Abstract: Provided is a resin composition for forming a resin layer of a laminate by coating, the resin composition having a thixotropic index at 25° C. of from 3 to 10, and the laminate includes a pair of members and the resin layer arranged between the pair of members.

Abstract: Provided are an epoxy resin composition including hexagonal boron nitride particles having an aspect ratio of 2 or more, a liquid crystalline epoxy monomer, and a curing agent, and the epoxy resin composition being capable of forming a resin matrix having a smectic domain by reacting the liquid crystalline epoxy monomer with the curing agent, and a thermally-conductive material precursor, a B-stage sheet, a prepreg, a heat dissipation material, a laminate, a metal substrate, and a printed circuit board, which use the epoxy resin composition.

Abstract: Provided are: a friction member having a friction material that contains no copper or containing copper in an amount of less than 0.5% by mass in terms of a copper element and has good friction coefficient at normal braking, good abrasion resistance at high speed and high temperature braking, and high stability of the friction coefficient at low speed and low temperature braking; a friction material composition capable of providing the friction material; the friction material; and a vehicle equipped with the friction member or the friction material. The friction member is specifically a friction member having the friction material and a back metal, wherein the friction material contains no copper or contains copper in an amount of less than 0.5% by mass in terms of a copper element and contains zirconium silicate having an average particle size of 0.2 to 0.9 ?m.

Abstract: One aspect of the present invention relates to a resin composition comprising a curable resin and a curing agent, which is used for forming an inter-wiring layer insulating layer in contact with a copper wiring.

Abstract: Provided is a friction material composition including: a binder; an organic filler; an inorganic filler; and a fiber substrate, in which a content of copper as an element is 0.5% by mass or less, the friction material composition contains at least one of phlogopite or biotite in a total of from 3% by mass to 9% by mass, and a graphite in an amount of from 2% by mass to 6% by mass, as the inorganic fillers, the at least one of phlogopite or biotite has an average particle size of from 340 ?m to 1,500 ?m, and the graphite has an average particle size of from 450 ?m to 1,100 ?m.

Abstract: A cathode for a lithium ion secondary battery, including: a cathode current collector; a PTC layer including an electrically conductive particle, a polymer particle, and a water-soluble polymer, the PTC layer being provided on the cathode current collector; and a cathode active material layer provided on the PTC layer, as well as a lithium ion secondary battery using the same.

Abstract: A photosensitive resin composition includes (A) a binder polymer having a structural unit derived from a hydroxyalkyl (meth)acrylate ester having a hydroxyalkyl group having from 1 to 12 carbon atoms, and a structural unit derived from a (meth)acrylic acid; (B) a photopolymerizable compound having an ethylenically unsaturated bond group; (C) a photopolymerization initiator; and (D) a styryl pyridine represented by the Formula (1). In Formula (1), each of R1, R2 and R3 independently represents an alkyl group having from 1 to 20 carbon atoms, an alkoxy group having from 1 to 6 carbon atoms, an alkyl ester group having from 1 to 6 carbon atoms, an amino group, an alkyl amino group having from 1 to 20 carbon atoms, a carboxy group, a ciano group, a nitro group, an acetyl group or a (meth)acryloyl group, each of a, b and c independently represents an integer of from 0 to 5. In a case in which each of a, b and c is independently 2 or more, the plural R1s, R2s, and R3s independently may be the same or different.

Abstract: Disclosed is an organic electronic material comprising charge transporting compounds and ionic compounds having electron-accepting properties and high solubility in a solvent. The organic electronic material is characterized by comprising charge transporting compounds and ionic compounds, and in that at least one of the ionic compounds is any one kind of compounds represented by general formulas (1b)-(3b). (In the formulas Y1-Y6 each independently represent a divalent linking group, R1-R6 each independently represent an electron-attracting organic substituent (these structures can further have substituents and hetero-atoms, and R1, R2 and R3, or, R4-R6 can respectively combine and become a ring shape or a polymer shape) and L+ represents a monovalent cation.

Abstract: Provided is a joined body including: a first member; a second member; and a sintered metal layer that joins the first member and the second member. The sintered metal layer includes a structure that is derived from flake-shaped copper particles which are oriented in approximately parallel to an interface between the first member or the second member, and the sintered metal layer, and the amount of copper contained in the sintered metal layer is 65% by volume or greater on the basis of a volume of the sintered metal layer.

Abstract: The present invention pertains to an aerogel having a thermal conductivity of 0.03 W/m·K or less and a compressive elasticity modulus of 2 MPa or less at 25° C. under atmospheric pressure.

Abstract: The present invention relates to a resin composition for an interlayer, comprising a copolymer of a monomer mixture containing a (meth)acryloyl compound and a siloxane compound having an ethylenically unsaturated group wherein an ethylenically unsaturated group equivalent is 2000 to 20000 g/mol.

Abstract: The present invention relates to a production method for an aerogel laminate including a support, and an aerogel layer disposed on the support and having a thickness of 200 ?m or less, the method comprising a step of washing a wet gel laminate including the support and a wet gel layer disposed on the support by a roll-to-roll scheme.

Abstract: The polishing agent of the invention comprises water, an abrasive grain containing a hydroxide of a tetravalent metal element, polyalkylene glycol, and at least one cationic polymer selected from the group consisting of allylamine polymers, diallylamine polymers, vinylamine polymers and ethyleneimine polymers.

Abstract: A polishing liquid comprising an abrasive grain, an additive, and water, wherein the abrasive grain includes a hydroxide of a tetravalent metal element, produces absorbance of 1.00 or more and less than 1.50 for light having a wavelength of 400 nm in an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass %, and produces absorbance of 0.035 or more for light having a wavelength of 400 nm in a liquid phase obtained when centrifuging an aqueous dispersion having a content of the abrasive grain adjusted to 1.0 mass % for 50 minutes at a centrifugal acceleration of 1.59×105 G.

Abstract: The film for temporary fixing of the present invention is a film for temporary fixing which is used in a processing method of a semiconductor wafer, the method including a temporary fixing step of temporarily fixing the semiconductor wafer to a support via the film for temporary fixing, a processing step of processing the semiconductor wafer that is temporarily fixed to the support, and a separation step of separating the processed semiconductor wafer from the support and the film for temporary fixing, contains (A) a high molecular weight component and (B) a silicone-modified resin, and has a modulus of elasticity of from 0.1 to 1000 MPa at 23° C. after being heated for 30 minutes at 110° C. and for 1 hour at 170° C.

Abstract: Provided is a thermosetting resin composition containing a polyimide compound (A) having a structural unit derived from a maleimide compound (a1) having at least two N-substituted maleimide groups and a structural unit derived from a diamine compound (a2); a modified polybutadiene (B); and an inorganic filler (C).

Abstract: A two-part curable urethane-based composition comprising a main agent (A); and a curing agent (B), wherein the main agent (A) contains a urethane prepolymer (a), an isocyanurate modified product of a polyisocyanate compound (b), and a silane coupling agent (c) in a specified ratio, the curing agent (B) contains a polyol (d) having a hydroxyl value of 50 to 500 mgKOH/g and an amine catalyst (e) in a specified amount, a mixing mass ratio of the main agent (A) to the curing agent (B) is 3:1 to 10:1, and an equivalent ratio of NCO group/OH group in the main agent (A) and the curing agent (B), respectively, is 1.0 to 5.0.

Abstract: A carbon dioxide removal device 100 that include an adsorbent 1 and a reaction vessel 10 that have the adsorbent 1 installed therein, and that brings a gas to be treated containing carbon dioxide into contact with the adsorbent 1 and thereby removes carbon dioxide from the gas, in which the carbon dioxide removal device 100 further includes a water adjustment unit 20 that supplies water to the reaction vessel 10 and discharges water from the reaction vessel 10.

Abstract: A wavelength conversion material contains a cured product of a curable composition that contains a (meth)allyl compound, a (meth)acryl compound, a photopolymerization initiator, and a quantum dot phosphor.