Abstract: The invention relates to a substrate holder device at least including at least one control valve and at least one substrate holder with a substrate holder surface and a substrate holder rear side. Furthermore, the invention relates to bonding device and a method for bonding.

Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.

Abstract: The invention relates to a device for the transfer of a transfer layer from a substrate, in particular from a growth substrate, to a carrier substrate.

Abstract: The invention relates to a device and a method for the alignment of substrates.

Abstract: A substrate holder for curving a substrate the substrate holding including a fixing plate for fixing the substrate, curving means for curving the fixing plate, wherein the fixing plate is constituted such that the curvature of the substrate can be adjusted in a targeted manner, as well as a corresponding method.

Abstract: A method for the exposure of image points of a photosensitive layer comprising a photosensitive material on a substrate by means of an optical system. The method including continuously moving the image points with respect to the optical system; and controlling a plurality of secondary beams by means of the optical system individually for individual exposures of each image point, whereby the secondary beams are put either into an ON state or into an OFF state, wherein a) secondary beams in the ON state produce an individual exposure of the image point assigned to the respective secondary beam and b) secondary beams in the OFF state do not produce any individual exposure of the image point assigned to the respective secondary beam; wherein, for the generation of image points with grey tones n>1, individual exposures are carried out by different secondary beams with individual doses D.

Abstract: A mark field, having at least two location marks with information for the location of the respective location mark in the mark field, and at least one position mark, which is or can be assigned to one of the location marks. Furthermore, the invention relates to a device for determining X-Y positions of structural features of structures arranged on a substrate, wherein the X-Y positions relative to the mark field, which is fixed with respect to the substrate, can be determined. Furthermore, the invention relates to a corresponding method.

Abstract: A substrate holder for mounting a substrate, comprising fixing elements for fixing the substrate, wherein the fixing elements can be grouped into zones, and a corresponding method.

Abstract: A method and device for injection moulding, in particular for micro-injection moulding, at least comprising a mould with a first mould half and a second mould half, wherein the first mould half and the second mould half define an injection moulding space in the closed state of the mould, and an insert arranged in the injection moulding space.

Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Abstract: A method for the transfer of components from a sender substrate to a receiver substrate includes provision and/or production of the components on the sender substrate, transfer of the components of the sender substrate to the transfer substrate, and transfer of the components from the transfer substrate to the receiver substrate. The components can be transferred selectively by means of bonding means and/or debonding means.

Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.

Abstract: A device and a method for aligning substrates. The method includes the steps of detecting alignment marks and aligning substrates with respect to one another in dependence on the detection of the alignment marks. At least two alignment marks are arranged parallel to a direction of a linear movement of the substrates, wherein the alignment of the substrates takes place along a single alignment axis, the alignment axis running parallel to the loading and unloading direction of the substrates.

Abstract: A method for producing singulated encapsulated components. The method includes the steps of application of a frame structure on a substrate surface of a substrate, wherein the frame structure surrounds components arranged on the substrate surface; bonding of a cover substrate on the frame structure; hardening of the frame structure; and singulation of the encapsulated components, wherein the frame structure is formed from an adhesive.

Abstract: An apparatus and a method for embossing micro- and/or nanostructures include the embossing of the micro- and/or nanostructures in an embossing material.

Abstract: Apparatus and method for heating a substrate. The apparatus including a heater and a substrate holder with a substrate holder surface, wherein the substrate to be heated can be placed on the substrate holder surface, the apparatus further includes means for exerting forces on the heater, the apparatus further includes a control unit for controlling the means, wherein the heater is deformable by the means.

Abstract: A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.

Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.

Abstract: The invention relates to a method for measuring a multilayered substrate (1, 1?, 1?), particularly with at least one structure (7, 7?, 7?, 7??, 7IV, 7V) with critical dimensions, particularly with a surface structure (7, 7?, 7?, 7??, 7IV, 7V) with critical dimensions, characterized in that the method has at least the following steps, particularly the following procedure: producing (110) the substrate (1, 1?, 1?) with a plurality of layers (2, 3, 4, 5, 6, 6?, 6?), particularly with a structure (7, 7?, 7?, 7??, 7IV, 7V), particularly with a structure (7, 7?, 7?, 7??, 7IV, 7V) on a surface (6o, 6?o, 6?o) of an uppermost layer (6, 6?, 6?), wherein the dimensions of the layers and in particular the structures are known, measuring (120) the substrate (1, 1?, 1?), and in particular the structure (7, 7?, 7?, 7??, 71IV, 7V)) using at least one measuring technology, creating (130) a simulation of the substrate using the measurement results from the measurement of the substrate (1, 1?, 1?), comparing (140) the measureme

Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.