Abstract: In order to treat solar cells in an electroplating device, they can be inserted into a grid-like or tray-like picking-up device. They are thus mechanically held and electrical contact is made with them via contacts. Instead of individual solar cells, the picking-up devices are moved with a large number of inserted solar cells through the electroplating device for treatment. Electrical contact with the solar cells is in this case made via the contacts and the frame limbs on a projecting angle section together with edge strips of the pick-up. Contact rollers rest on the edge strips and are connected to an electrical power source.

Abstract: A contacting device for a galvanization apparatus comprises contacting rollers with a continuous rigid external face, which is joined to a jacket section. The jacket section is provided with an inner opening that is wider than a rotating shaft on which the contacting roller sits. This allows the contacting roller to be moved in a radial direction, wherein electric contacting and securing of a basic position is obtained via springs in every one of the radially moved positions. The moveability of the contacting roller ensures good contact as the contacting roller rests against substrates also when the substrates are uneven. The contact pressure can be relatively small.

Abstract: One embodiment of the invention is a method for placing circuit boards in a receiving container, comprising the following steps: a) gripping and lifting a circuit board with a first grappling device, b) moving the first grappling device and the receiving container relative to each other, such that the receiving container is located below the first grappling device, c) the first grappling device lowers the circuit board into the receiving container, d) gripping and lifting a partition layer from a dispenser with a second grappling device, e) reversion to step b), such that the receiving container is accessible from above and is below the second grappling device, f) the partition layer is placed in the receiving container on top of the previously placed circuit board and g) start the process at a).

Abstract: In order in a continuous electroplating plant to avoid the problem of undesired metal application or metallization on contact faces (25), which e.g. occur in the case of rolling contacting of the article (13) to be plated, e.g. a printed circuit board, on contact rollers or disks (15) are provided individual contact sectors (24), which are alternately anodically and cathodically supplied with power via a commutator (27) located outside the treatment chamber (11). The contact sectors (24) are mutually overlapping and are staggered e.g. in sloping, arrow-like or step-like manner, so that a continuous contacting with respect to the article (13) is possible.Contacting takes place in a lateral portion (45) of the treatment chamber (11), which is admittedly filled with treatment fluid (40), but is largely shielded with respect thereto, so that the metal application tendency is reduced.

Abstract: In an apparatus for the treatment of board-shaped articles, particularly printed circuit boards, with a liquid treatment medium, particularly a cleaning, etching, metallizing or rinsing liquid, along a substantially horizontal conveying path defined by a conveying means, for improving the handling of thin circuit boards it is proposed that the conveying means on either side of the conveying path and both above and below the conveying plane comprises elements guiding the longitudinal edges of the boards.

Abstract: In order when treating printed circuit boards with liquids, particularly during cleaning, etching, metallizing or rinsing, to achieve a precisely time measurable and effective treatment, the area supplied by means of a spray or swell nozzle or a stationary wave is limited by suction devices (24, 25, 41, 42). The latter are positioned upstream and downstream of the application (28, 38). The spray or suction nozzles (22, 24, 25) are arranged in a common casing and the boards (12) to be treated move horizontally passed its lower periphery.

Abstract: An electroplating apparatus (11) has a conveying system (19), which passes the printed circuit boards on a horizontal passage path through the treatment chamber (13). They are contacted by tong-like grippers (32), which run upstream of the leading edge (63) of the circuit board and in this area engage thereon from above and below. The gripers (32) are fixed to transverse beams (29), which are guided on both sides by chains (26) and electrically contacted by contact rails (39). Thus, the circuit boards (12) are moved in a horizontal, central path and simultaneously contacted. Alternatively the circuit boards (12) can be conveyed between electrically connected contact roll pairs (21), which are conveyed by an upper and lower conveyor (20a, b) and automatically rotate in order to convey the circuit boards at high speed.

Abstract: In an apparatus for treating plate-shaped articles in a liquid medium including a bath containing the liquid medium with gap-like inlet and outlet openings arranged beneath the liquid level and a conveying device for conveying the plate-shaped articles along a substantially flat path of conveyance through the inlet and outlet openings and through the liquid medium in the bath, in order to reduce the loss of liquid from the bath, it is proposed that the inlet and outlet openings comprise sealing elements which are movable from a closed to an open position as the plate-shaped articles pass through them and which are furthermore of such design that the gap created by the sealing elements in their open position is substantially adaptable in height and width to the cross-section of the articles passing through it.