Patents Assigned to Hewlett-Packard Development Company, L.P.
  • Publication number: 20240126882
    Abstract: An example storage medium includes instructions that, when executed, cause a processor of a computing device to encrypt a source file that has been identified as potentially malicious, place the encrypted file in a location accessible to a virtual machine, provide, to the virtual machine, information for decrypting the encrypted file, and cause the virtual machine to use the information to process the encrypted file.
    Type: Application
    Filed: March 11, 2021
    Publication date: April 18, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: James Edwin Garnett Wright, Ratnesh Kumar Pandey, David Jonathan Mansergh
  • Publication number: 20240123446
    Abstract: A microfluidic system may comprise a dispense head with multiple dispensers, each dispensing a different cell type, such as single pairs of individual target cells and individual sensor cells. Interaction between the cells may be observed based on, for example, fluorescence. Individual target cells may then be selected, based on observations, for use or for further investigation. As an example, target cells may be B-cells, and enhanced selection of B-cells aids more direct antibody discovery.
    Type: Application
    Filed: May 26, 2023
    Publication date: April 18, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Alexander Govyadinov, Viktor Shkolnikov
  • Publication number: 20240124740
    Abstract: A printable medium that comprises a base substrate with an image-side and a back-side. An ink-receiving layer comprising water and, at least, two polymeric networks with the first polymeric network being a polyurethane-based polymer and the second polymeric network being a reactive polyaziridine polymer is applied to the image-side of the fabric base substrate. Also described herein are a method for forming the printable medium and a printing method that includes ejecting an ink composition onto the print medium described herein.
    Type: Application
    Filed: January 22, 2021
    Publication date: April 18, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Xiaoqi ZHOU, Zhang-Lin ZHOU
  • Publication number: 20240123685
    Abstract: According to an example, a heating device comprises a plurality of light emitting arrays to emit a respective irradiance associated with a calibration profile and a power source electrically connected to the plurality of light emitting arrays, wherein the irradiances emitted by the plurality of light emitting arrays result in a substantially spatially uniform irradiance towards a target surface.
    Type: Application
    Filed: January 21, 2022
    Publication date: April 18, 2024
    Applicant: HEWLETT-PACKARD DEVELOPMENT COMPANY, L.P.
    Inventors: Arnau CODINA SABORIT, Daniel Pablo ROSENBLATT, Ferran ESQUIUS BERENGUERAS
  • Patent number: 11958239
    Abstract: Apparatus to produce a three-dimensional object and methods of producing a three-dimensional object are described. In some examples, a first fluid comprising a colorant and a second fluid comprising an absorber to absorb electromagnetic radiation are applied on a layer of particulate material. Application of the second fluid to the layer of particulate material is in dependence on an ability of the first fluid to absorb the electromagnetic radiation.
    Type: Grant
    Filed: July 30, 2015
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: David Ramirez Muela, Lihua Zhao, Alejandro Manuel De Pena
  • Patent number: 11958240
    Abstract: A multi-fluid kit for three-dimensional printing can include a fusing agent and a detailing agent. The fusing agent can include water and a radiation absorber. The radiation absorber absorbs radiation energy and converts the radiation energy to heat. The detailing agent includes a lipophilic phase discontinuously dispersed within an aqueous phase by a surfactant. The lipophilic phase includes an organosilane having a central silicon atom coupled to a C6 to C24 aliphatic or alicyclic hydrocarbon and multiple hydrolyzable groups. The organosilane is present in the detailing agent at from about 1 wt % to about 20 wt %.
    Type: Grant
    Filed: August 8, 2019
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Graciela Emma Negri Jimenez, Emre Hiro Discekici, Shannon Rueben Woodruff
  • Patent number: 11958293
    Abstract: In some examples, a fluid ejection die includes a plurality of nozzles arranged in a plurality of nozzle columns, the plurality of nozzle columns distributed across a width of the fluid ejection die in a staggered manner, wherein nozzles of each respective nozzle column of the plurality of nozzle columns are spaced apart along a length of the fluid ejection die, wherein the plurality of nozzle columns includes a first pair of neighboring nozzle columns that are spaced by a first distance across the width. The plurality of nozzle columns includes a second pair of neighboring nozzle columns that are spaced by a second distance across the width, the second distance being larger than the first distance.
    Type: Grant
    Filed: June 3, 2021
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Galen Cook, Garrett E Clark, Michael W Cumbie, James R Przybyla, Richard Seaver, Frank D Derryberry, Si-lam J Choy
  • Patent number: 11962985
    Abstract: A method for interrupt based pairing for wireless audio devices includes determining a colocation of a wireless audio device with a subsequent wireless audio device with one or more sensors. An interrupt is generated in response to determining the colocation. A pairing mode of the wireless audio device is enabled in response to the interrupt. The wireless audio device is paired with the subsequent wireless audio device.
    Type: Grant
    Filed: December 11, 2020
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P
    Inventors: Victoria Pires, Hua Zhao, Yu Zhang
  • Patent number: 11958261
    Abstract: Example shoe manufacturing methods and related computer readable medium for implementing a portion of said manufacturing methods are disclosed herein. In some examples, the method includes placing an upper member about an upper portion of a last, wherein the last is a form for the shoe. In addition, the method includes producing a lasting based on data relating to a foot of a user, and attaching the lasting to the upper member, wherein the lasting extends over a lower portion of the last. Further, the method includes molding a sole onto the lasting and the upper member, and removing the last from the upper member.
    Type: Grant
    Filed: July 20, 2018
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Edward Ponomarev, Matthew G. Lopez, Stephen George Miller
  • Patent number: 11958982
    Abstract: A materials kit for three-dimensional (3D) printing can include a powder bed material including electroactive polymer particles including electroactive polymer having a melting temperature from about 100° C. to about 250° C. and a fusing agent including a radiation absorber to selectively apply to the powder bed material.
    Type: Grant
    Filed: January 16, 2019
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: James William Stasiak, Garry Hinch, Stanley J. Kozmiski
  • Patent number: 11960241
    Abstract: A liquid electrophotographic ink composition is disclosed herein. One example of the liquid electrophotographic ink composition includes a resin, a liquid carrier, a pigment chosen from titanium oxide, and a spacer chosen from barium sulfate, calcium carbonate, clay, magnesium silicate and mixtures thereof, in an amount from 5 to 15 wt. % of the total solids of the composition. A method for making a liquid electrophotographic ink composition is also disclosed herein.
    Type: Grant
    Filed: April 30, 2019
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hanit Marom Tchaicheeyan, Albert Teishev, Adi Mann, Orel Yosef Mizrahi, Doron Gurovich, Vladislav Kaploun, Emad Masoud
  • Patent number: 11958109
    Abstract: An example three-dimensional (3D) printing kit includes a particulate build material, which includes from about 80 wt % to 100 wt % metal particles based on a total weight of the particulate build material. In some examples, the kit also includes a binder fluid, which includes water and a curable polyurethane adhesion promoter in an amount ranging from about 0.5 wt % to about 15 wt % based on a total weight of the binder fluid. The curable polyurethane adhesion promoter is formed from a polyisocyanate; an acrylate or methacrylate, the acrylate or methacrylate having at least one hydroxyl functional group and having an acrylate functional group or a methacrylate functional group; a carboxylic acid including one or two hydroxyl functional groups, an amount of the carboxylic acid ranging from 0 wt % to about 10 wt %; and a sulfonate or sulfonic acid having one or two hydroxyl functional groups or one or two amino functional groups.
    Type: Grant
    Filed: September 20, 2018
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventor: Tienteh Chen
  • Patent number: 11958110
    Abstract: In an example of a method for three-dimensional printing, a first amount of a binding agent is selectively applied, based on a 3D object model, to individual build material layers of a particulate build material including metal particles to forming an intermediate structure. The binding agent and/or a void-formation agent is selectively applied, based on the 3D object model, to at least one interior layer of the individual build material layers so that a total amount of the binding agent, the void-formation agent, or both the binding agent and the void-formation agent in the at least one of the individual build material layers is greater than the first amount. This patterns an area that is to contain voids. The intermediate structure is heated to form a 3D structure including a void-containing breakable connection.
    Type: Grant
    Filed: October 29, 2018
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Jason C. Hower, Mohammed S. Shaarawi, Vladek P. Kasperchik, James McKinnell, Jennifer L. Wu
  • Patent number: 11960329
    Abstract: An example computing device includes: a display housing including a first recess and a base including a second recess; and a hinge to rotate the display housing from a closed configuration to an open configuration, the hinge comprising: a central bar; a first link coupled to the central bar at a first pivot point, the first link rotatable about the first pivot point; and a second link coupled to the central bar at a second pivot point, the second link rotatable about the second pivot point; and wherein in response to the display housing rotating to the open configuration, a first sliding end of the first link is to retract into the first recess and a second sliding end of the second link is to retract into the second recess.
    Type: Grant
    Filed: November 17, 2019
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Hyunmin Moon, Jin Sang Hwang
  • Patent number: 11958306
    Abstract: In an example of the disclosure, a priming lane and a non-priming lane are identified within an image frame to be printed by a printer. A line of molten wax is applied to the roller. The molten wax when cooled is to form a wax ridge upon the roller. The roller having the formed wax ridge is wetted with the primer. The wetted roller is rotated against the substrate to apply the primer. A first width of the wetted roller that does not include the wax ridge forms the priming lane upon the substrate. A second width of the roller that includes the wax ridge causes the primer to not transfer and thereby forms the non-priming lane upon the substrate.
    Type: Grant
    Filed: September 30, 2019
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Chen Zigdon, Mirit Shitrit, Liora Braun
  • Patent number: 11960337
    Abstract: Example approaches for customization of thermal and power policies in computers, are described. In an example, a microcontroller of a computing system, also referred to as system, validates thermal policy custom data stored in a firmware storage medium of the system, in response to a supply of power to the system. On a successful validation of the thermal policy custom data, thermal control settings is updated with a customized thermal policy included in the thermal policy custom data. In response to initiation of a boot operation of the system, a processor of the system validates power policy custom data stored in the firmware storage medium. In response to a successful validation of the power policy custom data during the boot operation, the processor updates power control settings of the system with a customized power policy included in the power policy custom data.
    Type: Grant
    Filed: January 22, 2020
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Kang-Ning Feng, Yuan-Ti Chang, Reily Chang
  • Publication number: 20240121729
    Abstract: Examples of transmit power controls are described herein. In some examples, an electronic device includes an imaging capturing device to capture a video stream. In some examples, the electronic device includes video processing circuitry. In some examples, the video processing circuitry may measure background motion in the video stream. In some examples, the video processing circuitry may detect human proximity based on the measured background motion. In some examples, the video processing circuitry may control transmit power in response to the human proximity detection.
    Type: Application
    Filed: March 1, 2021
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Isaac Lagnado, I-Chen Lin
  • Publication number: 20240121358
    Abstract: In some examples, an electronic device includes a machine learning circuit to detect a user break from an online meeting based on a video stream. In some examples, the machine learning circuit is to send an indicator in response to detecting the user break. In some examples, the electronic device includes a processor coupled to the machine learning circuit. In some examples, the processor is to replace a portion of the video stream with substitute video in response to the indicator.
    Type: Application
    Filed: March 11, 2021
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Lan Wang, Qian Lin
  • Publication number: 20240116293
    Abstract: An integrated circuit includes a plurality of memory cells, an address decoder to select memory cells based on a data signal, activation logic to activate selected memory cells based on the data signal and a fire signal, and configuration logic to enable or disable access to the plurality of memory cells.
    Type: Application
    Filed: December 21, 2023
    Publication date: April 11, 2024
    Applicant: Hewlett-Packard Development Company, L.P.
    Inventors: Scott A. Linn, James Michael Gardner, Michael W. Cumbie
  • Patent number: D1022931
    Type: Grant
    Filed: August 2, 2021
    Date of Patent: April 16, 2024
    Assignee: Hewlett-Packard Development Company, L.P.
    Inventors: Vignesh Kannan, Joshua M. Yu, Matthew David Smith, Jeffrey A. Nielsen, Kenneth Duda