Abstract: A microcomputer that is easy to use and connected direct to such memories as dynamic and static RAM's and to other peripheral circuits. The microcomputer has strobe signal output terminals CASH*, CASL* and RAS* for direct connection to a dynamic RAM, and chip select signal output terminals CS0* through CS6* for outputting a chip select signal in parallel with the output from the strobe signal output terminals. The microcomputer further includes address output terminals for outputting a non-multiplexed or multiplexed address signal as needed, and data I/O terminals for selectively outputting the address signal to comply with a multiple-bus interface scheme.

Abstract: A nonvolatile semiconductor memory recovers variation in the threshold of a memory cell due to disturbance related to a word line. The nonvolatile memory continuously performs many writing operations without carrying out single-sector erasing after each writing operation, performing the additional writing operations quicker than the usual writing operation, and lightening the burden imposed on software for use in additional writing. The data stored in a designated sector is read out before being saved in a register, and the selected sector is subjected to single-sector erasing when a predetermined command is given. Then write expected value data is formed from the saved data and data to be additionally written, completing the writing operation.

Abstract: A semiconductor memory having a redundancy circuit includes a judgment device for receiving outputs of first ROMs for storing a defective address therein and judging whether or not a defective memory cell and a spare memory cell to replace the defective memory cell belong to the same memory cell, and also includes a timing adjustment circuit for changing the timing of control signals applied to memory mat control circuits according to an output of the judgment device. When the defective and spare memory cells belong to the same memory mat, the timing of the control signals is made fast.

Abstract: In order to enable monitoring of a computer of a monitoring target, by two or more computers by way of a network, without increasing the load of the computer of monitoring target, the capturing process invoked on each node of the parallel computer captures performance data, the collecting process invoked on a specific node collects these captured performance data, and transmits to the relaying process on the monitoring computer. If there is a display process and a logging process invoked on the same or different monitoring computers, the relaying process distributes the performance data to them. The display process displays the performance data for part of measurement items included in the distributed performance data on the display device. The logging process stores all the distributed performance data in the storage device.

Abstract: In a nonvolatile semiconductor memory device wherein a plurality of threshold voltages are set so as to store multivalued information in one memory cell, data is first written into the memory cell whose threshold voltage is the lowest as a written state from the erase level, and data is successively written into memory cells whose threshold voltages are higher.

Abstract: A static RAM has plurality of memory mats each including a plurality of static memory cells formed in a matrix pattern at points of intersection between a plurality of word lines and a plurality of data lines. upon receipt of an address signal into an address register, an address selection circuit selects a memory cell in one of the memory mats, and connects the selected memory cell to a sense amplifier or a write amplifier furnished corresponding to the memory mat in question. At the same time, an address counter generates an address signal corresponding to the address signal by which one of the memory mats has been selected. When a burst mode is designated by a control signal, the address signal admitted to the address register is used to select a memory cell in a first memory mat. The selected memory cell is connected to the corresponding sense amplifier or write amplifier.

Abstract: A single-chip microcomputer comprising: a first bus having a central processing unit and a cache memory connected therewith; a second bus having a dynamic memory access control circuit and an external bus interface connected therewith; a break controller for connecting the first bus and the second bus selectively; a third bus having a peripheral module connected therewith and having a lower-speed bus cycle than the bus cycles of the first and second buses; and a bus state controller for effecting a data transfer and a synchronization between the second bus and the third bus. The single-chip microcomputer has the three divided internal buses to reduce the load capacity upon the signal transmission paths so that the signal transmission can be accomplished at a high speed. Moreover, the peripheral module required to have no operation speed is isolated so that the power dissipation can be reduced.

Abstract: A semiconductor memory device is provided which is able to supply data at high speed to a microprocessor (MPU) without being affected by the dispersion of power supply voltage, temperature and production process conditions. A semiconductor chip includes an address buffer, a decoder, a word driver, data lines, a sense amplifier, a main amplifier, an output buffer, and a PLL to which an external clock is applied. The PLL generates controls signals .PHI..sub.1 through .PHI..sub.7 with their phases shifted in turn, and supplies them to those internal circuits ranging from the address buffer to the output buffer. The PLL can control the phases of these control signals to be constant without being affected by the variations of temperature and power supply voltage. Thus, the internal circuits are precharged or equalized by the control signals, and then operated by the control signals to amplify data signal in turn.

Abstract: A method of manufacturing a semiconductor integrated circuit device includes the steps of constructing a plurality of lead frames having leads which each include an inner portion and an outer portion and electrically connecting a semiconductor chip to the inner portions of the leads of each frame. The lead frames are then stacked one above each other to form a vertical stack and plates are then inserted between each of the lead frames with each plate having an opening in the center whereby a central cavity is formed in the stack. The stack is then placed between a top mold member and a bottom mold member and a resin is injected into the central cavity whereupon the resin is cured to form a single resin package encapsulating the semiconductor chips. The resin package is then released from the mold members.

Abstract: A push-pull type output circuit is used in the differential amplifier of a voltage converter circuit. The threshold voltage of the driving transistor is set lower than the voltages of the transistors of the other circuits to operate the differential amplifier at a voltage higher than the power supply voltage. By using the push-pull type output circuit, the amplitude increases and it is possible to raise the capacity of the driving transistor. Moreover, by setting the threshold voltage of the driving transistor of the buffering circuit lower than the threshold voltages of the transistors of the other circuits, it is possible to further raise the driving capacity. Increase of the sub-threshold current due to lowering of the threshold voltage can be prevented by operating the differential amplifier at a voltage higher than the power supply voltage.

Abstract: In a dynamic RAM having a memory cell array in which a dynamic memory cell is arranged at an intersection between a word line and one of a pair of bit lines, a select level signal corresponding to a supply voltage and an unselect level signal corresponding to a negative potential lower than circuit ground potential are supplied to the word line. A signal of a memory cell read to the pair of bit lines by a sense amplifier that operates on the circuit ground potential and an internal voltage formed by dropping the supply voltage by an amount equivalent to the threshold voltage of the address select MOSFET is amplified. The dynamic RAM has an oscillator that receives the supply voltage and circuit ground potential and a circuit that receives an oscillation pulse generated by the oscillator to generate the negative potential.

Abstract: A method for making a semiconductor integrated circuit device comprises the steps of: (a) depositing a first underlying film made of titanium nitride, on an insulating film having a plurality of through-holes; (b) depositing a tungsten film on the first underlying film, and etching the tungsten film back by means of a fluorine-containing plasma thereby leaving the tungsten film only in the connection holes; (c) sputter etching the surface of the first underlying film to remove the fluorine from the surface of the first underlying film; and (d) forming an aluminium film on the first underlying film. The semiconductor integrated circuit device obtained by the method is also described.

Abstract: A batch erasable single chip nonvolatile memory device and a method therefor of using the same provided with memory cells which are adapted to execute an erase operation by ejecting an electric charge, accumulated at floating gates by a program operation (including a pre-write operation) carries out, in sequence a first operation for reading memory cells of an erase unit and carrying out a pre-write operation on those nonvolatile memory cells at the floating gates of which electric charge is not stored, a second operation for carrying out a batch erase operation at a high speed for the nonvolatile memory cells of said erase unit with a relatively large energy under a relatively large erase reference voltage, a third operation for carrying out a read operation of said all erased nonvolatile memory cells and a write operation on those nonvolatile memory cells which are adapted to have a relatively low threshold voltage, and a fourth operation for carrying out a batch erase operation at a low speed for the nonvo

Abstract: A control method and system when a flash memory is used as a semiconductor disk or a main memory in an information processing system. A semiconductor file system comprises a first nonvolatile memory electrically erasable, a second nonvolatile memory not electrically erasable, a volatile memory, a controller which controls the memories, and a control section which controls the controller wherein a physical address corresponding to a logical address specified from an external system is accessed. The first nonvolatile memory stores data for the external system to perform operations, first management information indicating the correspondence between physical addresses at which the data is stored and logical addresses, and second management information indicating a state of the first nonvolatile memory. The second nonvolatile memory previously stores interface information required for inputting and outputting the data from and to the external system and read-only data of the data.

Abstract: A sense amplifier, which is intended to reduce the output response time after it has received a small voltage difference until it delivers amplified output signals, consists of a latch circuit made up of a pair of CMOS inverters, a pair of NMOS transistors connected in parallel to the latch circuit, and a current source connected in series to the latch circuit and NMOS transistor pair. The NMOS transistors amplify a small voltage difference of input signals, and the inverters of the latch circuit further amplify the resulting voltage difference to produce the output signals. Based on is a small voltage difference of input signals being amplified in two stages and the amplifying circuit being of 2-stage serial connection of the current source and the NMOS transistor or CMOS inverter, the delay time of output response can be reduced.

Abstract: A single chip data processing apparatus having a central processing unit (CPU) and a flash memory constituted by electrically rewritable nonvolatile memory cells. The flash memory can be written with data under the control of the built-in CPU in an external write operation mode of the apparatus and, also, the CPU executes a data processing operation in accordance with a data processing program in a normal operation mode. In the external write operation mode, the CPU decodes a command by executing a command analyzing program so as to determine a process to be performed to the flash memory.

Abstract: Within an EEPROM having a memory array in which the electrically erasable nonvolatile storage elements are arranged in a matrix form, an erasing control circuit is included, which performs at least the read out operation one time on the corresponding memory cells after an erasing operation is performed in connection therewith in accordance with externally supplied erasing operation instructions. The erasing operation is automatically performed by the internal erasing control circuit while the EEPROM is electrically isolated from the microprocessor in response to instructions from the microprocessor. The control by the microprocessor requires only a slightly short period of time during which the erasing commencement is instructed while the EEPROM remains in the system during the erasing operation.

Abstract: In a parallel processor system comprising a plurality of processor elements constituting a network, a source processor element wishing to broadcast data to a plurality of destination processor elements sends a broadcast request message containing the target data to a broadcast exchanger. The broadcast exchanger converts the received message into a broadcast message and sends it over the network to the destinations. A plurality of broadcast request messages, if transmitted parallelly to the broadcast exchanger, are serialized thereby so that only one broadcast message will be transmitted at a time over the network. This prevents deadlock from occurring between different broadcast messages. The routes for transmitting broadcast request messages and those for transmitting broadcast messages are arranged so as not to overlap with one another. This suppresses deadlock between any broadcast request message and broadcast message. The broadcast exchanger is replaced alternatively with one of the partial networks.

Abstract: Two memory cells in different memory arrays are simultaneously selected in accordance with the designation of a specific write operation mode to associate a logic 1 of a write signal with a state in which an electric charge exists in each capacitor. Further, a logic 0 of the write signal is associated with a state in which no electric charge exists in the capacitor to write the same write signal. Two dynamic memory cells in different memory arrays are simultaneously selected in accordance with the designation of a specific read operation mode to associate a state in which an electric charge exists in a capacitor of each dynamic memory cell with a logic 1 of a read signal and associate a state in which no electric charge exists in the capacitor with a logic 0 of the read signal in response to a write operation. Thus, the logics 1 of the two read signals are preferentially output.

Abstract: In a semiconductor storage device wherein data lines connected to a plurality of memory cells selected by a select operation of word lines are sequentially selected by using an address signal generated by an address counter to serially read data in individual unit of at least one word line: redundancy data lines disposed perpendicular to the word lines are provided; a column select circuit receiving a Y address signal selects one of the data lines or redundancy data lines; a redundancy memory circuit stores, in the order of the selection operation by the column select circuit, a defect address signal of a defect data line among the data lines and a redundancy address signal of a corresponding redundancy data line; an address comparator circuit compares one defect address signal read from the redundancy memory circuit with an address signal generated by the address counter; an address signal for the redundancy memory circuit is generated by performing a count operation in response to a coincidence signal gener