Abstract: An image capturing module includes a light filter, a meta-lens layer, and a photosensitive element. The light filter includes a light receiving surface and a light emitting surface opposite to each other. The meta-lens layer and the light filter are disposed side by side with each other. The meta-lens layer includes a light transmitting film and a plurality of microstructures. Each microstructure is arranged on the light transmitting film. The photosensitive element includes a photosensitive surface. The photosensitive surface faces to the meta-lens layer and the light emitting surface of the light filter, wherein the photosensitive surface has a plurality of pixels, and each pixel corresponds to each microstructure.

Abstract: A wide-angle camera comprises a spectroscopic module, a first imaging module, and a second imaging module. The spectroscopic module comprises a spectroscopic lens holder, a first optical prism, and a second optical prism. The first optical prism is disposed on a first sidewall of the spectroscopic lens holder. The second optical prism is disposed on a second sidewall of the spectroscopic lens holder. The first sidewall is opposite to the second sidewall. An external light is split into a first light and a second light correspondingly through the first optical prism and the second optical prism. The first imaging module corresponds to the first optical prism and receives the first light for generating a first image. The second imaging module corresponds to the second optical prism and receives the second light for generating a second image. The first image and the second image are synthesized into a wide-angle image.

Abstract: The present disclosure provides a camera module and an electronic device. The camera module comprises a bearing base, an image sensor, a baseplate, a lens bracket, and a lens group. The image sensor is disposed at the bearing base. The baseplate is disposed at the bearing base and is separated from the image sensor. The baseplate is disposed on the periphery of the image sensor. The baseplate is electrically connected with the image sensor. The lens bracket is disposed at the bearing base. The image sensor and a part of the baseplate are disposed in the lens bracket. The lens bracket comprises a photosensitive through hole. The image sensor corresponds to the photosensitive through hole. The lens group is disposed at the lens bracket and corresponds to the image sensor through the photosensitive through hole.

Abstract: A 3D sensing device configured to sense a to-be-detected object is provided. The 3D sensing device includes a lighting module and a sensing module. The lighting module includes a lighting element, an optical element group, and a drive circuit. The drive circuit is coupled to the lighting element and configured to light the first lighting region, or the second lighting region, or both the first lighting region and the second lighting region. The drive circuit can determine an optical power of the second lighting region. The lighting module selectively emits a diffused light, or a structured light, or both the diffused light and the structured light. The sensing module is adjacent to the lighting module and configured to sense the diffused light, or the structured light, or both the diffused light and the structured light reflected by the to-be-detected object.

Abstract: An imaging device includes a light emitter, an optical diffraction plate, a pair of wedge prisms, a rotation unit, a light receiver, and a processing unit. The light emitter emits a light beam. The optical diffraction plate is for converting the light beam into a plurality of diffracted light rays that forms a first light spot. The pair of wedge prisms is for adjusting an emission direction of the first light spot. The rotation unit is connected to the pair of wedge prisms and is for rotating the pair of wedge prisms relative to each other. The light receiver is for receiving a plurality of second light spots reflected from the plurality of first light spots. The processing unit is connected to the light receiver and is for generating a plurality of pieces of light spot information and processing the plurality of pieces of light spot information into image information.

Abstract: An image-capturing assembly includes a circuit board, an optical filter, an image-capturing element between the circuit board and the optical filter, and a holder. The holder includes a fixing portion. The image-capturing element is on the circuit board and electrically connected to the circuit board. The holder is on an external side of the image-capturing element. The fixing portion has an upper surface and a lower surface opposite to each other, and the lower surface is fixed on the circuit board. The optical filter is fixed on the upper surface of the fixing portion.

Abstract: A wide-angle camera comprises a spectroscopic module, a first imaging module, and a second imaging module. The spectroscopic module comprises a spectroscopic lens holder, a first optical lens, and a second optical lens. The first optical lens is disposed on a first sidewall of the spectroscopic lens holder. The second optical lens is disposed on a second sidewall of the spectroscopic lens holder. The first sidewall is opposite to the second sidewall. An external light is split into a first light and a second light correspondingly through the first optical lens and the second optical lens. The first imaging module corresponds to the first optical lens and receives the first light for generating a first image. The second imaging module corresponds to the second optical lens and receives the second light for generating a second image. The first image and the second image are synthesized into a wide-angle image.

Abstract: The present disclosure provides a time-of-flight camera, comprising a light-emitting module and a light-receiving module. The light-emitting module comprises a light source component, a light-reflecting component, and a light-diffusing component. The light source component emits a first light in a first direction. The light-reflecting component and the light-diffusing component are disposed on the light path of the first light. A second light formed by the first light passes through the light-reflecting component and the light-diffusing component. The second light travels toward a second direction to an object to be measured. The object to be measured reflects the second light. The first direction is intersecting with the second direction. The light-receiving module receives the reflected second light and performs the function of sensing.

Abstract: The present disclosure provides an embedding reinforced circuit board, a camera module, and an electronic device. The embedding reinforced circuit board, comprising a circuit board and a reinforcing plate. The circuit board comprises a first surface and a second surface opposite to the first surface. The first surface is provided with a component installation area. The second surface is provided with an accommodating groove. The width of at least one side of the cross-sectional area of the accommodating groove is wider than the width of the corresponding side of the component installation area. The cross-sectional area of the accommodating groove is parallel to the first surface or the second surface. The reinforcing plate is disposed in the accommodating groove.

Abstract: An image sensing device includes a sensing module and an invisible light transmitter. The sensing module includes pixel sets arranged on a substrate. The pixel set includes sub pixels, an invisible light sensor, and a focus adjustment member. The sub pixels and the invisible light sensor are arranged in an array. The sub pixel includes a visible light photo diode. The invisible light sensor includes an invisible light photo diode. The focus adjustment member is between the substrate and the visible light photo diode or the invisible light photo diode. The focus adjustment member makes a distance between the visible light photo diode and the substrate less than or greater than a distance between the invisible light photo diode and the substrate. The invisible light transmitter is disposed corresponding to the sensing module. The invisible light sensor is configured to sense invisible light transmitted by the invisible light transmitter.

Abstract: An image-capturing assembly and a manufacturing method for image-capturing element are provided. The image-capturing assembly includes an image-capturing element, an adhesive layer, and an optical sheet. The image-capturing element has an active area and a non-active area. The non-active area surrounds the active area. The adhesive layer includes a plurality of adhesive sublayers stacked sequentially. The adhesive layer is on the non-active area of the image-capturing element. The optical sheet is on the adhesive layer.

Abstract: A camera module including a lens holder, a lens barrel, a first lens set, a second lens set, and an image sensing device is provided. The lens holder includes a limiting portion. The lens barrel is disposed in the limiting portion. The image sensing device has a common optical axis, and enables the second lens set to be located between the first lens set and the image sensing device. A position of the lens barrel is adjustable in the limiting portion when assembling the camera module, and the lens barrel is disposed on the lens holder enabling the limiting portion to be located on a periphery of the lens barrel, and a gap is arranged between the limiting portion and the lens barrel such that the position of the lens barrel is adjustable along a direction perpendicular to the optical axis.