Patents Assigned to EV GROUP E. THALLNER GMBH
  • Device and method for bonding substrates
    Patent number: 11020953
    Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
  • Method for the bonding and debonding of substrates
    Patent number: 11024530
    Abstract: A product-substrate-to-carrier-substrate bond with a product substrate, which is bonded to a carrier substrate via a connection layer, wherein a soluble layer is arranged between the connection layer and the product substrate, and wherein a) the soluble layer is soluble due to an interaction with an electromagnetic radiation of a radiation source, and b) the connection layer and the carrier substrate are both at least predominantly transparent to the electromagnetic radiation transmitted through the connection layer, wherein a material of the soluble layer and the electromagnetic radiation are chosen such that an increase of temperature of the soluble layer caused by the interaction with the electromagnetic radiation is less than 50° C.
    Type: Grant
    Filed: September 19, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Jurgen Burggraf, Harald Wiesbauer
  • Device and method for bonding substrates
    Patent number: 11020952
    Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
    Type: Grant
    Filed: March 20, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
  • Device and method for bonding substrates
    Patent number: 11020950
    Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
  • Device and method for bonding substrates
    Patent number: 11020951
    Abstract: A method for bonding a contact surface of a first substrate to a contact surface of a second substrate comprising of the steps of: positioning the first substrate on a first receiving surface of a first receiving apparatus and positioning the second substrate on a second receiving surface of a second receiving apparatus; establishing contact of the contact surfaces at a bond initiation site; and bonding the first substrate to the second substrate along a bonding wave which is travelling from the bond initiation site to the side edges of the substrates, wherein the first substrate and/or the second substrate is/are deformed for alignment of the contact surfaces.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: June 1, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Markus Wimplinger, Friedrich Paul Lindner, Thomas Plach, Florian Kurz
  • METHOD AND DEVICE FOR ALIGNMENT OF SUBSTRATES
    Publication number: 20210151339
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Application
    Filed: January 29, 2021
    Publication date: May 20, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • METHOD AND DEVICE FOR BONDING OF CHIPS
    Publication number: 20210134782
    Abstract: A method and device for bonding chips onto a substrate or onto further chips. The chips are bonded onto the substrate or the further chips by means of a direct bond.
    Type: Application
    Filed: January 8, 2021
    Publication date: May 6, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventor: Markus Wimplinger
  • METHOD AND DEVICE FOR EMBOSSING OF A NANOSTRUCTURE
    Publication number: 20210129520
    Abstract: A method for embossing a nanostructure, formed on a nanostructure punch, into a punch surface of a curable material which has been applied to a substrate. The method includes the following steps, especially following sequence: alignment of the nanostructure relative to the punch surface, embossing of the punch surface by a) prestressing of the nanostructure punch by deformation of the nanostructure punch and/or prestressing of the substrate by deformation of the substrate, b) making contact of a partial area of the punch surface with the nanostructure punch and c) automatic contacting of the remaining surface at least partially, especially predominantly, by the prestressing of the nanostructure punch and/or the prestressing of the substrate.
    Type: Application
    Filed: December 17, 2020
    Publication date: May 6, 2021
    Applicant: EV GROUP E. THALLNER GMBH
    Inventor: Gerald Kreindl
  • Structure stamp, device and method for embossing
    Patent number: 10994470
    Abstract: A structure stamp has a flexible stamp which has a microstructured or nanostructured stamp surface for embossing of an embossing structure which corresponds to the stamp surface on an embossing surface, and a frame for clamping the stamp. Moreover, the invention relates to a device for embossing an embossing pattern on an embossing surface with the following features: a stamp receiver for accommodating and moving a structure stamp, an embossing material receiver for accommodating and placing an embossing material opposite the structure stamp, and an embossing element drive for moving an embossing element along the structure stamp.
    Type: Grant
    Filed: August 1, 2019
    Date of Patent: May 4, 2021
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Peter Fischer, Gerald Kreindl, Jakob Harming, Christine Thanner, Christian Schon
  • METHOD AND DEVICE FOR THE SURFACE TREATMENT OF SUBSTRATES
    Publication number: 20210125821
    Abstract: A method for the surface treatment of a substrate surface of a substrate includes arranging the substrate surface in a process chamber, bombarding the substrate surface with an ion beam, generated by an ion beam source and aimed at the substrate surface, to remove impurities from the substrate surface, whereby the ion beam has a first component, and introducing a second component into the process chamber to bind the removed impurities. A device for the surface treatment of a substrate surface of a substrate includes a process chamber for receiving the substrate, an ion beam source for generating an ion beam that has a first component and is aimed at the substrate surface to remove impurities from the substrate surface, and means to introduce a second component into the process chamber to bind the removed impurities.
    Type: Application
    Filed: November 5, 2020
    Publication date: April 29, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventor: Nasser Razek
  • Method and substrate holder for the controlled bonding of substrates
    Patent number: 10991609
    Abstract: A method and a device for bonding a first substrate with a second substrate at mutually facing contact faces of the substrates.
    Type: Grant
    Filed: August 12, 2016
    Date of Patent: April 27, 2021
    Assignee: EV GROUP E. THALLNER GMBH
    Inventors: Dominik Zinner, Thomas Wagenleitner, Jurgen Markus Suss, Jurgen Mallinger, Thomas Plach
  • ACCOMMODATING DEVICE FOR RETAINING WAFERS
    Publication number: 20210104425
    Abstract: A receiving means for receiving and mounting of wafers, comprised of a mounting surface, mounting means for mounting a wafer onto the mounting surface and compensation means for active, locally controllable, compensation of local and/or global distortions of the wafer.
    Type: Application
    Filed: November 30, 2020
    Publication date: April 8, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Thomas Wagenleitner, Alexander Filbert
  • Method and device for bonding substrates
    Patent number: 10971365
    Abstract: A method for bonding a first substrate with a second substrate, with the following sequence: production of a first amorphous layer on the first substrate and/or production of a second amorphous layer on the second substrate, bonding of the first substrate with the second substrate at the amorphous layer or at the amorphous layers to form a substrate stack, irradiation of the amorphous layer or the amorphous layers with radiation in such a way that the amorphous layer or the amorphous layers is/are transformed into a crystalline layer or crystalline layers.
    Type: Grant
    Filed: February 21, 2017
    Date of Patent: April 6, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Kurt Hingerl, Peter Nikolaus Oberhumer, Gunther Hesser
  • Method and device for bonding substrates
    Patent number: 10971378
    Abstract: A method and corresponding device for bonding a first contact surface of a first substrate to a second contact surface of a second substrate. The method includes the steps of arranging a substrate stack, formed from the first substrate and the second substrate and aligned on the contact surfaces, between a first heating surface of a first heating system and a second heating surface of a second heating system.
    Type: Grant
    Filed: May 30, 2018
    Date of Patent: April 6, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventor: Friedrich Paul Lindner
  • Device and method for bonding of two substrates
    Patent number: 10964562
    Abstract: A device, a system and a method for bonding two substrates. A first substrate holder has a recess and an elevation.
    Type: Grant
    Filed: September 29, 2016
    Date of Patent: March 30, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Markus Wimplinger, Florian Kurz, Viorel Dragoi
  • Method for bonding of at least three substrates
    Patent number: 10954122
    Abstract: A method for bonding at least three substrates to form a substrate stack, wherein the substrate stack has at least one lowermost substrate a middle substrate, and an upper substrate. The method includes the following steps: aligning the middle substrate to the lowermost substrate and bonding the middle substrate to the lowermost substrate, then aligning the upper substrate and bonding the upper substrate to the middle substrate, wherein the upper substrate is aligned to the lowermost substrate.
    Type: Grant
    Filed: March 16, 2017
    Date of Patent: March 23, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Thomas Glinsner, Harald Zaglmayr
  • DEVICE AND METHOD FOR BONDING OF SUBSTRATES
    Publication number: 20210074544
    Abstract: A method for bonding a first substrate with a second substrate at respective contact faces of the substrates with the following steps: holding the first substrate to a first sample holder surface of a first sample holder with a holding force FH1 and holding the second substrate to a second sample holder surface of a second sample holder with a holding force FH2; contacting the contact faces at a bond initiation point and heating at least the second sample holder surface to a heating temperature TH; bonding of the first substrate with the second substrate along a bonding wave running from the bond initiation point to the side edges of the substrates, wherein the heating temperature TH is reduced at the second sample holder surface during the bonding.
    Type: Application
    Filed: November 4, 2020
    Publication date: March 11, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Florian Kurz, Thomas Wagenleitner, Thomas Plach, Jurgen Markus Suss
  • Device and method for bonding
    Patent number: 10943810
    Abstract: A device for bonding of a second substrate onto a first substrate, comprising a receiving apparatus for receiving the first substrate which has been coated with a bond layer and the second substrate which is held on the bond layer, and an action apparatus for applying a bond force to the second substrate on one action side of the second substrate, which side faces away from the bond layer proceeding from an initial zone A, which lies within an edge zone R of the action side as far as action on the entire action side. Furthermore, this invention relates to a corresponding method.
    Type: Grant
    Filed: November 5, 2013
    Date of Patent: March 9, 2021
    Assignee: EV GROUP E. THALLNER GMBH
    Inventor: Jurgen Burggraf
  • Method and device for alignment of substrates
    Patent number: 10943807
    Abstract: A method for aligning and contacting a first substrate with a second substrate using a plurality of detection units and a corresponding device for alignment and contact.
    Type: Grant
    Filed: March 26, 2020
    Date of Patent: March 9, 2021
    Assignee: EV Group E. Thallner GmbH
    Inventors: Thomas Wagenleitner, Dominik Zinner, Jurgen Markus Suss, Christian Sinn, Jurgen Mallinger
  • DEVICE AND METHOD FOR SEPARATING A TEMPORARILY BONDED SUBSTRATE STACK
    Publication number: 20210060710
    Abstract: A method for separating a temporarily bonded substrate stack by bombardment of a joining layer of the substrate stack by means of laser beams emitted by a laser, characterised in that laser beams of the laser reflected and/or transmitted at the temporarily bonded substrate stack are detected during the bombardment of the joining layer with the laser beams. The invention also relates to a corresponding device.
    Type: Application
    Filed: September 12, 2017
    Publication date: March 4, 2021
    Applicant: EV Group E. Thallner GmbH
    Inventors: Elisabeth BRANDL, Boris POVAZAY, Thomas UHRMANN