Abstract: An imaging apparatus includes an image sensor assembly and a plurality of signal feed-in contacts. The image sensor assembly includes a movable substrate, an image sensing chip, and a bearing frame. The image sensing chip is disposed on an upper surface of the movable substrate. The bearing frame is disposed on the upper surface and surrounds the image sensing chip. The signal feed-in contacts are disposed on the movable substrate, and the signal feed-in contacts are not shaded by the image sensor assembly. The signal feed-in contacts are configured to transmit an enabling signal for enabling the image sensing chip.

Abstract: An adjustable mirror motor assembly includes a base, a mirror motor component, and a housing. The mirror motor component is fixed on the base and includes a mount and a dragging member. The mount is fixed on the base. A pivot end of the dragging member is pivotally connected to a pivot portion of the mount, and a slide end of the dragging member is slidably disposed in a slide portion of the mount, so that the slide end is pivotally rotated with respect to the pivot end and is slidably moved in the slide portion. A magnet component is on a magnet fixation portion of the dragging member. A mirror is on a mirror fixation portion of the dragging member. The housing covers the base and the mirror motor component.

Abstract: The present disclosure provides a camera module and an electronic device. The camera module comprises a bearing base, an image sensor, a baseplate, a lens bracket, and a lens group. The image sensor is disposed at the bearing base. The baseplate is disposed at the bearing base and is separated from the image sensor. The baseplate is disposed on the periphery of the image sensor. The baseplate is electrically connected with the image sensor. The lens bracket is disposed at the bearing base. The image sensor and a part of the baseplate are disposed in the lens bracket. The lens bracket comprises a photosensitive through hole. The image sensor corresponds to the photosensitive through hole. The lens group is disposed at the lens bracket and corresponds to the image sensor through the photosensitive through hole.

Abstract: An imaging device includes a light emitter, an optical diffraction plate, a pair of wedge prisms, a rotation unit, a light receiver, and a processing unit. The light emitter emits a light beam. The optical diffraction plate is for converting the light beam into a plurality of diffracted light rays that forms a first light spot. The pair of wedge prisms is for adjusting an emission direction of the first light spot. The rotation unit is connected to the pair of wedge prisms and is for rotating the pair of wedge prisms relative to each other. The light receiver is for receiving a plurality of second light spots reflected from the plurality of first light spots. The processing unit is connected to the light receiver and is for generating a plurality of pieces of light spot information and processing the plurality of pieces of light spot information into image information.

Abstract: A zoom lens includes a first lens group and a second lens group. A relative movement between the first lens group and the second lens group is allowed, whereby the zoom lens zooms between a wide-angle end and a telephoto end. While the zoom lens is switched from the wide-angle end toward an intermediate state, the first lens group is moved toward the image side. While the zoom lens is switched from the intermediate state toward the telephoto end, the first lens group is moved toward the object side.

Abstract: An imaging apparatus includes an image sensor assembly and a flexible flat cable. The image sensor assembly includes a movable substrate, an image sensing chip, and a bearing frame. The image sensing chip is disposed on the movable substrate and electrically connected to electrical connection pads of the movable substrate. The bearing frame is surrounds the image sensing chip. The flexible flat cable includes a fixed disposed corresponding to an edge of the movable substrate, a floating section having one connected to the fixed end and floating over an upper surface of the movable substrate, and an electrical connection end extending from the other end of the floating section. The electrical connection end is perpendicular to the upper surface of the movable substrate and terminals on an edge of the electrical connection end are electrically connected to the electrical connection pads.

Abstract: An image sensing device includes a sensing module and an invisible light transmitter. The sensing module includes pixel sets arranged on a substrate. The pixel set includes sub pixels, an invisible light sensor, and a focus adjustment member. The sub pixels and the invisible light sensor are arranged in an array. The sub pixel includes a visible light photo diode. The invisible light sensor includes an invisible light photo diode. The focus adjustment member is between the substrate and the visible light photo diode or the invisible light photo diode. The focus adjustment member makes a distance between the visible light photo diode and the substrate less than or greater than a distance between the invisible light photo diode and the substrate. The invisible light transmitter is disposed corresponding to the sensing module. The invisible light sensor is configured to sense invisible light transmitted by the invisible light transmitter.

Abstract: An imaging correction unit and an imaging module are provided. The imaging correction unit has an optical axis and includes four wedge optical elements with the same structure. The wedge optical elements are disposed sequentially on the optical axis. Each of the wedge optical elements has a minimum thickness dimension at a first edge and a maximum thickness dimension at a second edge. A connection line between the first edge and the second edge forms a symmetry axis of the each of the wedge optical elements. When a beam transmitted along the optical axis of the imaging correction unit passes sequentially through the wedge optical elements and is imaged at a center of an imaging surface, the symmetry axis of any one of the four wedge optical elements is at an angle of 90 degrees relative to the symmetrical axis of one of adjacent wedge optical elements.

Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.

Abstract: A zoom lens module includes first to eighth lens elements sequentially arranged from an object end to an image end. The number of lens elements with refractive power in the zoom lens module is eight. The first lens element and the second lens element form a first lens element group. The third lens element and the fourth lens element form a second lens element group. The fifth lens element and the sixth lens element form a third lens element group. The seventh lens element and the eighth lens element form a fourth lens element group. The first lens element group and the fourth lens element group remain fixed during zooming. The second lens element group and the third lens element group move during zooming.

Abstract: An image sensing device includes a sensing module, a moving module, and an invisible light transmitter. The sensing module includes several pixel sets. Each of the pixel sets includes several sub-pixels and one or more invisible light sensor. The sub-pixels and the invisible light sensor are arranged into an array. The moving module is connected to the sensing module. The moving module is used to move the sensing module. The invisible light transmitter is disposed corresponding to the sensing module. The invisible light sensor is used to sense an invisible light transmitted from the invisible light transmitter.

Abstract: A lens positioning device including a lens carrier, a housing, three pairs of memory alloy wires and three displacement detecting units is provided. The three pairs of memory alloy wires are used to control the displacement of the lens carrier in three directions, respectively. Each of the displacement detecting units includes a magnetic element and a magnetic field sensing element. The magnetic field sensing element is arranged corresponding to the magnetic element to sense change of the magnetic field of the magnetic element along each of the three directions when the lens carrier moves. One magnetic element of any one of the three displacement detecting units is arranged at a position that can induce the corresponding magnetic field sensing element and does not interfere with the magnetic field sensing elements of the other two of the three displacement detecting units.

Abstract: A compound prism module is provided, including a first prism and a second prism. The first prism includes a first light-incident surface, a first reflecting surface, and a first light-emergent surface connected to each other, where the first light-incident surface and the first light-emergent surface are connected to each other on a first side edge. The second prism includes a second light-incident surface, a second reflecting surface, and a second light-emergent surface connected to each other, where the second light-incident surface and the second light-emergent surface are connected on a second side edge. The first light-incident surface and the second light-incident surface are connected to each other and are coplanar, the first reflecting surface and the second reflecting surface are connected on a third side edge, there is a spacing between the third side edge and a connection between the first light-incident surface and the second light-incident surface.

Abstract: A compound prism module is provided, including: a first prism, a second prism, and an interface filling medium. The first prism has a first light-incident surface, a first reflecting surface, and a first light-emitting surface, where the first light-incident surface and the first light-emitting surface are connected to a first side edge, and the first light-incident surface and the first reflecting surface are connected to a first chamfered plane. The second prism has a second light-incident surface, a second reflecting surface, and a second light-emitting surface, wherein the second light-incident surface and the second light-emitting surface are connected to a second side edge, and the second light-incident surface and the second reflecting surface are connected to a second chamfered plane. The first light-incident surface and the second light-incident surface are connected to each other, and the first side edge and the second side edge are parallel to each other.

Abstract: An imaging correction unit and an imaging module are provided. The imaging correction unit has an optical axis, and includes an optical turning element and two wedge-shaped optical elements. The optical turning element has a light emitting surface, and the light emitting surface has a first included angle with respect to the optical axis. Each of the two wedge-shaped optical elements has an inclined optical surface, and the inclined optical surface has a second included angle with respect to the optical axis. The light emitting surface of the optical turning element faces one of the two wedge-shaped optical elements, and the two wedge-shaped optical elements are rotatable relative to the optical axis.

Abstract: A circuit structure including a pad assembly, a bonding pad assembly, and a bonding assembly is provided. The pad assembly includes a first pad, a second pad, and a third pad which are separated from one another. The bonding pad assembly is located on one side of the pad assembly and includes a first bonding pad. The bonding assembly includes a first bonding wire, a second bonding wire, and a plurality of bonding members. The first bonding wire is connected to the first bonding pad and the first pad. The second bonding wire is connected to the first bonding pad and the third pad. The bonding members are connected among the first pad, the second pad, and the third pad. The circuit structure provided here may have an improved wire bonding efficiency and an increased distribution density of bonding points, and the number of bonding wires may be reduced.

Abstract: The present disclosure provides a time-of-flight camera, comprising a light-emitting module and a light-receiving module. The light-emitting module comprises a light source component, a light-reflecting component, and a light-diffusing component. The light source component emits a first light in a first direction. The light-reflecting component and the light-diffusing component are disposed on the light path of the first light. A second light formed by the first light passes through the light-reflecting component and the light-diffusing component. The second light travels toward a second direction to an object to be measured. The object to be measured reflects the second light. The first direction is intersecting with the second direction. The light-receiving module receives the reflected second light and performs the function of sensing.

Abstract: A zoom lens module is provided and includes a liquid lens, a rigid lens, and an actuator. The liquid lens has two side surfaces opposite to each other. An optical axis of the liquid lens passes through the two side surfaces, and at least one of two side surfaces is a deformable side surface. The rigid lens has a shaping surface being not flat. The rigid lens is arranged inside or outside the liquid lens, and the shaping surface faces the deformable side surface. The actuator is connected to one of the liquid lens and the rigid lens to drive the deformable side surface and the shaping surface to move relative to each other, so that the shaping surface contacts and presses the deformable side surface to be deformed.

Abstract: An image sensing device includes a first light path changing element, a second light path changing element, and a plane lens. The first light path changing element includes a first light-incident side and a first light-emergent side, where the first light-incident side faces an image-capturing direction, the first light-emergent side faces a zoom optical axis, and there is an angle between the first light-incident side and the first light-emergent side. The second light path changing element includes a second light-incident side and a second light-emergent side, where the second light-incident side faces the zoom optical axis, the second light-emergent side faces an image-forming direction. An angle is between the second light-incident side and the second light-emergent side. An image-capturing light path passes through the first light-incident side, the first light-emergent side, the second light-incident side, and the second light-emergent side. The plane lens is disposed on the image-capturing light path.

Abstract: An image capturing module including an image capturing unit, a lens set and a first adhesive layer is provided. The lens set is disposed on the image capturing unit. The lens set has a light incident surface and a light emitting surface opposite to each other and has at least one side surface, the light emitting surface faces the image capturing unit, and the side surface is connected between the light incident surface and the light emitting surface. The first adhesive layer covers the side surface of the lens set. In addition, a manufacturing method of the image capturing module is also provided.