Abstract: Composition for use as catalyst in hydrosilylations, comprising at least one platinum compound selected from the group consisting of Pt[(Me2SiCH?CH2)2O]2 and Pt2[(Me2SiCH?CH2)2O]3 and at least one rhodium compound selected from the group consisting of Rh(acac)(CO)2, Rh2(CO)4Cl2, [Rh(cod)Cl]2, Rh(acac)(cod), RhH(CO)(PPh3)3, Rh(CO)(PPh3)(acac), RhCl(CO)(PPh3)2, and Rh-2-ethylhexanoate at a molar ratio of Pt/Rh in the range of 0.1 to 100.

Abstract: One aspect relates to a process for producing an electrical medical implant, comprising the following steps: a. providing an electrical feedthrough, which comprises a substrate, an electrical component, and a contact element; b. coating the electrical component with a layer.

Abstract: One aspect is an ablation system with a wire feed configured to feed a wire and a wire take-up configured to take-up the wire. A wire handling system is configured to advance the wire and to stop the wire between the wire feed and the wire take-up in a controlled manner. A laser ablation processor is located between the wire feed and the wire take-up, the laser ablation processor having at least one laser configured to ablate the wire when the wire is stopped. A clamp system is located between wire feed and the wire take-up and configured to clamp onto the wire when the wire is stopped.

Abstract: One aspect relates to a method of producing a sleeve for a ring electrode for electrophysiological and neuro-medical applications from a biocompatible metallic tape. Repetitive structures are punched into the tape and each includes at least one surface that is connected by at least one fin to at least one external strip. The at least one external strip connects the repetitive structures to each other on the margin. A sleeve mold is formed from a multiple of the repetitive structures through multiple reforming steps by a reforming technique. The sleeve mold is punched off the such that the sleeve is formed with a first tube-shaped region with a larger diameter and a second tube-shaped region with a smaller diameter. The first region with the larger diameter has a larger external diameter and internal diameter than the second region with the smaller diameter, and the two regions are connected.

Abstract: One aspect is a feedthrough system including a) a feedthrough including i) an insulating body, ii) an electrically conductive pathway, wherein an end of the electrically conductive pathway is level with a surface of the insulating body, iii) an electrically conductive pad, wherein the electrically conductive pad is attached to the level end of the electrically conductive pathway, b) an electrical contact element including a metal, wherein the electrical contact element is attached to the level end of the electrically conductive pathway by a joint microstructure, or wherein, when the feedthrough includes an electrically conductive pad, the electrical contact element is attached to the electrically conductive pad by a joint microstructure. Furthermore, the present embodiment refers to a process for preparing the inventive feedthrough system, and to a device including the inventive feedthrough system.

Abstract: A process for the treatment of acidic wastewater which comprises hydrochloric acid, nitric acid as an optional component, 0.1 to 30 wt.-% of one or more dissolved metals selected from the group consisting of aluminum and heavy metals other than precious metals, and 10 to 500 wt.

Abstract: One aspect relates to a method of manufacture of a composition, including providing a precursor formulation which includes at least silver chloride and an organic vehicle, wherein the precursor formulation includes agglomerates, and comminuting the precursor formulation, wherein the composition is obtained. One aspect further relates to a substrate which is at least partially coated with a coating including silver chloride, wherein the coating has an average size of agglomerates of 30 ?m or less, to an electrochemical sensor including at least one of these coated substrates and a use of the composition or a wire which is coated with the composition.

Abstract: One aspect is a method for producing a plurality of wire elements, including providing a metal wire, coating the metal wire with a first layer to obtain a first coated wire, subjecting the first coated wire to a first quality control process, marking any first defects identified in the first quality control process, coating the first coated wire with a further layer to obtain a further coated wire, and cutting the further coated wire to obtain a plurality of wire elements. Prior to cutting the further coated wire to obtain the plurality of wire elements, a first length of the first coated wire is less than 10% longer than a further length of the further coated wire.

Abstract: Process for the production of high purity iridium(III) chloride hydrate, comprising the steps of: (1) providing at least one material selected from the group consisting of solid H2[IrCl6] hydrate, aqueous, at least 1 wt. % H2[IrCl6] solution, and solid IrCl4 hydrate; (2) adding, to the at least one material provided in step (1), at least one monohydroxy compound selected from the group consisting of monohydroxy compounds that are miscible with water at any ratio, primary monoalcohols comprising 4 to 6 carbon atoms, and secondary monoalcohols comprising 4 to 6 carbon atoms at a molar ratio of Ir(IV):monohydroxy compound=1:0.6 to 1000, and allowing to react for 0.2 to 48 hours in a temperature range from 20 to 120° C., followed by removing volatile components from the reaction mixture thus formed.

Abstract: One aspect relates to an apparatus including a first frame, a further frame, a first element, a second element, and a third element. The first frame frames the further frame, the further frame frames the first element, and electrically insulates the first element and the first frame from each other. The first element is electrically conductive, the second element is electrically conductive, and the third element provides an electrically conductive connection between the first element and the second element, and has a porosity in the range of 0.001 to 0.4.

Abstract: A composition consisting essentially of (a) 1 to 30% by weight of a 1 to 90% by weight aqueous phosphoric acid and/or a hydrogen phosphate; (b) 1 to 40% by weight of a compound selected from the group of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95% by weight of a particulate filler selected from the group of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide, aluminium oxide; silicon oxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; (d) 1 to 10% by weight of an urea compound selected from the group consisting of imidazolidine-2-on, allantoin and imidazolidinyl urea; and (e) 0 to 15% by weight of a component differing from (a) to (d).

Abstract: A liquid composition. The liquid composition comprises (i) particles comprising a complex of a polythiophene and a polyanion, (ii) at least one tetraalkyl orthosilicate, (iii) at least one solvent, and (iv) gallic acid, at least one derivative of gallic acid or a mixture thereof. Also provided are a process for the preparation of a liquid composition, a liquid composition obtainable by such a process, a process for the preparation of a layered body, the layered body obtainable by such a process, a layered body and the use of a liquid composition.

Abstract: A method for producing a stable sandwich arrangement of two components with solder situated therebetween, comprising the steps: (1) providing two components, each having at least one contact surface, and a free solder preform, (2) producing a sandwich arrangement of the components and a solder preform arranged between them and thus not yet connected to them by bringing into contact (i) each one of the contact surfaces, (ii) each of the single contact surface of the components or (iii) one of the contact surfaces of one component and a single contact surface of the other component, with the contact surfaces of the free solder preform, and (3) hot-pressing the sandwich arrangement produced in step (2) so as to form the stable sandwich arrangement at a temperature being at 10 to 40% below the melting temperature of the solder metal of the solder preform, expressed in ° C.

Abstract: The disclosure relates to a method for manufacturing a biocompatible wire, a biocompatible wire comprising a biocompatible metallic material and a medical device comprising such wire. The method for manufacturing a biocompatible wire comprises providing a workpiece of a biocompatible metallic material, cold working the workpiece into a wire, and annealing the wire, wherein a cold work percentage is 97 to 99%, wherein the cold working is a drawing with a die reduction per pass ratio in a range of 6 to 40%, and wherein the annealing is done in a range of 850 to 1100° C.

Abstract: One aspect is a manufacturing method including providing at least a first electrically conductive wire with an electrical insulation and a second electrically conductive wire with an electrical insulation, providing a first and a second ring electrode surrounding the wires, electrically connecting the first ring electrode with the first wire and the second ring electrode with the second wire, bundling the ring electrodes and the wires by means of a first sheath surrounding the ring electrodes and the wires to obtain a first ring electrode component, providing a second ring electrode component, bundling the ring electrode components by means of a second sheath surrounding the ring electrode components, and partially removing the first and the second sheaths from the ring electrodes to expose ring electrode portions.

Abstract: One aspect relates to a method for producing a substrate plate for a large-area semiconductor element, particularly for a thyristor wafer or a diode. At least one first layer made from a first material, with a first coefficient of expansion, and at least one second layer made from a second material of low expandability, with a second coefficient of expansion, which is smaller than the first coefficient of expansion, are bonded to one another by means of a low-temperature sintering method at a bonding temperature of 150° C.-300° C. At least one first bonding layer made from a bonding material is formed between the first layer and the second layer and the bonding temperature substantially corresponds to the mounting temperature during the bonding of the substrate plate produced with at least one large-area semiconductor element.

Abstract: One aspect relates to a method for producing a circuit carrier for a semiconductor component. At least one first copper layer or one first copper-alloy layer with a first coefficient of expansion and at least one second layer made from a second material of low expandability with a second coefficient of expansion, which is smaller than the first coefficient of expansion, are bonded to one another by means of a low-temperature sintering method at a bonding temperature of 150° C. to 300° C.

Abstract: One aspect relates to a heat spreading plate having at least one cooling fin. The heat spreading plate includes at least a first layer and at least a second layer, and at least one surface portion bent out of a base surface of the second layer forms a cooling fin.

Abstract: One aspect relates to a method for producing a heat-spreading plate for a circuit carrier. At least one first layer made of a first material having a first coefficient of expansion and at least one second layer made of a second, low-stretch material having a second coefficient of expansion that is smaller than the first coefficient of expansion are bonded to each other at a bonding temperature of 150° C.-300° C. by means of a low-temperature sintering process. At least one bonding layer from a bonding material is formed between the first layer and the second layer and the bonding temperature essentially corresponding to the mounting temperature at which the produced heat spreading plate is connected to at least one circuit carrier.

Abstract: The invention relates to a metal paste, containing (A) 75 to 90% by weight of copper and/or silver particles that are provided with a coating containing at least one organic compound, (B) 5 to 20% by weight of an organic solvent, and (C) 2 to 20% by weight of at least one type of metal particles different from the particles of (A) and having an average particle size (d50) in the range of 0.2 to 10 ?m. The metal particles of component (C) are selected from the group consisting of molybdenum particles and nickel core-silver shell particles with a silver content of 10 to 90% by weight.