Abstract: There are provided a photosensitive resin composition which can be applied to either a projection exposure or direct-write exposure machine without fine adjustment of the composition, and can form a resist pattern having an excellent cross-sectional shape in which an undercut in which the bottom portion of the resist pattern is hollowed and omission of the top of the resist pattern are less likely to occur, and a line width of an intermediate portion (central portion) and a deepest portion (bottom portion) in the depth direction of the cross section of the resist pattern is less likely to be larger than a line width of the surface portion (that is, linearity in the depth direction of the resist pattern contour is favorable), and which has excellent insulation reliability and crack resistance reliability, and a dry film using the same, a printed wiring board, and a printed wiring board manufacturing method.
Abstract: A separator 100 is disposed between a positive electrode and a negative electrode in a lead acid storage battery including the positive electrode and the negative electrode, in which the separator 100 contains a glass fiber and an organic binder, the separator 100 includes a first layer 110a that is in contact with the positive electrode, and a second layer 110b that is in contact with the negative electrode, an average pore diameter of the first layer 110a is larger than an average pore diameter of the second layer 110b, and a thickness of the first layer 110a is equal to or less than the half of the overall thickness of the separator 100.
Abstract: A friction material composition imparts superior friction coefficient, abrasion resistance, aggressiveness against an opposite member, and brake noise preventive characteristics in high speed and high load braking to a friction material, although containing no copper, which can pollute rivers, lakes, the ocean, or other environments, or containing copper in an amount of at most 0.5 mass. Moreover, a friction material and a friction member each uses the friction material composition. The friction material composition includes a binder, an organic filler, an inorganic filler, and a fibrous base material, and the friction material composition contains copper in an amount of at most 0.5 mass % as an element or contains no copper. The binder contains silicone-rubber dispersed phenolic resin in an amount of 5 to 10 mass %. The inorganic filler contains zirconium oxide in an amount of 20 to 33 mass %.
Abstract: A charge transport polymer containing a structural unit having an N-aryl phenoxazine skeleton is produced, and is used as a charge transport material.
Abstract: An epoxy resin, comprising an epoxy compound having a mesogenic structure, the epoxy compound comprising a first epoxy compound having one biphenyl structure in a molecule and a second epoxy compound that is different from the first epoxy compound, at a mass ratio of the first epoxy compound to the second epoxy compound (first epoxy compound:second epoxy compound) of from 10:100 to 50:100.
Abstract: Method of forming a compact based on the press forming method provides a compact having high density and not having cracking or surface roughness in a product and without compact adhesion to press forming mold wall occurring, including steps: filling raw material powder in a cavity formed by an outer mold and lower punch, or outer mold and lower punch and core rod, pressing and forming raw material powder between an outer punch and lower punch, and extracting the compact obtained out of the outer mold by the lower punch, wherein a lubricating film of a press forming mold lubricant containing oil as main component is formed on at least part of outer mold inner surface, or outer mold inner surface and core rod outer circumferential surface before filling the raw material powder in the cavity, and press forming so that compact density ratio is not less than 93%.
Abstract: This negative electrode material for lithium ion secondary batteries has a C of 5.5 or less, C being a value obtained from a formula C=(pressure B?pressure A)/(1.70?1.35), where pressure A (kN/cm2) is defined as the pressure at which, when a 3.0 g specimen packed into a column space having a diameter of 15 mm is pressed down at a rate of 10 mm/min, a density of 1.35 g/cm3 is obtained, and pressure B (kN/cm2) is defined as the pressure at which a density of 1.70 g/cm3 is obtained.
Abstract: Provided is a method for manufacturing a silsesquioxane compound represented by general formula (III) shown below, the method having a step of reacting a compound represented by general formula (I) shown below and a compound represented by general formula (II) shown below. In general formulas (I) to (III): each of R1 and R2 independently represents a hydrogen atom, an alkyl group of 1 to 8 carbon atoms, an aryl group of 6 to 14 carbon atoms, an aminoalkyl group, an amino group-containing group, a nitrile group-containing group, a vinyl group-containing group, a (meth)acryloyl group-containing group, a chloro group-containing group, a bromo group-containing group, or a functional group containing a boron trifluoride-complexed amino group, each of R3 to R10 independently represents an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 14 carbon atoms, and M represents at least one element selected from the group consisting of hydrogen, lithium, sodium and potassium.
Abstract: The present invention relates to a friction member comprising a friction material and a back metal, wherein the friction material comprises no copper, or has a copper content of less than 0.5% by mass in terms of a copper element even if the friction material comprises copper, the friction material comprises magnesium oxide and a carbon material comprising graphite and coke, the carbon material is obtained by blending in a combination of a coarse-grained material and a fine-grained material, an average particle diameter of the coarse-grained material is 100 to 600 ?m, and an average particle diameter of the fine-grained material is less than 100 ?m.
Abstract: A silicon compound having a structural unit represented by general formula (I) shown below. In general formula (I), m represents an integer of 1 to 30, n represents a number that ensures a weight average molecular weight of 5,000 to 1,000,000, each of R1 to R4 independently represents an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 14 carbon atoms, each of R5 and R6 independently represents an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 14 carbon atoms, each of R7 to R10 independently represents an alkyl group of 1 to 8 carbon atoms or an aryl group of 6 to 14 carbon atoms, and in the n structural units, the combinations of m and R1 to R10 may be all the same, partially different, or all mutually different.
Abstract: Provided is an epoxy polymer which has a mesogen skeleton and a structural unit represented by Formula (A). In Formula (A), each R5 independently represents an alkyl group having from 1 to 8 carbon atoms, and n represents an integer of 0 to 3.
Abstract: A cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin having a smectic structure; a cured epoxy resin, which is a cured product of an epoxy compound having a mesogenic structure and a curing agent having a molecular chain or a flexible backbone with a molecular weight of 100 or more, the cured epoxy resin not having a smectic structure; an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a molecular chain with a molecular weight of 100 or more; and an epoxy resin composition, comprising an epoxy compound having a mesogenic structure and a curing agent having a flexible backbone with a molecular weight of 100 or more.
Abstract: A wavelength conversion member which contains a cured product of a curable composition that contains a quantum dot phosphor and a carboxylic acid having 1 to 17 carbon atoms.
Abstract: A wavelength conversion member which contains a quantum dot phosphor and is capable of converting incident light into green light and red light, and which is configured such that the half-value width of the green light emission spectrum (FWHM-G) and the half-value width of the red light emission spectrum (FWHM-R) satisfy the following condition A. Condition A: (FWHM-G)/(FWHM-R)?0.
Abstract: A negative electrode material for lithium ion secondary batteries has an oil absorption capacity of 50 ml/100 g or more, and a post-pressurization density of 1.70 g/cm3 or more.
Abstract: A wavelength conversion member which contains a quantum dot phosphor and is capable of converting incident light into green light and red light, and which is configured such that the half-value width of the green light emission spectrum (FWHM-G) is 30 nm or less.
Abstract: An aspect of the present invention is an anisotropic thermal conductive resin fiber including a stretch fiber of a thermoplastic resin; and a thermal insulation material covering the stretch fiber.
Abstract: An aspect of the present invention is an anisotropic thermal conductive resin member including a plurality of bundled thermoplastic resin stretch fibers.
Type:
Application
Filed:
February 27, 2019
Publication date:
December 31, 2020
Applicants:
HITACHI CHEMICAL COMPANY, LTD., THE UNIVERSITY OF TOKYO
Abstract: Disclosed is a semiconductor device manufacturing method, including a preparation step of preparing a laminated body in which a supporting member, a temporary fixation material layer that generates heat upon absorbing light, and a semiconductor member are laminated in this order, and a separation step of irradiating the temporary fixation material layer in the laminated body with incoherent light and thereby separating the semiconductor member from the supporting member.
Abstract: A polyamideimide resin composition containing a polyamideimide resin (A), 4-morpholine carbaldehyde (B), water (C), and a basic compound (D), wherein the change in viscosity of the composition from before storage to after storage at 60° C. for 7 days is within ?30%.