Patents Assigned to Heraeus Deutschland GmbH & Co. KG
  • Publication number: 20210187831
    Abstract: One aspect relates to a method for manufacturing a medical electrode, including providing an electrically insulating substrate material, on which a conductor track is arranged; applying a continuous metal layer, which at least partially covers the substrate material, and the conductor track, so that an electrically conducting connection is formed between the metal layer and the conductor track; and partially removing the metal layer to form an electrode segment, which has an electrically conducting connection to the conductor track.
    Type: Application
    Filed: December 17, 2020
    Publication date: June 24, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus JUNG, Murad ABU ASAL, Ulrich HAUSCH
  • Publication number: 20210177323
    Abstract: One aspect relates to a method for the manufacture of a medical electrode, including: (i) providing a substrate; (ii) applying a composition onto the substrate, wherein the composition comprises (a) a non-aqueous solvent and (b) an organic precious metal complex compound that is dissolved in the solvent; (iii) heating the composition and thereby forming a precious metal layer on the substrate, wherein the solubility of the organic precious metal complex compound in propylene glycol mono-propyl ether at 25° C. and 1013 hPa is at least 1 mass percent, or at least 2, 3, 4, 5 or 10 mass percent, in relation to the total mass of the composition.
    Type: Application
    Filed: December 10, 2020
    Publication date: June 17, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Stefan SCHIBLI, Robert SIEVI, David MEDER, Andreas REISINGER, Jens TRÖTZSCHEL, Anna ERMERT, Heiko SPECHT
  • Publication number: 20210162206
    Abstract: One aspect relates to a medical electrode, having a conductor, an insulation, which surrounds the conductor at least in some sections over its entire circumference, protrusions in the insulation, electrode segments arranged between the protrusions, and insulating areas arranged between the electrode segments, wherein the electrode segments have steps, wherein the steps engage with the insulating areas.
    Type: Application
    Filed: November 24, 2020
    Publication date: June 3, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus JUNG, Thorsten KAISER
  • Patent number: 11021406
    Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 ?m to 300 ?m.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 1, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Kai Herbst, Christian Muschelknautz
  • Patent number: 11021407
    Abstract: The invention relates to a copper/ceramic composite comprising—a ceramic substrate which contains aluminum oxide, —a coating which lies on the ceramic substrate and which is made of copper or a copper alloy, wherein the copper or the copper alloy has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Cu)=d50/darith; the aluminum oxide has a particle size number distribution with a median value d50, an arithmetic mean value darith, and a symmetry value S(Al2O3)=d50/darith; and S(Al2O3) and S(Cu) satisfy the following condition: 0.7?S(Al2O3)/S(Cu)?1.4.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: June 1, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Kai Herbst, Christian Muschelknautz, Alexander Rogg
  • Publication number: 20210125895
    Abstract: Described is a metal-insulator substrate, which provides a structuring of the metallization for direct cooling. Furthermore, a process for manufacturing this metal-insulator substrate is described.
    Type: Application
    Filed: July 11, 2019
    Publication date: April 29, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventor: Peter DIETRICH
  • Patent number: 10983615
    Abstract: The present invention relates to the production of a layer structure, comprising the following process steps: i) coating a substrate with a composition at least comprising silver nanowires and a solvent; ii) at least partial removal of the solvent, thereby obtaining a substrate that is coated with an electrically conductive layer, the electrically conductive layer at least comprising the silver nanowires; iii) bringing into contact selected areas of the electrically conductive layer with an etching composition, thereby reducing the conductivity of the electrically conductive layer in these selected areas, wherein the etching composition comprises an organic compound capable of releasing chlorine, bromine or iodine, a compound containing hypochloride, a compound containing hypo-bromide or a mixture of at least two of these compounds.
    Type: Grant
    Filed: August 7, 2018
    Date of Patent: April 20, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Wilfried Lovenich, Rüdiger Sauer, Udo Guntermann
  • Patent number: 10973420
    Abstract: The present invention relates, generally, to a component containing a composite of at least two layers that are connected to each other, in which the first layer comprises a hole and the second layer has a thickness in the range of 1 to 50 ?m. The first and second layers each contain at least one metal and compositions of the first and second layers are different. Further objects of the present invention include a method for producing a component containing at least two layers that are connected to each other and have the aforementioned features, a method for producing a component containing at least three layers that are connected to each other and have the aforementioned features, as well as a component that is obtained by one of the aforementioned methods and a device containing at least one of the aforementioned components for use in a living body.
    Type: Grant
    Filed: November 22, 2019
    Date of Patent: April 13, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Nicholas Baltos, Oliver Keitel, Lena Weber, Andreas Reisinger
  • Publication number: 20210096136
    Abstract: One aspect relates to a process for manufacturing an electrochemical sensor, including moving a metal wire from a wire feed unit to a wire pick-up unit, the moving wire passing at least one printer Pcond which is located in between the wire feed and wire pick-up units, and printing an ink which includes electrically conductive particles by the printer Pcond onto discrete arrays of an electrically insulating polymer coating which is present on the metal wire.
    Type: Application
    Filed: September 24, 2020
    Publication date: April 1, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Andreas Reisinger, Stefan Schibli, Heiko Specht, Jörg-Martin Gebert
  • Patent number: 10960498
    Abstract: A wire comprising a wire core with a surface, the wire core having a coating layer superimposed on its surface, wherein the wire core includes: (a) pure silver consisting of silver and further components; or (b) doped silver consisting of silver, at least one doping element, and further components; or (c) a silver alloy consisting of silver, palladium and further components; or (d) a silver alloy consisting of silver, palladium, gold, and further components; or (e) a doped silver alloy consisting of silver, palladium, gold, at least one doping element, and further components, wherein the individual amount of any further component is less than 30 wt.-ppm and the individual amount of any doping element is at least 30 wt.-ppm, and the coating layer is a single-layer of gold or palladium or a double-layer comprised of an inner layer of nickel or palladium and an adjacent outer layer of gold.
    Type: Grant
    Filed: September 16, 2016
    Date of Patent: March 30, 2021
    Assignees: HERAEUS MATERIALS SINGAPORE PTE., LTD., HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Il Tae Kang, Yong-Deok Tark, Mong Hyun Cho, Jong Su Kim, Hyun Seok Jung, Tae Yeop Kim, Xi Zhang, Murali Sarangapani
  • Publication number: 20210085956
    Abstract: One aspect relates to a method for the electrical connection of an electrode to a conductor to form an electrode-conductor composite, including (i) bringing an electrode and/or a conductor into contact with a metalliferous layer that includes a metal powder or a metalliferous suspension, or consists thereof, (ii) irradiating the metalliferous layer with a laser, and (iii) thus forming a coherent, electroconductive metal layer.
    Type: Application
    Filed: September 23, 2020
    Publication date: March 25, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus Jung, Katharina Musiol
  • Publication number: 20210087111
    Abstract: A composition consisting essentially of (a) 1 to 30% by weight of a 1 to 90% by weight aqueous phosphoric acid and/or a hydrogen phosphate; (b) 1 to 40% by weight of a compound selected from the group of oxides, hydroxides and oxide hydrates of magnesium, calcium, iron, zinc and copper; (c) 40 to 95% by weight of a particulate filler selected from the group of glass; mono-, oligo- and polyphosphates of magnesium, calcium, barium and aluminium; calcium sulphate; barium sulphate; simple and complex silicates; simple and complex aluminates; simple and complex titanates; simple and complex zirconates; zirconium dioxide; titanium dioxide, aluminium oxide; silicon oxide; silicon carbide; aluminium nitride; boron nitride and silicon nitride; (d) 1 to 10% by weight of an urea compound selected from the group consisting of imidazolidine-2-on, allantoin and imidazolidinyl urea; and (e) 0 to 15% by weight of a component differing from (a) to (d).
    Type: Application
    Filed: March 2, 2018
    Publication date: March 25, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus SCHEIBEL, Tamara DRASKOVIC
  • Patent number: 10941080
    Abstract: The invention relates to a copper-ceramic composite comprising: a ceramic substrate; and a copper or copper alloy coating on the ceramic substrate, the copper or copper alloy having grain sizes of 10 ?m to 300 ?m.
    Type: Grant
    Filed: February 16, 2017
    Date of Patent: March 9, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Kai Herbst, Christian Muschelknautz
  • Publication number: 20210068263
    Abstract: One aspect relates to a method of manufacture of an electronic assembly comprising at least these steps: providing a substrate having at least a first contact area; positioning a spot of a UV curable substance on the substrate; positioning an electrically conductive item on the substrate wherein the electrically conductive item is superimposed on the first contact area and on the spot of curable substance; exposing the UV curable substance to UV irradiation, wherein a mechanical connection between the electrically conductive item and substrate is formed; and optionally connecting the first contact area with the electrically conductive item. One aspect relates to an electronic assembly comprising a substrate with a contact area, a spot of a cured substance on the substrate and an electrically conductive item that is in electrically conductive connection with the first contact area and mechanically connected through the spot of cured substance to the substrate.
    Type: Application
    Filed: August 27, 2020
    Publication date: March 4, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Ilias Nikolaidis, Alexander Zimmermann, Thomas Lauinger
  • Patent number: 10933233
    Abstract: One aspect relates to a production method for a ring electrode, to a ring electrode, and to an electrode system. One method for the ring electrode includes providing an outer element, including an outer tube, providing a first inner element, including a first inner tube having a first core of a sacrificial material, providing a second inner element, including a second core of a sacrificial material, forming a composite tube by arranging the first inner element and the second inner element inside the outer element, the first inner element and the second inner element being arranged off-center with respect to one another, drawing the composite tube in a longitudinal direction of the composite tube, separating a composite tube disk from the composite tube, removing the sacrificial material of the first core, and removing the sacrificial material of the second core in order to obtain a contacting opening in the ring electrode.
    Type: Grant
    Filed: February 18, 2019
    Date of Patent: March 2, 2021
    Assignee: Heraeus Deutschland GmbH & Co. KG
    Inventors: Christiane Leitold, Oliver Keitel, Hoang-Minh Le, Jörg Krenzer
  • Publication number: 20210051803
    Abstract: A method for producing a sandwich arrangement consisting of a first component having a contact surface A, a second component having a contact surface D and a solder located between said contact surfaces A and D, wherein the solder is produced by melting a solder deposit that is arranged between the two components and connected at the contact surface A or D to one of the components, followed by cooling of the molten solder to below its solidification temperature, wherein the solder deposit is produced previously by melting a solder preform that is fixed to the relevant contact surface A or D by means of an applied fixing agent from a fixing agent composition, followed by cooling of the molten solder to below its solidification temperature, and wherein the solder deposit is arranged with its free contact surface facing the corresponding contact surface D or A of the as of yet unconnected component, wherein the fixing agent composition consists of 0 to 97 wt.
    Type: Application
    Filed: March 5, 2018
    Publication date: February 18, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Michael SCHÄFER, Nadja PELSHAW, Yvonne LÖWER, Anton-Zoran MiIRIC
  • Publication number: 20210038882
    Abstract: One aspect is a process for producing a segmented electrode, including providing a pipe made of metal having an outer side and an inner side, wherein the inner side of the pipe forms a hollow space. A support structure is arranged in the hollow space, so that the support structure mechanically stabilizes the pipe. Intermediate spaces are formed in the pipe, which define a plurality of segments in the pipe. An electrically insulating material is introduced into the intermediate spaces and thus forming electrically insulating areas, wherein a boundary layer is in each case defined between the segments and the areas. The pipe is cut so that several segmented ring-shaped electrodes are formed therefrom. The support structure is removed from the pipe.
    Type: Application
    Filed: August 4, 2020
    Publication date: February 11, 2021
    Applicant: Heraeus Deutschland GmbH & Co. KG
    Inventors: Markus Jung, Katharina Musiol
  • Patent number: 10913120
    Abstract: Process for the production of particulate ruthenium with a purity of ?99.99 wt. % and a specific surface area of 0.2-0.5 m2/g, comprising: (1) providing a hydrochloric solution prepared by dissolving RuO4 in hydrochloric acid and has a content of ruthenium in the form of dissolved ruthenium species of 15-22 wt. %; (2) providing an aqueous solution with an ammonium chloride content of 200-600 g/litre; (3) forming a reaction mixture by dosing the hydrochloric solution provided in step (1) to the aqueous solution provided in step (2) at a molar ratio of 1 mol ruthenium: 3-6 mol ammonium chloride, at a temperature of 55-90° C. over the course of 0.2-5 hours and while adjusting and maintaining a pH of ?0.6 to 0; (4) separating solid material formed during step (3) from the hydrochloric reaction mixture; and (5) calcinating the solid material separated in step (4) at an object temperature of 350-1,000° C.
    Type: Grant
    Filed: April 18, 2017
    Date of Patent: February 9, 2021
    Assignee: HERAEUS DEUTSCHLAND GMBH & CO. KG
    Inventors: Vasco Thiel, Marco Stemmler, Hermann Von Eiff, Christian Kraushaar, Jan Roder, Christoph Rohlich
  • Publication number: 20210030292
    Abstract: One aspect relates to a body, including at least one first polymer segment having a porosity p1 and an electrical conductivity c1, and at least one further polymer segment being in seamless contact with the at least one first polymer segment and having a porosity p2?p1 and an electrical conductivity c2?c1. One aspect also relates to a process for the preparation of a body, to a body obtainable by such a process, to the use of a body for electrophysical measurements or as a biosensor and to a therapeutic current delivery or current receiving system comprising the body.
    Type: Application
    Filed: September 24, 2020
    Publication date: February 4, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Robert Dittmer, Leonard Stoica, Jeffrey Hendricks
  • Publication number: 20210031306
    Abstract: One aspect is a device for processing a filament in a process stream, including at least one processing beam source, designed and arranged for emitting at least one processing beam which is suitable for processing a segment of the filament by interaction of the at least one processing beam with the segment of the filament, thereby obtaining a processed filament. The device includes a guide, including a filament feed which is arranged upstream of the at least one processing beam source, and is designed to feed the filament from a feed reel. The guide is designed and arranged to guide the filament so that during the processing the segment of the filament inclines an angle with a vertical axis in the range from 0 to 45°.
    Type: Application
    Filed: July 31, 2020
    Publication date: February 4, 2021
    Applicants: Heraeus Deutschland GmbH & Co. KG, Heraeus Medical Components LLC
    Inventors: Stefan Schibli, Michael Goettlicher, Paul Schuster, Joerg-Martin Gebert