Abstract: A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Abstract: Provided is a manufacturing method of a metal oxide semiconductor material for gas sensors by which an oxide precursor and noble metal colloid particles will not readily cohere in the manufacturing process. The manufacturing process implements a precursor solution synthesis step 1 of synthesizing an oxide precursor solution in which an oxide precursor is dispersed, a pH adjustment step 3 of adjusting the pH of the oxide precursor solution, a precursor-colloid dispersion preparation step 5 of preparing an oxide precursor-noble metal colloid dispersion in which the oxide precursor and the noble metal colloid are dispersed substantially uniformly, a purifying step 7 of purifying the oxide precursor-noble metal colloid dispersion to obtain a purified oxide precursor noble metal colloid dispersion, and a freeze-drying step 11 of freeze-drying an precipitate of the purified oxide precursor-noble metal colloid dispersion.

Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

Abstract: A waterproof push button switch does not need to be covered with a resin to a height at which a divided connected portion of a case for the switch is hidden by the resin in a height direction and the divided connected portion may be waterproofed. A gap (55, 57) is formed between a peripheral wall portion 7b of a base case 7 and a second cylindrical wall portion 9b of a cover case 9, and between an opposite surface 41 of the cover case 9 and a waterproofing seal member 11. The gap (55, 57) extends from an opening portion of the base case fitting chamber 37 to an annular watertight seal portion 51 to completely surround a periphery of the watertight seal portion 51. The thickness of the gap portion 55 is determined so that the resin entered into the gap portion 55 from an opening portion 37a of the base case fitting chamber 37 reaches the watertight seal portion 51 by surface tension.

Abstract: Provided herein are a display apparatus with a touch panel to which a piezoelectric actuator may readily be mounted, and a piezoelectric actuator used in such a display apparatus with a touch panel. A support structure for supporting a piezoelectric actuator 3 on a front surface of a circuit substrate 5 is constituted from a pair of electrically conductive support members 13A, 13B which are each formed of an electrically conductive foam. The piezoelectric actuator 3 may be mounted by locating the piezoelectric actuator 3 with the pair of electrically conductive support members 13A, 13B attached thereto in a predetermined position on the circuit substrate 5, and connecting the pair of electrically conductive support members 13A, 13B to the pair of output electrodes 5A, 5B of the circuit substrate 5.

Abstract: A surface mount variable resistor meets the needs of user for front and rear terminals of an insulating substrate. The surface mount variable resistor includes an insulating substrate 1 with a variable resistor pattern 3 and electrode patterns 5 formed thereon, resistor termination terminal fittings 7 connected to the electrode patterns 5, an electrically conductive slider 15 including a sliding contact 15c that slides on the variable resistor pattern 3, and an intermediate terminal 17 that includes a rear intermediate terminal fitting portion 17a and is electrically connected to the electrically conductive slider 15. The intermediate terminal 17 includes an extended conductor portion 17c and the rear intermediate terminal fitting portion 17a integrally formed with the extended conductor portion 17c. A front intermediate terminal fitting portion 17d located between the resistor termination terminal fittings 7 is integrally formed with the extended conductor portion 17c.

Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

Abstract: A biaxial angular velocity sensor provided herein has good detection sensitivity and allows an oscillator to be fixed stably. The biaxial angular velocity sensor includes an oscillator (3) made of a non-piezoelectric material, an electromechanical energy converting element (23) for driving and electromechanical energy converting element (25) for detection, both of which are provided in the oscillator (3), a plurality of drive electrodes (27) provided corresponding to the electromechanical energy converting element (23) for driving, and a plurality of detection electrodes (29) provided corresponding to the electromechanical energy converting element (25) for detection. The oscillator (3) includes a central portion (5) located in the center of the oscillator and eight first to eighth arm portions (7) to (21). The distal end portions of the fifth to eighth arm portions (15) to (21), located on the opposite side to the central portion (5), are fixed.

Abstract: A chip-like electric component such as a chip resistor is provided, which is easy to manufacture and in which cracks or fractures of an insulating substrate are unlikely to occur. A pair of surface electrodes 21, 23 are formed so that thicknesses of the pair of surface electrodes increase from a resistor layer 13 toward end portions 30 of an insulating substrate 29 in a direction in which the pair of surface electrodes 21, 23 are arranged. A plating reservoir S is formed between one of the surface electrodes 21, 23 and an insulating protective layer 15. When forming at least one plated layer 33, a plated metal pools in the plating reservoir S. The at least one plated layer 33 may work to reduce to some extent a height difference between a soldering electrode portion 21, 23, 27, 33 and the insulating protective layer 15.

Abstract: A connector device for interconnecting circuit substrates is obtained, in which a pitch for electrically conducting paths can easily be aligned with a pitch for electrodes on the side of circuit substrates. The connector includes a rectangular parallelepiped connecting element (9) and a connector housing (11). The rectangular parallelepiped connecting element (9) has a plurality of electrically conducting paths disposed on a rectangular parallelepiped insulating base thereof at an insulating interval and the connector housing (11) is mounted on a first circuit substrate (1) with the rectangular parallelepiped connecting element (9) received therein.

Abstract: The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B.

Abstract: A connector device for interconnecting circuit substrates is provided, in which no electric element for protection needs to be mounted separately on circuit substrates. A rectangular parallelepiped connecting element having an electrical component (9) is received in a connector housing (11). The rectangular parallelepiped connecting element having an electrical component (9) includes a plurality of first electrically conducting path portions (17a) and a plurality of second electrically conducting path portions (17b) disposed on a rectangular parallelepiped insulating base (13), and a plurality of electric elements (19) that are electrically connected in series with the plurality of first electrically conducting path portions (17a) and the plurality of second electrically conducting path portions (17b).

Abstract: A waterproof push button switch does not need to be covered with a resin to a height at which a divided connected portion of a case for the switch is hidden by the resin in a height direction and the divided connected portion may be waterproofed. A gap (55, 57) is formed between a peripheral wall portion 7b of a base case 7 and a second cylindrical wall portion 9b of a cover case 9, and between an opposite surface 41 of the cover case 9 and a waterproofing seal member 11. The gap (55, 57) extends from an opening portion of the base case fitting chamber 37 to an annular watertight seal portion 51 to completely surround a periphery of the watertight seal portion 51. The thickness of the gap portion 55 is determined so that the resin entered into the gap portion 55 from an opening portion 37a of the base case fitting chamber 37 reaches the watertight seal portion 51 by surface tension.

Abstract: A connector device for interconnecting circuit substrates is obtained, in which a pitch for electrically conducting paths can easily be aligned with a pitch for electrodes on the side of circuit substrates. The connector includes a rectangular parallelepiped connecting element (9) and a connector housing (11). The rectangular parallelepiped connecting element (9) has a plurality of electrically conducting paths disposed on a rectangular parallelepiped insulating base thereof at an insulating interval and the connector housing (11) is mounted on a first circuit substrate (1) with the rectangular parallelepiped connecting element (9) received therein.

Abstract: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7.

Abstract: A semiconductor sensor of which the thickness may be reduced and a method of manufacturing a sensor body for the semiconductor sensor are provided. A total length L1 of a weight portion 5 and an additional weight portion 3 as measured in an extending direction of a centerline C is determined to be shorter than a length L2 of a support portion 7 as measured in the extending direction of the centerline C. The weight portion 5 and the additional weight portion 3 are received within a space 15 defined, being surrounded by the support portion 7. Then, dimensions and shapes of the weight portion 5 and the additional weight portion 3 are determined to allow the weight portion 5 and the additional weight portion 3 to move within the space 15.

Abstract: A surface mount variable resistor meets the needs of user for front and rear terminals of an insulating substrate. The surface mount variable resistor includes an insulating substrate 1 with a variable resistor pattern 3 and electrode patterns 5 formed thereon, resistor termination terminal fittings 7 connected to the electrode patterns 5, an electrically conductive slider 15 including a sliding contact 15c that slides on the variable resistor pattern 3, and an intermediate terminal 17 that includes a rear intermediate terminal fitting portion 17a and is electrically connected to the electrically conductive slider 15. The intermediate terminal 17 includes an extended conductor portion 17c and the rear intermediate terminal fitting portion 17a integrally formed with the extended conductor portion 17c. A front intermediate terminal fitting portion 17d located between the resistor termination terminal fittings 7 is integrally formed with the extended conductor portion 17c.

Abstract: A connector device for interconnecting circuit substrates is provided, in which no electric element for protection needs to be mounted separately on circuit substrates. A rectangular parallelepiped connecting element having an electrical component (9) is received in a connector housing (11). The rectangular parallelepiped connecting element having an electrical component (9) includes a plurality of first electrically conducting path portions (17a) and a plurality of second electrically conducting path portions (17b) disposed on a rectangular parallelepiped insulating base (13), and a plurality of electric elements (19) that are electrically connected in series with the plurality of first electrically conducting path portions (17a) and the plurality of second electrically conducting path portions (17b).

Abstract: A terminal structure of a chip-like electric component capable of blocking entry of electromigration-causing factors through an insulating resin layer in the vicinity of the peak of a raised portion of an electrical element forming layer is obtained. A metal-glaze-based front electrode 103 containing silver is provided on a surface of an insulating ceramic substrate 101. A resistor layer 107 electrically connected to the front electrode 103 is provided on the substrate surface. A glass layer 109a is provided to completely cover a surface of the resistor layer 107 as well as a surface of an end portion of the resistor layer 107 and also to partially cover the front electrode 103. An insulating resin layer 109b is provided to cover a surface of the glass layer 109a as well as a surface of at least an end portion of the glass layer 109a and to partially cover the front electrode 103.