Abstract: A light emitting diode (LED) side marker lamp, comprising a punching panel with a coating, a water-proof light source module, and a through hole. The water-proof light source module is disposed below the punching panel, and the through hole is disposed on the punching panel and operates to allow light to be emitted from the water-proof light source module. A traditional cover is not needed, and the punching panel is used to replace the cover and colors thereof match with those of buildings, which improves decoration effect of the invention; secondly, as the LED side marker lamp fails, only the water-proof light source module needs to be replaced, which is convenient for maintenance and reduces cost; finally, the number of light source modules can be varied, which is flexible in use.

Abstract: A structure of a heat dissipation substrate of power LEDs and a device made by using the same overcomes drawbacks such as complex structure of power LEDs, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of the heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other. The through hole is smaller than the blind hole, and both of them share the same direction of axis. The heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit.

Abstract: The present invention relates to lighting assemblies and more particularly to light emitting diode (LED) light bulbs comprising a support for one or more LED lenses, which can be used to position and support the lenses within the lamp housing and which facilitate assembly of the light bulbs during manufacturing.

Abstract: A structure of heat dissipation substrate of power LED and a device made thereof overcomes drawbacks such as complex structure of power LED, strict manufacturing process, low production efficiency, high production cost, and unreliable product quality. The structure of heat dissipation substrate includes a one-piece circuit board having a counterbore and metal lines thereon, wherein the counterbore is formed by a through hole and a blind hole communicating with each other, and the through hole is smaller than the blind hole, and both of them share the same direction of axis; the heat sink has a one-piece terraced structure formed by a upper terrace and a lower terrace; the heat sink matches the counterbore to form a firm fit; a plurality of counterbores may be arranged on the circuit board; the circuit board may also comprise a plurality of position lines for cutting and a plurality of slots and/or holes.