Abstract: A method of forming a circuit on a circuit board includes the following steps. Firstly, a surface of an insulating substrate is hydrophilically treated. Secondly, a first circuit layer having a number of electrical traces is formed on the hydrophilically treated surface, the first circuit layer is comprised of a soluble palladium salt. Thirdly, the soluble palladium salt of the first circuit layer is reduced into metallic palladium, thereby obtaining a second circuit layer comprised of metallic palladium. Lastly, an electrically conductive layer is formed on the second circuit layer.

Abstract: An exemplary ink for forming electrical traces includes a plurality of noble-metal-coated diacetylene vesicles formed by combining a noble-metal-ions-containing aqueous solution with diacetylenic monomers each including a hydrophilic group and a lipophilic group. The noble metal ions are attracted to an external surface of each of the diacetylene vesicles.

Abstract: A silver-containing ink includes an aqueous carrier medium having both a silver salt and an amine sensitizer for the silver salt dissolved therein, and a light sensitive reducing agent dispersed in the aqueous carrier medium. The amine sensitizer includes at one or more amine group; and the light sensitive reducing agent is capable of reducing the silver in the silver-containing ink to silver particles when irradiated.

Abstract: An exemplary ink for forming electrical traces includes an aqueous carrier medium, a palladium salt and a reducing agent. The palladium salt is capable of being dissolved in the aqueous carrier medium. The reducing agent is configured for reducing the palladium ions into palladium particles under an irradiation ray.

Abstract: A method of forming a circuit on a circuit board includes the steps of: forming a first circuit pattern made of a nano-scale metal oxide material on a surface of an insulating substrate; reducing the nano-scale metal oxide material into a nano-scale deoxidized metal material, thus obtaining a second circuit pattern; and forming an electrically conductive metal layer on the second circuit pattern.

Abstract: A method for manufacturing a printed circuit board (PCB) having different thicknesses in different areas includes: providing a first substrate having two lateral unwanted portions bounded two imaginary boundary lines, a binder layer having a through opening and a second substrate having a mounting area for mounting electronic elements; forming two slots bounded the imaginary boundary lines in an intermediated unwanted portion of the first substrate corresponding to the mounting area; laminating the first and second substrates, and the binder layer with the mounting area exposed via the through opening; filling the two slots and the through opening with a filling material, thereby obtaining a semifinished PCB board; cutting the semifinished PCB board along the imaginary boundary lines to remove the two lateral unwanted portions and a portion of the second substrate corresponding to the two lateral unwanted portions; and removing the intermediate unwanted portion and the filling material.

Abstract: A printed circuit board includes a substrate having a surface, a circuit layer having a plurality of electrical traces formed on the surface, and an electrically conductive metal layer formed on the circuit layer. The circuit layer is comprised of a composite of carbon nano-tubes and metallic nano-particles.

Abstract: A method for manufacturing a printed circuit board (PCB) includes: providing a first PCB substrate, a second PCB substrate and an adhesive layer, the first PCB substrate having a first main portion and a first unwanted portion divided by a first imaginary boundary, the second PCB substrate including a second main portion and a second unwanted portion divided by a second imaginary boundary; forming an opening in the adhesive layer; filling an filling mass in the opening; laminating the first PCB substrate, the second PCB substrate and the adhesive layer such that the adhesive layer is sandwiched between the first PCB substrate and the second PCB substrate, and the first, second imaginary boundaries are misaligned, a projection of each of the first and second imaginary boundaries in the adhesive layer being within the opening; and cutting the first and second PCB substrates along the first and second imaginary boundaries respectively.

Abstract: In this present invention, a method for forming solder lumps on printed circuit board (PCB) substrate is provided. A PCB substrate including a number electrical traces and solder pads formed on a substrate surface thereof is provided. A liquid photoresist is applied onto the PCB substrate such that a photoresist layer defining a number of openings thereof is formed and each of the solder pads is exposed via each of the openings. A solder masses are filled into each of the openings. The solder masses are reflowed and the photoresist layer is removed.

Abstract: A method for manufacturing a multilayer FPCB includes the steps of: providing a first copper clad laminate, a second copper clad laminate and a binder layer; defining an opening on the binder layer; defining a first slit on the first copper clad laminate; laminating the first copper clad laminate, the binder layer and the second copper clad laminate; defining a via hole for establishing electric connection between the first copper clad laminate and the second copper clad laminate; cutting the first copper clad laminate, the binder layer and the second copper clad laminate thereby forming a multilayer flexible printed circuit board having different numbers of layers in different areas.

Abstract: A method for manufacturing a rigid-flexible printed circuit boards includes following steps. Firstly, a flexible substrate is provided. Secondly, at least one slit is defined in the flexible substrate. Thirdly, a rigid substrate having a structure corresponding to the flexible substrate is provided. Fourthly, the flexible substrate is laminated to the rigid substrate to obtain a laminated substrate. Fifthly, part of the rigid substrate is removed. Sixthly, the laminated substrate is cut along an imaginary boundary line to remove waste portion of the laminated substrate. Thus, a rigid-flexible printed circuit board is obtained.

Abstract: A method for forming circuit in making a printed circuit board includes the following steps. A patterned photoresist layer is formed on a surface of an insulating substrate such that a first portion of the surface of the insulating substrate is exposed and a second portion of the surface of the insulating substrate is covered by the patterned photoresist layer. An electrically conductive layer is deposited on the first portion of the surface of the insulating substrate so as to obtain a circuit formed on the surface of the insulating substrate. The patterned photoresist layer is removed from the surface second portion of the surface of the insulating substrate.

Abstract: The present invention relates to a board inverter and a boarding inverting system. The board inverter includes a support, a first board picking device, an second board picking device and a controller. Each of the first board picking device and the second board picking device includes a driving mechanism and a first board picking device. The driving mechanism comprises a first linear driving means mounted on the support, a second linear driving means mechanically coupled to the first linear driving means, and a rotary driving means attached to the second linear driving means. The controller is connected to all the power supply members. The controller controls the motion of the first board picking device and the second board picking device such that the first board picking device and the second board picking device cooperatively inverting workpieces transmitted on a production line. The board inverter can be installed on a production line without altering the arrangement of existing production line.

Abstract: A method for manufacturing a multilayer printed circuit board includes the following steps. A number of laminate units are provided. Each of the laminate units includes an electrically conductive layer with a circuit pattern defined therein, and a release layer releasably attached to the electrically conductive layer. A number of insulation layers are provided. Each of the insulation layers definies a metalized through hole therein. The electrically conductive layers and the insulation layers are stacked alternately one on another such that adjacent electrically conductive layers are insulated by one insulation layer and the metalized through holes electrically connects the circuit patterns of the adjacent electrically conductive layers. In the stacking step, the release layer is removed from the laminate unit after the electrically conductive layer is stacked onto the respective insulation layer, thereby obtaining a pre-laminated multilayer printed circuit board.

Abstract: An exemplary method for manufacturing printed circuit boards is provided. In the method, a substrate having a first surface and a second surface on an opposite side of the substrate to the first surface is provided. A number of through holes in the substrate between the first surface and the second surface are formed. An electrically conductive paste is applied to the substrate to fill the through holes defined in the substrate to form a plurality of filling members and be printed on at least one of the first surface and the second surface of the substrate to form a number of electrical traces. The filling members located in the through hole in the substrate and the electrical traces printed on the substrate are cured.

Abstract: A flexible printed circuit board substrate includes an electrically conductive layer, an insulation layer, and a hook. The electrically conductive layer has a first surface and a second surface at an opposite side thereof to the first surface. The insulation layer having a third surface and a fourth surface at an opposite side thereof to the third surface. The third surface of the insulation layer combines with the second surface of the electrically conductive layer. A through hole is defined in the electrically conductive layer and the insulation layer extending from the first surface of the electrically conductive layer to the fourth surface of the insulation layer. The hook extends from the electrically conductive layer and passes through the through hole to protrude from the fourth surface of the insulation layer.

Abstract: An exemplary simulation system for manufacturing a printed circuit board is provided. The simulation system includes at least one simulation sub-system. The simulation sub-system includes an input module, a storing module, a processing module, and an output module. The input module is configured for acquiring a number of processing parameters associated with steps of a process for manufacturing the printed circuit board. The storing module is configured for storing a number of simulation functions relating to the steps of the process for manufacturing the printed circuit board. The processing module is configured for selecting and performing the corresponding simulation function according to the acquired parameters, thereby obtaining a simulation result. The output module is configured for output the simulation result.

Abstract: A flexible printed circuit board includes a flexible base, a working trace region, and at least one reinforcement trace. The working trace region and the at least one reinforcement trace are formed on the flexible base. The working trace is formed by a number of working traces. In the flexible base, the at least one reinforcement trace is disposed at a periphery of the working trace region.

Abstract: An exemplary method of welding electronic components on PCBs is disclosed. Firstly, a metal tray including a number of supporting areas is provided. At least one through hole is formed in each of the supporting areas. Secondly, solder pastes are applied onto welding pads of PCBs. Thirdly, electronic components are mounted on the welding pads. Fourthly, PCBs are placed on the metal tray in a manner that each printed circuit board is placed in a corresponding supporting area and the welding pads being above the through hole. Finally, the solder pastes are heated to weld the electronic components on the printed circuit board. By doing so, the heat can pass through the through holes in each supporting area directly and fully melt the solder paste. As a result, welding defects can be reduced.

Abstract: In one embodiment, a holder for holding printed circuit boards includes a base plate with a plurality of holding unit formed thereon. Each of the holding units includes a spring member, a securing member, and a blocking structure. The spring member includes a first end and a second end. The first end is attached to the base plate. The securing member is slideably mounted on the base plate. The securing member includes a connecting end and a securing end. The connecting end is connected with the second end of the spring member. The blocking structure is located on the base plate. The spring member is configured for pressing the securing member to move toward the blocking structure such that a printed circuit board is retainable between the securing end of the securing member and the blocking structure on the base plate. The holder is capable of holding printed circuit boards in batches.