriage includes at least one nailing gun for driving nails and a hydraulic accumulator mounted on the carriage in hydraulic communication with the at least one nailing gun for supplying hydraulic fluid to provide a force to the nailing gun to nail the cross members to the stringer. The nailing gun may be pivotally secured to the carriage wherein the nailing gun pivots with respect to the carriage while driving a nail into the cross member and the underlying stringer. The nail gun is also positioned into a nail driving position pneumatically and when in the nail driving position the hydraulic cylinder is actuated to drive the nail into the cross member.

Abstract: A package structure including a device, an interconnecting element, a pad and a protecting element is provided. The device connects with a first end of the interconnecting element through the pad. The protecting element covers the pad and the first end of the interconnecting element.