Abstract: A printed circuit board includes a first printed circuit substrate and a second printed circuit substrate. The first printed circuit substrate includes a substrate layer and a first conductive circuit layer. The first conductive circuit layer is formed on the substrate layer. The substrate layer includes at least two first grooves. The first conductive circuit layer includes at least one signal wire. The first grooves are defined in both sides of the signal wire. The second printed circuit substrate is formed on the first printed circuit substrate. The second circuit substrate includes a third copper layer. A second groove is defined in the third copper layer. The first grooves are opposite to the second groove. The first grooves and the second groove form a space. The signal wire is surrounded by air in the space. A method for manufacturing the printed circuit board is also provided.

Abstract: A flexible circuit board includes a wiring layer, two photosensitive resin layers, and two electromagnetic interference shielding layers. The wiring layer includes at least one signal line, two ground lines and at least two gaps. Each gap includes two opening portions. The two photosensitive resin layers cover the signal line and the opening portions, and are connected to each end of each ground line. Each electromagnetic interference shielding layer covers one photosensitive resin layer away from the signal line, portions of the two ground lines not connected to the photosensitive resin layer, and portions of the gaps not covered by the two photosensitive resin layers, thereby causing the portions of each gap not covered by the two photosensitive resin layers to define a receiving chamber. Each end of each receiving chamber communicates with one opening portion of the corresponding gap to define a cavity.

Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.

Abstract: A flexible circuit board includes two copper clad laminates, a circuit pattern and two bonding layers. Each copper clad laminate includes an insulating base and an outer circuit layer. The circuit pattern is located between the two copper clad laminates. The circuit pattern includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. Each bonding layers is located between the circuit pattern and a corresponding copper clad laminate. Each boding layer defines a slot without adhesive therein. The bonding layers are spaced from the linear signal line by the slots. The slots and the hollow areas cooperatively define an air medium layer enclosing the linear signal line. A method for manufacturing the flexible circuit board is also provided.

Abstract: A flexible circuit board includes an insulating layer, a linear signal line, a plurality of grounding lines, a metal coating layer, a circuit layer and an electromagnetic shielding layer. The insulating layer includes a first face and a second face. The metal coating layer covers the linear signal line on the first face. The metal coating layer has a thickness less than that of the linear signal line, and an electrical conductivity larger than that of the linear signal line. The grounding lines are at two opposite sides of the linear signal line on the first face. The circuit layer is on the second face. The electromagnetic shielding layer covers the linear signal line and the grounding lines. The linear signal line and the grounding lines are between the electromagnetic shielding layer and the circuit layer. A method for manufacturing the flexible circuit board is also provided.

Abstract: A flexible circuit board includes a first base layer, a circuit layer, a second base layer and a bonding layer. The circuit layer is coupled to a side of the first base layer and includes a linear signal line, two grounding lines located at two opposite sides of the linear signal line, and two hollow areas located between the linear signal line and the grounding lines. The bonding layer couples the second base layer to the circuit layer and defines a first opening corresponding to the linear signal line and communicating with the hollow areas of the circuit layer. The first opening of the bonding layer and the hollow areas of the circuit layer cooperatively define an air medium layer surrounding the linear signal line. A method for manufacturing the flexible circuit board is also provided.

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract: A printed circuit board with circuit visible includes a wiring layer, a first adhesive layer, a first dielectric layer, and a cover film, which are stacked in described order, the wiring layer comprising at least one electrical contact pad. The cover film has at least one opening corresponding to the electrical contact pad. The cover film includes a second dielectric layer and a second adhesive layer. A flow initiation temperature of the first adhesive layer is in a range from 85 degrees centigrade to 90 degrees centigrade, and a hardening temperature of the first adhesive being lower than 150 degrees centigrade.

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.

Abstract: A method for manufacturing a rigid-flexible printed circuit board includes following steps. First, a flexible PCB is provided. The flexible PCB includes a base and an electrical trace layer on the base. The flexible PCB includes a first region and a second region connected to the first region. The first and second regions define a borderline. Second, a protective film and a peelable layer are sequentially formed on the electrical trace layer in the first region and part of the second region. Third, a copper coil, an adhesive tape and the flexible circuit board are laminated together. Fourth, the copper coil in the second region is etched to form an outer electrical trace layer. Last, the copper coil in the first region is removed and the peelable layer and the adhesive tape are peeled off, thereby obtaining an R-F PCB.

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a double-sided flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising m segments, wherein m=n/2 if n represents an even integer, and m=(n+1)/2 if n represents an odd integer. Each segment includes two foil portions. In a reel to reel process, the strip is treated to form n?2 foil portions of each PCB unit into traces, further remove one foil portion if n represents an odd integer. The other two foil portions are left untreated. Then the strip is cut to separate the PCB units from each other. The PCB unit is folded in such a manner that the traces are arranged between the other two foil portions. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two foil portions.

Abstract: A printed circuit board includes a first electrically conductive circuit pattern, a substrate layer, an adhesive sheet, and a second electrically conductive circuit pattern, which are arranged in the above described order. The printed circuit board includes a single layer electrically conductive circuit area. The adhesive sheet defines a first opening spatially corresponding to the single layer electrically conductive circuit area. The adhesive sheet includes a first inner sidewall surrounding the first opening. The second electrically conductive circuit pattern defines a second opening spatially corresponding to the single layer electrically conductive circuit area. The second electrically conductive circuit pattern includes a second inner sidewall surrounding the second opening. The first inner sidewall and the second inner sidewall are not completely coplanar.

Abstract: In a method for manufacturing multilayer PCBs having n circuit layers, a flexible substrate strip is provided. The strip comprises a number of PCB units, each comprising n segmental portions. The strip is treated in a reel to reel process to form traces in n?2 segmental portions of each of the PCB units, the other two segmental portions are left untreated without traces. Then the strip is cut to obtain a number of separated PCB units. The PCB unit is folded in such a manner that the n?2 segmental portions having traces are arranged between the other two segmental portions without traces. The folded PCB unit is laminated to form a multilayer substrate and traces are formed in the two segmental portions.

Abstract: An RFPCB includes a reinforcement layer and at least two FPCBs spliced together to match the reinforcement layer in shape and size. The FPCBs are adhered onto the reinforcement layer. The reinforcement layer includes circuits connected with the FPCB and has portions removed to obtain a desired flexibility.

Abstract: This disclosure relates to a printed circuit board comprising a light-pervious insulation layer, a patterned electrically conductive layer and a light-pervious overlay. The patterned electrically conductive layer includes a first black oxide layer, a copper layer and a second black oxide layer. The copper layer includes two opposite surfaces and a plurality of inner surfaces interconnecting the two opposite surfaces of the copper layer. The first black oxide layer is formed on one of the surfaces, and the second black oxide layer is formed on the other surface and the inner surfaces. The patterned electrically conductive layer is arranged on the light-pervious insulation layer. The light-pervious overlay is arranged on the second black oxide layer. A method for manufacturing the printed circuit board is also provided in this disclosure.

Abstract: A method for manufacturing a PCB includes certain steps. A printed circuit board sheet is provided. The printed circuit board includes an unwanted portion and a printed circuit board unit which includes a plurality of contact pads. An imaginary boundary line is defined between the printed circuit board unit and the unwanted portion. Each of the contact pads defines an outline. A nearest distance between the outline and the imaginary boundary line is less than 4 millimeters. The printed circuit board sheet is punched along the imaginary boundary line, forming one hollow portion or a plurality of through slots. A plurality of burrs is generated on an inner surface of the hollow portion or the through slots. The burrs are removed using a low-energy laser cutting process, thereby obtaining a printed circuit board. A laser power used in the low-energy laser cutting process is 5-8 watts.

Abstract: A method for manufacturing a printed circuit board with cavity includes following steps. First, a first substrate is provided. The first substrate includes a first electrically conductive layer defining an exposed portion and a laminating portion. Second, a second substrate is provided. The second substrate includes an unwanted portion corresponding to the exposed portion and a preserving portion. Third, a first annular bump surrounding the exposed portion is formed. Fourth, a second annular bump surrounding the unwanted portion is formed. Fifth, a first adhesive layer defining an opening is provided. Sixth, the first and second substrates are laminated to the first adhesive layer, the exposed portion and the unwanted portion are exposed in the opening, and the second annular bump is in contact with the first annular bump. Seventh, the unwanted portion is removed and a cavity is defined, the exposed portion is exposed in the cavity.

Abstract: An FPCB includes a flexible base, a wiring layer formed on a top surface of the base, a covering layer formed on the wiring layer, and a shielding layer formed on a portion of the covering layer. The wiring layer includes a grounding line. The covering layer defines an opening to expose the grounding line to the outside. A portion of the shielding layer fills into the opening. The shielding layer is electrically connected to the grounding line through the opening.

Abstract: A PCB includes at least three single layer circuit boards laminated together. The single layer circuit boards include two outer circuit boards and at least one inner circuit board. Each single layer circuit board includes a dielectric layer and a conductive layer on a surface of the dielectric layer. The dielectric layer is selected from a material of thermoplastic resin. Each single layer circuit board defines at least one blind hole passing through the dielectric layer and is ended at the conductive layer. Each blind hole is filled with a filler material electrically connected to the conductive layer. The conductive layer of the at least one inner circuit board forms a first conductive circuit pattern, and the conductive layers of the outer circuit boards each form a second conductive circuit pattern. The second conductive circuit pattern is electrically connected to the first conductive circuit pattern by the filler material.

Abstract: A compact rigid-flexible board includes two flexible PCBs, two rigid substrates, a third trace layer and a fourth trace layer. The first flexible PCB includes a first depressing portion, a first exposed portion and a third depressing portion, and a separated second exposed portion. The second flexible PCB includes fourth and fifth depressing portions, and a second exposed portion. The first rigid substrate includes sixth, seventh, and eighth depressing portions. The second rigid substrate includes ninth and tenth depressing portions. The third trace layer, the sixth, first, fourth, and ninth depressing portions and the fourth trace layer are stacked in sequence. The third trace layer, the seven, second, fifth, and tenth depressing portions, and the fourth trace layer are stacked in sequence. The third trace layer and the eighth and third depressing portions are stacked in sequence.