Abstract: The present invention provides an optical film comprising a substrate having a first optical surface and a second surface and a micro structure layer on the first optical surface of the substrate, wherein the micro structure layer comprises a plurality of first light-adjusting structures selected from the group consisting of prism columnar structures, conical columnar structures, solid angle structures and orange-segment like structures and a combination thereof and a plurality of second light-adjusting structures selected from the group consisting of arc columnar structures, lens-like structures, and capsule-like structures and a combination thereof, wherein at least a portion of the second light-adjusting structures has a height greater than those of all the first light-adjusting structures. The optical film of the present invention will not suffer the damage caused on the microstructure layers while achieving a light-gathering effect and effectively reducing optical interference.

Abstract: A curable material is provided. The curable material has the structure of formula I or formula II: wherein, X, R1, R2, m1 to m3, and n1 to n3 are defined as cited in the description.

Abstract: A self-sensitive polymerizable liquid resin is provided, which contains an uncrosslinked Michael addition reaction product of the following components: a Michael donor, a Michael accepter and optionally a viscosity modifier. The Michael accepter has 5 to 18 acryloyl functional groups. The self-sensitive polymerizable liquid resin of the present invention is capable of being used as an aid in a coating composition and providing a good property in deep radiation curing, and is particularly applicable in color coatings.

Abstract: The present invention provides a conductive coating composition, which contains: a conductive organic polymer, a non-conductive organic compound, a solvent and optionally a curing agent; where the content of the conductive organic polymer is about 10% to about 50%, based on the total weight of the solids content in the composition. The present invention also provides a conductive film, which is formed by drying the conductive coating composition. The conductive film has a surface resistivity lower than 1000 ?/sq and a total light transmittance greater than 80%. The conductive coating composition of the present invention can be used as an electromagnetic interference shielding material or an electrode material, and can be applied to various electronic products.

Abstract: The present invention pertains to a passivation layer disposed on a surface of a substrate for use in solar cells, including a first passivation layer formed on the substrate by screen printing. The present invention also pertains to a method for preparing the passivation layer structure. The method according to the present invention can prepare a passivation layer on a surface of a semiconductor substrate by screen printing, and during the screen printing, a patterning step can be performed simultaneously. Therefore, the present invention is able to produce the passivation layer in a more economic and faster manner.

Abstract: An etch-resistant composition is provided. The etch-resistant composition comprises a polymer and a first organic solvent. The polymer is prepared by copolymerizing a polymerization unit comprising styrene-based monomer(s) and acrylate-based monomer(s), and has a weight average molecular weight of at least about 35,000. Based on the total weight of the etch-resistant composition, the amount of the polymer is about 20.0 to about 60.0 wt % and the amount of the solvent is about 40.0 to about 80.0 wt %. The etch-resistant composition can be used for preparing a selective emitter of a solar cell.

Abstract: The invention relates to an electrolyte composition, comprising a polyether polymer, a polyethylene oxide, and a redox pair and optionally nano-particles.

Abstract: The present invention provides a polyimide precursor composition comprising a polyimide precursor and a thermal base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5 and Y? are as defined in the specification. The present invention also provides a polyimide prepared from the aforementioned precursor composition, and a preparation method thereof.

Abstract: The present invention provides an electrolyte material formulation comprising: (a) a monomer of formula (I) (b) a monomer of formula (II) and (c) a polymerizable compound, wherein A, X, B1, B2, R1 to R3, q and w are defined as those recited in the specification, and the monomer (b) is in an amount of about 1 part by weight to about 800 parts by weight and the polymerizable compound (c) is in an amount of about 1 part by weight to about 10000 parts by weight based on 100 parts by weight of the monomer (a). The present invention further provides an electrolytic material composition obtained by the polymerization of the aforementioned electrolytic material formulation. The electrolytic material composition can be applied to a solid electrolyte capacitor.

Abstract: The present invention provides a base generator having the structure of formula (1): wherein R1, R2, R3, R4, R5, and Y{circle around (?)} are defined as in the specification. The base generator of the present invention can be used for imidization of a polyimide precursor, promoting crosslinking of epoxy monomers, or crosslinking of polyurethane or polyurea.

Abstract: The present invention relates to an anti-reflection coating composition containing hollow particles, an adhesive, and a hydrophobic organic solvent, wherein the weight ratio of the hollow particles to the solids content of the adhesive is in the range of 1:2 to 1:20. The present invention also provides a method for producing the anti-reflection coating composition.

Abstract: A solvent-free conductive paste composition including (a) a binder, (b) an initiator, (c) a glass powder and (d) a conductive powder; and a solar cell element having an electrode or wire made by coating and sintering the conductive paste composition coated on a silicon semiconductor substrate. The conductive paste composition is solvent-free so that it will not cause environmental problems with respect to the evaporation of solvents and will not be easy to spread out. The conductive paste composition facilitates the development of fine wire and high aspect ratio designs and can efficiently enhance the photoelectric conversion efficiency.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: The invention pertains to an isocyanate-modified photosensitive polyimide. The photosensitive polyimide of the invention possesses excellent heat resistance, chemical resistance and flexibility, and can be used in a liquid photo resist composition or dry film photo resist composition, or used in a solder resist, coverlay film, or printed wiring board.

Abstract: In this disclosure, a blue colorant is added in the adhesion layer of a reflective polarizer to compensate the chromaticity difference caused by the reflective polarizer itself and large horizontal viewing angle. The chromaticity difference can be further reduced by adding beads in the adhesion layer and/or forming light-gathering microstructures on the outer surface of the quarter wave plate of the reflective polarizer.

Abstract: A diindenothiophene derivative of the following formula (1) is disclosed: wherein each of G1, G2, G3 and G4 is independently an unsubstituted or substituted C6-C40-aromatic group or a C1-C40-aliphatic group; A is an electron-withdrawing group; and D is an electron-donating group. The inventive diindenothiophene derivatives can be used in a dye-sensitized solar cell.

Abstract: The subject invention provides an optical film comprising a substrate and a resin coating having a convex-concave structure on at least one surface of the substrate, wherein said resin coating comprises a plurality of organic particles and a binder, the organic particles being formed from a polyacrylate resin which comprises at least one multi-functional acrylate monomer as polymerization units, and said multi-functional acrylate monomer is in an amount from 30 wt % to 70 wt % based on the total weight of the monomers, and wherein the organic particles have a single mean particle size, the particle size distribution of the organic particles ranges within about ±30% of the mean particle size, and the organic particles are in an amount from about 110 to about 360 parts by weight per 100 parts by weight of the solids content of the binder.

Abstract: The subject invention relates to a scratch-resistant optical film, which comprises: (a) a transparent substrate having a first surface and a second surface; (b) a diffusion layer on the first surface of the substrate, which has a convex-concave structure and is comprised of a first hard coat layer comprising organic particles; (c) a scratch-resistant layer on the second surface of the substrate, which is comprised of a second hard coat layer; wherein the organic particles in the first hard coat layer are formed from a polyacrylate resin which comprises at least one multi-functional acrylate monomer as polymerization units, said multi-functional acrylate monomer being in an amount from 30 to 70 wt % based on the total weight of the monomer used, and wherein the organic particles have a single mean particle size and have a particle size distribution in the range within about ±5% of the mean particle size.

Abstract: The invention pertains to an epoxy-modified photosensitive polyimide, which possesses excellent heat resistance, chemistry resistance, and flexibility, and can be used in a liquid photo resist or dry film resist, or used in a solder resist, coverlay film, or printed circuit board.

Abstract: A process for preparing a precursor solution for polyimide/silica composite material and a process for forming a polyimide/silica composite material film on a substrate, including adding a monomer of a silane compound to allow a poly(amic acid) to carry a silica moiety; adding a monomer of formula (R6)xSi(R7)4-x to allow the silica moiety to carry a photo-polymerizable unsaturated group; adding a monomer of formula R8N(R9)2 to allow the poly(amic acid) to carry a photo-polymerizable unsaturated group, where R6, R7, R8, R9 and x are as defined in the specification. Also, a precursor solution for polyimide/silica composite material and a polyimide/silica composite material. The composite material is useful in microelectronic devices, semiconductor elements, and photoelectric elements.