Abstract: A system for determining a degree of contamination of production units of a production line for the printing, equipping and reflow soldering of printed circuit boards, and evaluation unit.

Abstract: Moving unit for moving two soldering assemblies connected by a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.

Abstract: The invention relates to a soldering tip assembly for an electric soldering device, in particular a soldering iron. The soldering tip assembly is designed to be releasably arranged on a soldering device handle which has a heating element, and the soldering tip assembly has a sleeve with a soldering tip provided on the distal end of the sleeve. The sleeve has an opening at the proximal end for introducing the heating element, wherein a holding element which at least partially surrounds the sleeve in an annular manner and a spring element which is provided between the holding element and the sleeve are provided, the spring element pushing the holding element in the distal direction. The sleeve has at least one stop arranged distally from the spring element. The stop secures the holding element against the soldering tip assembly in the distal direction.

Abstract: A network and a method for operating a network is provided. The network includes one or more soldering systems provided in the network, and the soldering systems each include at least one soldering apparatus for soldering electronic components, a user interface for outputting target-soldering-information to a user; and a way for determining actual soldering information. The network includes at least one input device for inputting and/or specifying work information, and a control unit which is designed to identify soldering systems provided in the network; create soldering tasks with target-soldering-information from the work information depending on the identified soldering systems and assign the tasks to the relevant soldering system; and process the actual soldering information of the relevant soldering system with the associated target-soldering-information of the relevant soldering system.

Abstract: The invention relates to a stand of a soldering system and to a soldering system. In addition to the stand, the soldering system includes an electric soldering device, in particular a soldering iron, with a handle, a heating element provided on the handle, and a soldering tip assembly which can be releasably secured to the handle and has a holding element. The stand has at least one exchangeable holder which is formed about an insertion axis and is designed to at least partly complement a holding element such that a soldering tip assembly arranged on the handle can be introduced into the exchangeable holder along the insertion axis, and the exchangeable holder has an anti-rotation element which interacts with the holding element such that, when the soldering tip assembly is inserted into the exchangeable holder, the holding element is rotationally fixed in the exchangeable holder when the handle is rotated from the securing position into the removal position.

Abstract: Placement method for the accurately positioned placement of large components with pins on a target region of a substrate, in particular a printed circuit board, and placement apparatus for this purpose.

Abstract: Soldering system, in particular a reflow soldering system, for continuous soldering of printed circuit boards along a transport direction, that includes a process channel having a preheating zone, at least one of a soldering zone and a cooling zone, including a main body, at least one covering hood that is pivotable about a hood axis between a closed position, in which the process channel is closed, and an open position, in which the covering hood is open and the process channel is accessible.

Abstract: Transport system for transporting soldering material through a soldering apparatus and soldering apparatus, having two transport tracks running parallel to one another and extending in a transport direction, wherein each of the transport tracks includes two transport rails, and wherein at least one of the two transport rails of the respective transport track is adjustable in the transverse direction running transversely to the transport direction for a width adjustment of the respective transport track.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel including a preheating zone, a soldering zone and a cooling zone, having fan units for circulating process gas in the process channel, wherein the fan units each comprise an electric fan motor and a fan wheel, and having at least one apparatus element, wherein the soldering apparatus can be operated in an operating mode in which the fan motors are controlled in such a way that they are operated at a constant or largely constant rotational speed, as a result of which process gas is conducted through the at least one apparatus element and is then drawn in again by the respective fan units.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for continuous soldering of printed circuit boards along a transport direction, having a process channel that includes a preheating zone, a soldering zone and a cooling zone, having a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air channels carrying the process gas, filter elements and/or cooling elements are provided in the base body. At least one fan unit is arranged in or on the base body laterally next to the process channel in the transport direction, and air channels are arranged and provided in such a manner that process gas is blown into the process channel during operation of the at least one fan unit, with the process gas directed through a filter element provided in a filter region after passing through the process channel, and the filtered process gas drawn in by the at least one fan unit.

Abstract: A soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, including a process channel that has a preheating zone, a soldering zone and a cooling zone, and further includes a base body and a cover hood movable between a closed position and an open position, wherein nozzle plates, fan units with fan motors, air ducts that conduct the process gas, filter elements and/or cooling elements are provided in the base body. The soldering apparatus further includes a drawer, which extends along a pull-out direction running transversely to the transport direction, is provided in the base body, with a bottom, a front wall and a rear side. Air ducts for conducting the process gas, at least one replaceable filter element in a filter region and at least one cooling device are provided in the drawer.

Abstract: A transport system for transporting material to be soldered through a soldering apparatus, and soldering apparatus with laterally movable middle support. The transport system for transporting the material to be soldered through the soldering apparatus, includes at least one transport track extending in the transport direction in which the material to be soldered is transportable in a transport plane in the transport direction, wherein the transport track includes two transport bars extending in the transport direction and at least one middle support with a middle bar extending in the transport direction. The middle bar has a revolving conveying means with folding elements, and the conveying means provides a feed in the transport direction and a return counter to the transport direction. The folding elements are displaceable between a support position and a folded position.

Abstract: Soldering apparatus, in particular a reflow soldering apparatus, for the continuous soldering of printed circuit boards along a transport direction, with an entry and an exit for feeding and removing the printed circuit boards, with a process channel including a preheating zone, a soldering zone and/or a cooling zone, and including a main body and at least one cover hood movable between a closed position and an open position, the cover hood enclosing a hood compartment above the process channel in which fan motors are provided.

Abstract: A press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a printed circuit board or carrier plate, and method therefor, including a moving unit, which comprises a receptacle for a substrate and with which the substrate can be moved in a plane, which is spanned by an x-axis and a y-axis and can be placed in a press-in position in which one or more components are pressed into the substrate, a lower tool, which comes to rest against the underside of the substrate before or during the press-in, an upper tool, which can be moved against the component for pressing the component along the z axis toward the substrate, a control unit for controlling the moving unit, and a sensor for detecting at least one reference mark present on the substrate, wherein the control unit is configured and designed such that it controls the moving unit depending on the detected reference mark in such a way that the substrate is placed between the lower to

Abstract: Press-in machine for pressing electrical, electronic, mechanical and/or electromechanical components into a substrate, in particular into a circuit board or carrier board, including a lower tool, which for pressing-is in contact against the underside of the substrate, an upper tool, which with an upper pressing unit for pressing-in the component can be moved against the component along the z-axis toward the substrate, and a changing unit for automatically changing the lower or upper tool. The changing unit includes a magazine in which a plurality of tools can be deposited, one or more tool-holders, a tool being provided in or on each of the tool-holders, a displacement unit with which the respective tool holder can be moved along a displacement direction out of the magazine and into a pressing receptacle of a pressing unit, and a locking device, with which the respective tool-holder can be locked in the pressing receptacle.

Abstract: Selective soldering system for selective wave soldering of circuit boards, including a solder pot, a solder nozzle which can be detachably arranged on the solder pot, wherein the solder nozzle has a nozzle base and a nozzle neck, wherein at the free end of the nozzle neck a nozzle opening is provided, the solder pot being arranged on a moving unit, which can be moved along an x and y axis in a horizontal plane and along a z axis in the vertical direction, and a control unit for controlling the moving unit.

Abstract: A fan module for a soldering system and a soldering system, in particular for a reflow soldering system, for circulating air in a process channel of the soldering system, the module having a housing-like support part, a first shaft bearing provided in or on the support part, a motor, which includes a stator and a rotor which cooperates with the stator, a rotor shaft provided on the rotor, a fan wheel provided on the rotor shaft and having a second shaft bearing for supporting the rotor shaft, wherein the fan module includes a flange plate, which in the assembled state covers a channel opening in the process channel and which includes an aperture in or on which the second shaft bearing is provided.

Abstract: A transport unit for transporting printed circuit boards along a direction of transport within at least one zone of a soldering system, in particular a reflow soldering system, characterized in that a base part is provided with an output shaft that can be driven, and with at least two output wheels which are rotatably coupled to the output shaft, in that at least two drive parts which can be releasably fastened on and removed from the base part are each provided with a drive wheel in such a manner that the drive parts have drive rollers which are rotatably coupled to the drive wheel, and which act on the printed circuit board to transport the printed circuit board through the zone, and in that, when the drive parts are fastened to the base part, each of the output wheels is in engagement with the associated drive wheel.

Abstract: Moving unit for moving two soldering assemblies connected by means of a coupling device, soldering system for selective wave soldering of circuit boards with such a moving unit, and associated method.