Patents Assigned to ERSA GmbH
-
Publication number: 20220355423Abstract: Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.Type: ApplicationFiled: May 3, 2022Publication date: November 10, 2022Applicant: ERSA GmbHInventor: Markus Sendelbach
-
Publication number: 20220339727Abstract: Center support for supporting solder material during the transport along a transport direction through a soldering system, transport unit, and soldering system having such a center support.Type: ApplicationFiled: April 21, 2022Publication date: October 27, 2022Applicant: ERSA GmbHInventors: Benedict Fleischmann, Michael Haas
-
Patent number: 11458558Abstract: The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.Type: GrantFiled: March 1, 2019Date of Patent: October 4, 2022Assignee: ERSA GmbHInventor: Alexander Leisering
-
Publication number: 20220295643Abstract: The invention concerns a reflow soldering machine for continuously soldering of soldering goods in a process channel along a process direction, whereby the process channel comprises at least one pre-heating zone, at least one soldering zone, and at least one cooling zone, whereby the soldering zone comprises a pressure chamber comprising one base part and one cover part opposite the base part and that can be raised when the reflow soldering machine is operating, wherein the process channel can be covered by at least one covering hood that can be opened, and wherein the cover part is motion-coupled to the covering hood in such a way that when the covering hood is opened, the cover part is also taken along by the covering hood.Type: ApplicationFiled: August 27, 2020Publication date: September 15, 2022Applicant: ERSA GmbHInventors: Thomas Huhler, Benedict Fleischmann, Ruppert Elmar
-
Publication number: 20220184726Abstract: Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.Type: ApplicationFiled: September 14, 2021Publication date: June 16, 2022Applicant: ERSA GmbHInventors: Sven Proppert, Theresa Christ
-
Patent number: 11292069Abstract: The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.Type: GrantFiled: July 2, 2018Date of Patent: April 5, 2022Assignee: ERSA GmbHInventor: Michael Schaefer
-
Patent number: 11267063Abstract: Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder (122) when the solder (122) flows out over at least part of a surface (124) of a soldering nozzle (116).Type: GrantFiled: July 2, 2018Date of Patent: March 8, 2022Assignee: ERSA GmbHInventor: Michael Schaefer
-
Patent number: 11154916Abstract: The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder.Type: GrantFiled: July 2, 2018Date of Patent: October 26, 2021Assignee: ERSA GmbHInventor: Stefan Voelker
-
Patent number: 11014180Abstract: Soldering system includes a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection, and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.Type: GrantFiled: October 22, 2018Date of Patent: May 25, 2021Assignee: ERSA GmbHInventors: Thomas Alletzhaeusser, Tim Alletzhaeusser
-
Publication number: 20210138515Abstract: The invention relates to a method for operating a soldering system for selective wave soldering comprising at least one solder crucible, the solder crucible comprising a solder reservoir, a solder nozzle and a solder pump, the solder pump being designed to guide the liquid solder out from the solder reservoir through the solder nozzle for generating a standing wave from liquid solder.Type: ApplicationFiled: July 2, 2018Publication date: May 13, 2021Applicant: ERSA GmbHInventor: Stefan Voelker
-
Publication number: 20210039183Abstract: The invention relates to a soldering nozzle for the simultaneous selective wave soldering of at least two spaced-apart rows of solder joints in a soldering installation, with a base portion which can be arranged on a nozzle plate, and with a wave portion which forms the solder wave during operation and which has a peripheral wall having a free upper side, and with at least one separating strip which can be inserted into the wave portion and which can be wetted with solder, wherein the at least one separating strip is formed as a frameless separating strip. The invention also relates to a soldering installation having a nozzle plate and having at least one soldering nozzle.Type: ApplicationFiled: March 1, 2019Publication date: February 11, 2021Applicant: ERSA GmbHInventor: Alexander Leisering
-
Publication number: 20200156169Abstract: Method for operating a soldering device and soldering device, wherein a graphic representation of at least part of the soldering device is captured, wherein an instantaneous operating state of the soldering device is determined by means of automated processing of the graphic representation dependent on information about the soldering device from the graphic representation, characterized in that the information about the soldering device is determined dependent on a reference representation of at least part of the soldering device, wherein the reference representation is captured as a graphic representation or wherein the reference representation is read as a graphic representation from a memory, and in that the reference representation characterizes a degree of oxidation of solder (122) when the solder (122) flows out over at least part of a surface (124) of a soldering nozzle (116).Type: ApplicationFiled: July 2, 2018Publication date: May 21, 2020Applicant: ERSA GmbHInventor: Michael Schaefer
-
Publication number: 20200156168Abstract: The invention relates to a soldering device for removing solder pearls and/or solder balls from the lower face of a printed circuit board, in particular a soldering device for a soldering system for a selective wave soldering process, comprising a brush device for removing solder pearls and/or solder balls from the lower face of a printed circuit board. The brush device has a brush which can be driven about a drive axis and which is designed to remove the solder pearls and/or solder balls, wherein a moving device is provided, said brush device being arranged on the moving device such that the brush device can be moved relative to the printed circuit board in the direction of an X, Y, and Z axis.Type: ApplicationFiled: July 2, 2018Publication date: May 21, 2020Applicant: ERSA GmbHInventors: Meinrad Eckert, Stefan Voelker
-
Publication number: 20200101548Abstract: The invention relates to a soldering system and a method for wave soldering, having at least one flux nozzle and a device for monitoring a state of a spray jet of the flux nozzle.Type: ApplicationFiled: July 2, 2018Publication date: April 2, 2020Applicant: ERSA GmbHInventor: Michael Schaefer
-
Publication number: 20200030961Abstract: Rework system for unsoldering and/or soldering electronic components on a circuit board, having a work table for fastening the circuit board, having a module which can travel along at least one X-axis and one Y-axis having at least one camera for accommodating electronic components provided on the circuit board, having a drive unit on which the module can travel with the camera, having a control unit for activating the drive unit, having a computing unit to which a display and user-operable input means are assigned, wherein the input means comprises a pointer which can be moved on the display and a command generator which can be operated in a positioning mode for positioning the camera in two steps (rough positioning and fine positioning).Type: ApplicationFiled: July 26, 2019Publication date: January 30, 2020Applicant: ERSA GmbHInventors: Udo Hofmann, Sai-Krishna Vuppala, Wolfram Sinn, Benedict Schulz
-
Patent number: 10500662Abstract: The invention relates to a device for feeding a stream of hot gas to a printed circuit board during convection soldering in a soldering installation. The feed device comprises a nozzle plate (1) having at least one drilled hole (3), which opens into a hot gas nozzle (2) arranged on the nozzle plate (1) and having a nozzle opening (4). The invention is defined in that the hot gas nozzle is formed by a flexible helical spring (2). The invention permits the nozzle plate with the hot gas nozzles to be advanced right up to the printed circuit board under all peripheral conditions which occur. In particular, the printed circuit board can, for instance, be advanced right up to the nozzle plate even when a central support for the printed circuit boards or some other disruptive contour is present.Type: GrantFiled: June 26, 2014Date of Patent: December 10, 2019Assignee: ERSA GMBHInventors: Lothar Endress, Hermann Beck
-
Publication number: 20190126375Abstract: Soldering system includes—a first soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which includes a communication module designed for setting up a wireless data connection,—and at least a second soldering device having a control apparatus that has a central microcontroller and/or microprocessor and is designed for controlling at least one operating parameter of the soldering device, wherein a radio module is provided which comprises a communication module designed for setting up a wireless data connection.Type: ApplicationFiled: October 22, 2018Publication date: May 2, 2019Applicant: ERSA GmbHInventors: Thomas Alletzhaeusser, Tim Alletzhaeusser
-
Patent number: 10217211Abstract: A method for placing electronic components onto a circuit board, comprising the following steps: Placing a component to be placed of a first component type into a starting position; creating a component image of the component to be placed in the starting position; creating a circuit board region image of a circuit board of a first circuit board region type; calculating a travel path for moving the component to be placed into a final position on the circuit board based upon an image overlay of the component image and a previously saved reference component image of a reference component of the first component type, and based upon a previously saved reference travel path of the reference component from a reference starting position into a reference final position on a reference circuit board of the first circuit board region type, and based upon an image overlay of the circuit board region image and a previously saved reference circuit board region image of the reference circuit board; moving the component to beType: GrantFiled: October 19, 2016Date of Patent: February 26, 2019Assignee: ERSA GmbHInventors: Udo Hofmann, Wolfram Sinn, Sergei Richter
-
Patent number: 10166619Abstract: A soldering pump for pumping an electrically conductive fluid—in particular, a liquid solder—said soldering pump having a feed channel which travels at least in segments along a circular path and has an inlet and an outlet, and having a device for generating a moving magnetic field, wherein the device comprises at least one permanent magnet, wherein the device is designed such that the permanent magnet is moved along the feed channel during operation.Type: GrantFiled: October 14, 2016Date of Patent: January 1, 2019Assignee: ERSA GmbHInventors: Simon Hame, Richard Kressmann
-
Patent number: 10081069Abstract: A device for soldering electrical or electronic components on a printed circuit board includes a soldering nozzle arrangement arranged above a solder crucible. The nozzle arrangement includes at least one carrier, on which at least one soldering nozzle is arranged. Molten solder is conveyed, using a conveyor unit, out of the solder crucible through the soldering nozzle to the components to be soldered. At least one discharge unit is arranged between a tip of the soldering nozzle and the carrier for any excess solder that has left the soldering nozzle. The discharge unit includes at least one baffle plate substantially surrounding the soldering nozzle.Type: GrantFiled: June 26, 2015Date of Patent: September 25, 2018Assignee: ERSA GMBHInventors: Stefan Völker, Egon Spachmann