Abstract: Provided are a beveled light-emitting lamp bead, a beveled light-emitting lamp bead holder, a manufacturing method therefor, and a display device. The beveled light-emitting lamp bead holder includes a holder body and a metal holder embedded in the holder body, where the holder body is divided by the metal holder into a cup shield located on a top side and a support structure located on a bottom side, a cup bottom in the cup shield is provided with a chip mounting surface parallel to a cup rim top surface, a bottom portion of the support structure is provided with a soldering plane, the soldering plane is electrically connected to the chip mounting surface through the metal holder, and an inclination angle is formed between the chip mounting surface and the soldering plane.

Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.

Abstract: Provided are a light source module and a backlight display module. The light source module includes a flexible printed circuit board and a plurality of side-emitting LEDs. The flexible printed circuit board extends along a central axis. The plurality of side-emitting LEDs are sequentially arranged along the central axis and bonded to the flexible printed circuit board, and a light-emitting surface of one side-emitting LED of the plurality of side-emitting LEDs is perpendicular to a bonding surface of the flexible printed circuit board.

Abstract: A display module includes a substrate, m rows and n columns of pad sets, m*n sets of light emitting chip sets and multiple pins. The substrate includes a first surface and a second surface disposed opposite to each other. Each set of pad sets among the m rows and n columns of pad sets includes three pairs of pads, and first pads in the each set of pad sets are electrically connected. In a same set of light emitting chips, each of first electrodes of the light emitting chips is connected to a respective one of first pads of one set of pad sets among the m rows and n columns of pad sets, and each of second electrodes of the light emitting chips is connected to a respective one of second pads of a same set of pad sets.

Abstract: A white light emitting device, a light bar and a light apparatus. A relative spectrum of the white light emitting device is ?(?). A relative spectrum of a black body radiation with a corresponding color temperature is S(?). An area normalization is performed on ?(?) and S(?) to convert an equal energy spectrum ??(?) of the white light emitting device and an equal energy spectrum S?(?) of the black body radiation with the corresponding color temperature. A degree of similarity R of the equal energy spectrum of the white light emitting device and the equal energy spectrum of the black body radiation satisfies the following formula: R = 1 - ? ? ? ? i ? ? n ? ? S ? ? ( ? ) - ? ? ? ( ? ) ? ? ? ? i ? ? n ? S ? ? ( ? ) , when ?i is 380 nm, ?n is 680 nm, R?85%.

Abstract: Provided are a backlight board and a driving method thereof, a backlight module and a driving method thereof, and a display device. The backlight board includes light-emitting devices arranged in rows and columns and a first connector, where each first pin of the first connector is electrically connected to first electrodes of light-emitting devices in one row, each second pin of the first connector is electrically connected to second electrodes of light-emitting devices in one column; and in one drive cycle, a first drive signal drives light-emitting devices in each row for a duration T/n at different times, and a second drive signal drives light-emitting devices in each column for a duration T/n at different times.

Abstract: A LED display unit group includes a substrate and an electronic device, where the substrate includes a pad layer, an ink layer and an identification structure, the pad layer is disposed on a first surface of a side of the substrate adjacent to the electronic device; the pad layer includes pad regions and a non-pad region, each of the pad regions includes multiple pads, and the non-pad region includes metal traces; and the ink layer is disposed above the pad layer; each of the multiple pads is configured to secure the electronic device and is electrically connected to the electronic device; the metal traces are configured to connect the multiple pads via the metal traces; and an orthographic projection of the identification structure on the substrate is partially overlapped or staggered with an orthographic projection of the pad regions on the substrate.

Abstract: Provided are an LED package device and a preparation method thereof, and a display device. The package device includes a transparent substrate, a black layer, a transparent bonding layer, multiple LED chips, and a mold protective layer. The multiple LED chips are fixed to the transparent substrate based on the transparent bonding layer. The black layer is configured to cover the transparent bonding layer. The black layer is provided with multiple matching holes. The multiple LED chips are matched in the multiple matching holes in a one-to-one correspondence. The cover area of the transparent bonding layer is S1. The area of the top surface of the transparent substrate is S2. The constraint relationship between S1 and S2 is S1<S2. The mold protective layer is configured to wrap the black layer, the transparent bonding layer, and the multiple LED chips on the transparent substrate.

Abstract: Provided are a backlight board and a driving method thereof, a backlight module and a driving method thereof, and a display device. The backlight board includes light-emitting devices arranged in rows and columns and a first connector, where each first pin of the first connector is electrically connected to first electrodes of light-emitting devices in one row, each second pin of the first connector is electrically connected to second electrodes of light-emitting devices in one column; and in one drive cycle, a first drive signal drives light-emitting devices in each row for a duration T/n at different times, and a second drive signal drives light-emitting devices in each column for a duration T/n at different times.

Abstract: Some embodiments of the present disclosure disclose an LED backlight module and a display device, a plurality of light-emitting units are distributed on a substrate of the LED backlight module, and the surface of the substrate is provided with a plurality of solder mask window areas for the plurality of light-emitting units to abut against, and a conductive circuit connecting two adjacent light-emitting units includes a main circuit and an auxiliary circuit; a remaining portion of the substrate except for the solder mask window area is coated with an insulating material, an alignment error in the coating process causes the reserved solder mask window area to be covered and an actual solder mask window area to shift, since the auxiliary circuit passes through the solder mask window area and a routing-wiring direction is intersected the connecting-wiring direction of the two electrodes of the light-emitting units.

Abstract: The disclosure provides an LED white light device, including a blue light chip and phosphors. The blue light chip has a band of (455-470) nm. The phosphors include a dual-band yellow phosphor and a red phosphor having an excited light peak wavelength range of (610-660) nm. The yellow phosphor and the red phosphor are mixed according to a proportion of 1:(0.03-0.2) and cover the blue light chip, such that blue light emitted by the packaged LED white light device has a peak wavelength range of (450-465) nm. The disclosure also provides a preparation method of an LED white light device and an LED backlight module adopting the above LED white light device. The disclosure achieves the effects of blue light prevention, high color gamut and pure white simultaneously, Color uniformity and consistency are good, and a blue-green-red three-color continuous spectrum is provided, which is closer to a solar spectrum.

Abstract: A light-emitting system for healthy lighting, a light bar and a light fixture, wherein they are applied to the field of lighting and can emit white light with a color temperature range of 2700 K to 6500 K. A relative spectral power of the light-emitting system is set to be ? (?), and a relative spectral power distribution of a solar spectral curve corresponding to the color temperature is set to be S (?). The white light has a first characteristic waveband, and a wavelength region of the first characteristic waveband is 380-405 nm. The white light has a second characteristic waveband, and a wavelength region of the second characteristic waveband is 415-455 nm. The white light has a third characteristic waveband, and a wavelength region of the third characteristic waveband is 465-495 nm.

Abstract: Provided are a discrete component, a power module and a heat sink system. The discrete component includes a lead frame and a chip. The lead frame includes a top and a bottom disposed adjacent to each other. The top includes a support surface and multiple lateral surfaces connected in sequence. The multiple lateral surfaces are located between the support surface and the bottom. The chip is disposed on each of at least one lateral surface of the multiple lateral surfaces separately. The top of the lead frame is configured to be a metal structure.

Abstract: Provided are a method for machining a device and the device. The method for machining a device includes die bonding, primary dicing, filling by a baffle wall material, grinding and secondary dicing. In the step of grinding machining, a semi-finished product is placed on a platform surface of a grinding and fixing platform, a grinding working end of a grinding device is controlled to operate, and with the platform surface of the grinding and fixing platform as a height reference, the grinding working end grinds from above the semi-finished product toward the grinding and fixing platform and operates to a preset height. Through the special machining process, the probability of the appearance of white glue on a top surface of the device is reduced, which is conducive to ensuring a production yield of the device.

Abstract: Provided is an LED device. The LED device includes a bracket and a chip. The bracket includes a lead frame and a molded structure connected to the lead frame. The molded structure includes a chip placement body and a reflective structure. The chip placement body defines an avoidance groove. The reflective structure is a cylindrical structure with an inner through hole. The inner through hole communicates with the avoidance groove. The cylindrical structure is disposed around the periphery of the chip placement body. A first end of the cylindrical structure is formed with an opening communicating with the inner through hole. A second end of the cylindrical structure is connected to the chip placement body in the entire circumferential direction. A circumferential sidewall of the inner through hole forms a reflective surface used for reflecting light.

Abstract: Provided are a power module and a heat sink system. The power module includes a first circuit board, a second circuit board, at least one discrete component and an encapsulation body. One discrete component includes a lead frame and at least one chip, the lead frame is disposed between the first circuit board and the second circuit board, the lead frame includes two end faces and multiple mounting lateral surfaces connected in sequence, an angle is formed between one end face and one mounting lateral surface, one of the two end faces is electrically connected to the first circuit board and the other of the two end faces is electrically connected to the second circuit board, and the chip is disposed on each of the multiple mounting lateral surfaces. The encapsulation body is configured to pot a space between the first circuit board and the second circuit board.

Abstract: Provided are a bracket and a LED device. The bracket includes a lead frame and a molded structure connected to the lead frame. The lead frame includes a first lead portion, a second lead portion, and a barrier structure. The first lead portion includes a first base. The second lead portion includes a second base spaced from the first base. A gap between the first base and the second base forms a channel. The barrier structure is disposed on a side of at least one of the first base or the second base facing the channel. The barrier structure is disposed between two opposite ends of the first base and/or the second base and protrudes from the first base and/or the second base, and a length between two opposite ends of the channel is greater than a length of a middle part so that a “wide-narrow-wide” pattern is formed.

Abstract: Provided are a sensing device and a manufacturing method thereof. The sensing device includes a substrate, a red light chip, an infrared light chip, and a green light chip. The red light chip, the infrared light chip, and the green light chip are disposed on the front face of the substrate. Five front face pads are disposed on the front face of the substrate. Five back face pads are disposed on the back face of the substrate. The third back face pad is connected to the fourth back face pad by a conductive line. One of the five front face pads is electrically connected to a corresponding one of the five back face pads.

Abstract: Provided are a light board, a method for manufacturing the same, a light-emitting diode (LED) backlight module and an LED backlight device. The light board includes a substrate and a LED device. The substrate includes a first surface and a second surface disposed opposite to each other. The first surface and the second surface are each provided with a wiring area and a non-wiring area. A first heat sink assembly and multiple first reinforcement ribs are disposed in the non-wiring area of the first surface. The multiple first reinforcement ribs intersect to form a first encircled area. The first heat sink assembly is disposed in the first encircled area. The LED device is disposed in the wiring area of the second surface.

Abstract: Provided are a LED display unit group and a display panel. The LED display unit group includes a circuit board and pixel units. The circuit board includes N metal wiring layers stacked in sequence and an insulating plate disposed between adjacent metal wiring layers, and the N metal wiring layers are electrically connected through conductive vias on the insulating plate. The pixel units are arranged in an array of m rows and n columns and disposed on the circuit board. Each pixel unit includes at least two LED light-emitting chips with different emitted colors, each LED light-emitting chip is fixed on a first metal wiring layer. The first metal wiring layer includes m common A-electrode pads, A-electrode pads, and B-electrode pads. All the A-electrode pads corresponding to each row of pixel units are integrally formed with and electrically connected to one corresponding common A-electrode pad.