Patents Assigned to Finisar Corporation
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Patent number: 9874691Abstract: In an example, a coupled system includes a first waveguide, at least one second waveguide, and an interposer. The first waveguide has a silicon (Si) core having first refractive index n1 and a tapered end. The at least one second waveguide each has a silicon nitride (SiN) core having a second refractive index n2. The interposer includes a third waveguide having a third refractive index n3 and a coupler portion, where n1>n2>n3. The tapered end of the first waveguide is adiabatically coupled to a coupler portion of one of the at least one second waveguide. A tapered end of one of the at least one second waveguide is adiabatically coupled to the coupler portion of the third waveguide of the interposer. The third waveguide of the interposer has an optical mode size that is similar to the mode size of a standard single mode optical fiber.Type: GrantFiled: July 12, 2016Date of Patent: January 23, 2018Assignee: Finisar CorporationInventors: Daniel Mahgerefteh, Bryan Park, Jianxiao Chen, Xiaojie Xu, Gilles P. Denoyer, Bernd Huebner
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Patent number: 9866330Abstract: In one example embodiment, a transmitter module includes a header electrically coupled to a chassis ground. First and second input nodes are configured to receive a differential data signal. A buffer stage has a first node coupled to the first input node and a second node coupled to the second input node. An amplifier stage has a fifth node coupled to a third node of the buffer stage and a sixth node coupled to a signal ground that is not coupled to the chassis ground. An optical transmitter has an eighth node coupled to a seventh node of the amplifier stage and a ninth node configured to be coupled to a voltage source. A bias circuit is configured to couple a fourth node of the buffer stage to a bias current source.Type: GrantFiled: February 2, 2015Date of Patent: January 9, 2018Assignee: FINISAR CORPORATIONInventors: The'Linh Nguyen, Henry M. Daghighian
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Patent number: 9857545Abstract: Latch mechanism for communication modules. In an example embodiment, a module latch mechanism includes a follower configured to be slidingly positioned relative to a housing and a driver configured to be rotatingly positioned relative to the housing. The follower includes a first arm configured to facilitate selective engagement of the housing with a host device. The follower may further include a fastening mechanism configured to facilitate selective engagement of the follower with the housing. The driver is configured to be positioned relative to the follower such that the driver urges the follower toward a first position relative to the housing as the driver is rotated from an unlatched position to a latched position.Type: GrantFiled: September 28, 2015Date of Patent: January 2, 2018Assignee: FINISAR CORPORATIONInventor: Demetrios Koutrokois
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Patent number: 9860972Abstract: An electrical connection interface is provided. The electrical connection interface includes a first ground plane layer, a second ground plane layer, a first substrate and a second substrate. The second ground plane layer is positioned to overlap the first ground plane layer. The first substrate includes a first substrate conductive lead with a first interface region connected to and electrically insulated from the first ground plane layer. The second substrate includes a second substrate conductive lead with a second interface region connected to the first substrate conductive lead and the second ground plane layer. The second substrate conductive lead is electrically insulated from the second ground plane layer.Type: GrantFiled: May 28, 2015Date of Patent: January 2, 2018Assignee: FINISAR CORPORATIONInventors: Andrei Kaikkonen, Doron Lapidot, Lennart Lundqvist, Lars-Gote Svensson
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Patent number: 9857541Abstract: A system may include a substrate and a lens component. The substrate may include pads and solder protuberances. Each solder protuberance may be located on a pad. The lens component may define grooves sized to receive at least a portion of the solder protuberances. The lens component may be positioned relative to the substrate such that at least a portion of each solder protuberance is positioned within the grooves.Type: GrantFiled: July 25, 2016Date of Patent: January 2, 2018Assignee: FINISAR CORPORATIONInventors: Darin James Douma, Frank J. Flens
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Patent number: 9852057Abstract: Embodiments of a device and method to automatically acquire signal quality metrics in a digital communication system are disclosed. The device may include acquisition means to sample the likelihood of a digital communication signal passing through a grid of time and amplitude regions, and storage means by which such likelihood measurements may be accumulated in a computer memory array for analysis. A state machine may execute a method that controls both the acquisition means and the storage means, requiring minimal intervention from supervisory systems.Type: GrantFiled: June 24, 2015Date of Patent: December 26, 2017Assignee: Finisar CorporationInventors: Henry Meyer Daghighian, Lucy G. Hosking, Gilles P. Denoyer
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Patent number: 9851508Abstract: In an example embodiment, a WSS may include a steering element, an optical subsystem, and a cylindrical lens. The optical subsystem may include a collimating lens and a dispersive element. The optical subsystem may be located between a fiber array and the steering element. The collimating lens may be located between the fiber array and the dispersive element. The cylindrical lens may be located between the optical subsystem and the steering element.Type: GrantFiled: February 25, 2016Date of Patent: December 26, 2017Assignee: Finisar CorporationInventor: Brendan Hamel-Bissell
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Patent number: 9854687Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a multi-layer substrate with a bottom layer, a top layer having top thin film signal lines, and one or more intermediate layers having thick film traces between the top layer and the bottom layer, the thick film traces electrically coupled to the top thin film signal lines; and optoelectronic components positioned over the multi-layer substrate and electrically coupled with the signal lines.Type: GrantFiled: October 26, 2015Date of Patent: December 26, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Yunpeng Song, Hongyu Deng
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Patent number: 9847776Abstract: A system may include a driver circuit configured to receive a clock signal. The system may also include a first tuned circuit and a second tuned circuit. The first tuned circuit and the driver circuit may be collectively tuned according to a first frequency range. The first tuned circuit may be configured to be active when a rate of the clock signal is within the first frequency range and to be inactive when the rate is outside of the first frequency range. Further, the second tuned circuit and the driver circuit may be collectively tuned according to a second frequency range that is different from the first frequency range. The second tuned circuit may be configured to be active when the rate is within the second frequency range and to be inactive when the rate is outside of the second frequency range.Type: GrantFiled: July 14, 2014Date of Patent: December 19, 2017Assignee: FINISAR CORPORATIONInventors: Georgios Kalogerakis, The'linh Nguyen, Timothy G. Moran
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Patent number: 9848498Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to header subassemblies and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods may relate to a header subassembly that can include: a substrate with a substrate top and a substrate bottom; at least one optoelectronic transducer on the substrate top; at least one top electrical component on the substrate top, the electrical component can be operably coupled with the optoelectronic transducer; and at least one bottom electrical component on the substrate bottom, the bottom electrical component can be operably coupled with the optoelectronic transducer.Type: GrantFiled: October 26, 2015Date of Patent: December 19, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Yunpeng Song, Peter Henry Mahowald, Hongyu Deng
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Patent number: 9847840Abstract: A laser module can include: a laser chip having a plurality of laser diodes; a focusing lens optically coupled to each of the plurality of distinct laser diodes; and a photonic integrated circuit (PIC) having a plurality of optical inlet ports optically coupled to the plurality of laser diodes through the focusing lens. The laser module can include an optical isolator optically coupled to the focusing lens and PIC and positioned between the focusing lens and PIC. The laser chip can include a fine pitch laser array. The laser module can include a plurality of optical fibers optically coupled to an optical outlet port of the PIC. The laser module can include a hermetic package containing the laser chip and having a single focusing lens positioned for the plurality of laser diodes to emit laser beams there through.Type: GrantFiled: March 17, 2014Date of Patent: December 19, 2017Assignee: FINISAR CORPORATIONInventors: Xiaojie Xu, Mark Donovan
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Patent number: 9841568Abstract: Latch mechanisms for modules are disclosed. A module includes a housing and a release slide. The housing includes a first rib located on a first side of the housing and a second rib located on a second side of the housing. The release slide is slidingly positioned on the housing. The release slide includes a release slide base, a first release slide arm extending from the release slide base, and a second release slide arm extending from the release slide base. A first flange extending from the first release slide arm is positioned at least partially over the first rib. A second flange extending from the second release slide arm is positioned at least partially over the second rib.Type: GrantFiled: May 23, 2016Date of Patent: December 12, 2017Assignee: FINISAR CORPORATIONInventors: William H. Wang, Joshua John Edward Moore
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Patent number: 9838116Abstract: A peripheral component interconnect-express (PCIe) link with presence of an active optical cable (AOC) that couples between an electrical PCIe (E-PCIe) transmitter and an E-PCIe receiver may include the AOC. The AOC may include an electrical-to-optical PCIe (EO-PCIe) transceiver coupled to the E-PCIe transmitter. The EO-PCIe transceiver may include a laser diode driver that includes a common mode voltage output terminal. The EO-PCIe transceiver may include a detection condition circuit that includes a decoupling capacitor. The decoupling capacitor may be referenced to a ground level and may connect to the common mode voltage output terminal of the laser diode driver. The detection condition circuit may create a receiver detection condition for a receiver detection circuit of the E-PCIe transmitter to detect presence of the AOC.Type: GrantFiled: January 8, 2016Date of Patent: December 5, 2017Assignee: Finisar CorporationInventors: Hongdang He, Qin Chen
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Patent number: 9831631Abstract: In an embodiment, a laser includes a gain section. The gain section includes an active region, an upper separate confinement heterostructure (SCH), and a lower SCH. The upper SCH is above the active region and has a thickness of at least 60 nanometers (nm). The lower SCH is below the active region and has a thickness of at least 60 nm.Type: GrantFiled: June 11, 2015Date of Patent: November 28, 2017Assignee: Finisar CorporationInventor: Yasuhiro Matsui
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Patent number: 9824552Abstract: Communication devices are disclosed. In an example embodiment, a communication device may include a communication module including an illumination source and a body element. The body element may be configured to allow illumination generated by the illumination source to propagate within and illuminate at least a portion of an outer surface of the body element.Type: GrantFiled: December 2, 2015Date of Patent: November 21, 2017Assignee: FINISAR CORPORATIONInventors: Rafik Ward, Stephen T. Nelson, Frank Flens, Cindy Hsin-I Hsieh, Lucy G. Hosking, Joshua Moore
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Patent number: 9823430Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to lens receptacles and/or optoelectronic subassemblies. In some aspects, the disclosed devices and methods relate to a lens receptacle including a receptacle body extending between a receptacle top and a receptacle bottom, the receptacle body including: a port body defining a receptacle port with a port opening at the receptacle top; a receptacle window defining a base of the receptacle port; a lens array including lenses positioned on the receptacle window; and at least one receptacle alignment feature.Type: GrantFiled: August 20, 2015Date of Patent: November 21, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Tao Wu, Mark Donovan, Hongyu Deng
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Patent number: 9814153Abstract: An optoelectronic module is provide and includes an electronic unit, an optical unit, and an interconnect structure. The electronic unit is capable of outputting and/or receiving electric signals, while the optical unit is capable of converting the electric signals into optical signals. The interconnect structure connects the electronic unit and the optical unit, and includes an electrically conducting substrate and a pair of transmission leads connecting electronic unit and the optical unit. The pair of transmission leads includes a signal lead and a ground lead having lower impedance than the signal lead.Type: GrantFiled: June 11, 2015Date of Patent: November 7, 2017Assignee: FINISAR CORPORATIONInventors: Andrei Kaikkonen, Lennart Per Olof Lundqvist, Lars-Goete Svensson, Peter Lindberg
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Patent number: 9804349Abstract: This disclosure generally relates to high-speed fiber optic networks that use light signals to transmit data over a network. The disclosed subject matter includes devices and methods relating to multi-lens optical components and/or optoelectronic subassemblies. In some aspects, devices and methods relate to an optical component including a housing defining a cavity and a lens array having a plurality of lenses on an optically transmissive portion of the housing. In some aspects, devices and methods relate to an optical component including a substrate; and a lens array on the substrate, the lens array having a plurality of discrete lenses.Type: GrantFiled: October 13, 2015Date of Patent: October 31, 2017Assignee: FINISAR CORPORATIONInventors: Maziar Amirkiai, Tao Wu, Mark Donovan, Hongyu Deng
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Patent number: 9798099Abstract: A communication module includes a printed circuit board, a housing including a left and right sidewall, a top and bottom panel, and a catch pin extending from the bottom panel, the housing enclosing the circuit board and configured to be inserted into and removed from the host device, and a delatch assembly slidably engaged with the bottom panel of the housing, including first and second delatch arms extending underneath the bottom panel of the housing and configured to removably engage with the host device, and a delatch cross-member extending underneath the bottom panel of the housing, including a hooking member configured to selectively engage the catch pin as the delatch assembly slides along the housing.Type: GrantFiled: March 29, 2016Date of Patent: October 24, 2017Assignee: Finisar CorporationInventor: Long Van Nguyen
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Patent number: 9794017Abstract: In an example embodiment, an N-channel WDM OSA includes active optical devices coupled to a carrier, an optical block, and a MUX or a DEMUX. The optical block may be positioned above the active optical devices and coupled to the carrier. The optical block may include a bottom with lenses formed in the bottom that are aligned with the active optical devices; a first side that extends up from the bottom; a second side that extends up from the bottom and is opposite the first side; a port that extends forward from the bottom and the first and second sides; and an optical block cavity defined by the bottom and the first and second sides that extends rearward from the port. The MUX or DEMUX may be positioned in the optical block cavity in an optical path between the port of the optical block and the active optical devices.Type: GrantFiled: August 12, 2015Date of Patent: October 17, 2017Assignee: Finisar CorporationInventor: Jason O'Daniel