Abstract: Disclosed is a connecting structure for the signal lines of the liquid crystal display screen of a notebook computer installed between the primary machine of a notebook computer and a liquid crystal display screen, and comprising a casing, a first connector, and a second connector. The casing is connected to the liquid crystal display screen at one end thereof, while another end has an inserting portion for being inserted into the primary machine. A first connector is installed within the inserting portion of the casing. The first connector is connected to the signal lines of the liquid crystal display screen; A second connector is installed on the mother board of the primary machine. The second connector may be connected to the first connector. Thereby, the present invention can be used to connect the single lines of the liquid crystal screen and the primary machine.

Abstract: A computer mainframe case and side cover arrangement, which includes a computer mainframe case having a back opening and two coupling holes respectively provided at two opposite upright side walls thereof near the back opening, a side cover coupled to the computer mainframe case and closed on the back opening, the side cover having a top flange and a bottom flange perpendicularly backwardly raised from top and bottom sides thereof, and two coupling lugs respectively formed integral with two distal ends of the top flange and respectively coupled to the coupling holes at the computer mainframe case for enabling the side cover to be turned between a close position where the side cover is closed on the back opening of the computer mainframe case with the bottom flange thereof stopped at the bottom wall of the computer mainframe case, and an open position where the side cover is maintained in horizontal and supported on the upright side walls of the computer mainframe, and retaining devices respectively fastened t

Abstract: An enhanced heat dissipating Chip Scale Package (CSP) method and devices include preparing a heat dissipating base with a recess surrounded by a guarding wall. A chip with an integrated circuit (IC) layout is adhered the heat dissipating base in the recess. A substrate with a metallic circuit layer that is smaller size than the chip is then adhered to the chip. Then coupling the metallic circuit layer with the IC layout. A non-conductive resin is then filled in the recess within the guarding wall and covers the coupling portion. The resulting package device produced by means of BGA package process is small size and has enhanced heat dissipating property. The Package size/chip size ratio may be lower than 1.2 to meet the CSP requirements.

Abstract: Disclosed is a bearing structure of a central processing unit comprises a radiating plate, a back plate, a plurality of screws and elastic elements. The radiating plate has a heat conductive portion and a plurality of sleeves. The back plate is installed below the radiating plate and has a plurality of studs. The plurality of screws are placed within the sleeves of the radiating plate, and protrudes from the bottom of the radiating plate. The plurality of elastic elements being installed between the screws and the sleeve. The radiating plate is moved by the elastic elements so that the heat conductive portion of the radiating plate presses elastically the central processing unit. Therefore, the pressure will not be too large so as to harm the central processing unit, or too small so as to cause the unfastening therebetween. As a result, during assembly, the fastening force of the screws would not be adjusted. Thus, the assembly work becomes easily and the cost is reduced.

Abstract: A multi-chips semiconductor package and fabrication method mainly combines LOC and BGA techniques to overlap one chip upon another chip in an IC component package. One chip uses leads of a lead frame as connection interface of the circuit in the chip to outside. Another chip uses solder balls as connection interface of the circuit in another chip to outside. The two chips are supported by the lead frame without a substrate used in a conventional BGA package. The two chips may have same or different function. The structure is simple and easy to produce at low cost. The size and length of the IC component is smaller than the one produced by conventional multi-chips packaging techniques.

Abstract: A combination rack includes a partition frame, and two side frames fastened to the partition frame at two opposite lateral sides, the side frames and the partition frame having respective flat front and rear fenders respectively matched together in a flash manner, and respective bottom coupling plates respectively matched together in a flush manner and fixed together by hook means and screws to hold a computer mainframe and an expansion unit at two opposite sides of the partition frame between the front fenders and the rear fenders, the partition frame having an elongated through hole through which a bus line is inserted and connected between the computer mainframe and the expansion unit for signal transmission.

Abstract: A countersunk hole reinforcing structure, which includes a plate member having a countersunk hole formed of a circular recess and a screw hole at the center of the circular recess for the installation of a screw bolt to fix the plate member to an object below, wherein the plate member has a plurality of reinforcing ribs raised from the circular recess and equiangularly spaced around the screw hole to reinforce the structural strength of the wall body of the circular recess.

Abstract: A detachable housing structure of a computer, including a main base board and a detachable base board. The main base board includes a front section and a rear section. The rear section serves to bear a computer main circuit board, a power supply and other components. The detachable base board is detachably assembled with the front section. The detachable base board has an L-shaped structure, having a front vertical panel serving as the face panel of the computer and a horizontal panel on which the hard disc drive, floppy disc drive and CD ROM device are mounted. When assembling the detachable base board with the main base board, the detachable base board is locked and located by engaging structure and locking mechanism. The detachable base board can be easily drawn out of the main base board for maintenance, replacement and expansion.

Abstract: An actuating apparatus for optical scanners which can cause the lamp and the reflecting mirror to travel at a desired ratio of distances such that the total distance of scanner's light path before and after the lamp movement remains substantially unchanged. The actuating apparatus employs only one belt, thus greatly simplifying the structure of the scanner, improving the reliability thereof, and allowing the scanner to become more compact.