Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.

Abstract: A semiconductor force sensor capable of preventing a diaphragm part from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part, wherein a force transmitting device for applying a measured force to the diaphragm part of a semiconductor force sensor element is formed of a sphere having a rigidity, and a through hole passing through an opposed wall part toward the diaphragm is formed in the opposed wall parts at a position opposed to the center part of the diaphragm part so that a part of the sphere can face the outside of the opposed wall part and stores a part of the remaining part of the sphere to allow the sphere to be moved only in a direction orthogonal to the diaphragm part and rotated on the center part of the diaphragm part.

Abstract: A semiconductor sensor of the present invention is capable of preventing a diaphragm portion of the sensor from being damaged if a weight collides against a semiconductor integrated circuit substrate of the sensor and is further capable of preventing the diaphragm portion from being bent significantly even when a semiconductor sensor element of the sensor is disposed inside a distorted or deformed casing. A rear surface of the semiconductor integrated circuit substrate 7 is joined onto a wall surface of the casing 9 that defines a receiving chamber of the casing. A support portion of the semiconductor sensor element is joined onto a front surface 7a of the semiconductor integrated circuit substrate 7.

Abstract: A semiconductor force sensor capable of preventing a diaphragm part (37) from being broken and accurately measuring a force applied thereto in a direction orthogonal to the diaphragm part (37), wherein a force transmitting means for applying a measured force to the diaphragm part (37) of a semiconductor force sensor element (31) is formed of a sphere (33) having a rigidity, and a through hole (63) passing through an opposed wall part (55) toward the diaphragm (37) is formed in the opposed wall parts (55) at a position opposed to the center part of the diaphragm part (37) so that a part of the sphere (33) can face the outside of the opposed wall part (55) and stores a part of the remaining part of the sphere (33) to allow the sphere (33) to be moved only in a direction orthogonal to the diaphragm part (37) and rotated on the center part of the diaphragm part (37).

Abstract: The present invention provides a connector chip capable of preventing electrical shorting between adjoining electrodes and also capable of readily connecting a plurality of electrodes on a first circuit substrate and a plurality of electrodes on a second circuit substrate without using a dedicated mounting device or the like. A plurality of conductive paths 5 are formed on an outer periphery surface constituted by continuous four surfaces 9A to 9D of an insulating substrate 3 including six surfaces of the surfaces 9A to 9D and surfaces 9E and 9F. Each of the conductive paths 5 goes round on the outer periphery surface. The conductive paths 5 are formed on the outer periphery surface at a predetermined interval in an opposing direction in which the remaining two surfaces 9E and 9F are opposing to each other. Each of insulating layers 7 having a property of repelling molten solder is formed between portions of each two adjoining conductive paths located on a pair of the surfaces 9A and 9B.

Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.

Abstract: The present invention provides a semiconductor acceleration sensor wherein a semiconductor element is prevented from being damaged even when at least part of a weight is disposed in an internal space of a semiconductor sensor element and the mass of a weight is accordingly increased. An inner peripheral surface of a support portion 9 is constituted by four trapezoidal inclined surfaces 13 of a substantially identical shape which are annularly combined so as to define an outer peripheral surface of a frust-pyramidal space. A weight 3 is so constructed as to have an abutting portion including a linear portion 3d which abuts against the inclined surfaces 13 constituting the inner peripheral surface of the support portion 9 when the weight 3 makes a maximum displacement in a direction where a diaphragm portion 11 is located. The abutting portion 3d has a circular outline shape as seen from a side where a weight fixing portion 7 is located.

Abstract: An electric component capable of attaining connection of two kinds of connection conductors thereto and electrically connecting an electrode arranged on a front surface of a circuit board and a terminal fitment to each other without soldering. A terminal fitment (129) is integrally formed by subjecting a metal plate to machining. The terminal fitment 19 includes a first conductor holding section 129A, a second conductor holding section 129B and a contact terminal section 129C. The contact terminal section 129C is constructed to as to exhibit elastic or resilient force sufficient to force a contact portion 129s against the contact electrode E2 while being kept arranged between the first conductor holding section 129A and the front surface of the circuit board 102.

Abstract: An acceleration detecting device capable of permitting a weight, a diaphragm and a base to be precisely positioned on a casing of a measuring equipment or the like. The weight, diaphragm and base are integrally formed of a metal material into a single unit. An insulating casing is integrally formed while incorporating the single unit as an insert therein. The insulating casing has a recess defined by a side wall thereof, which is formed with a window for exposing a part of the base therethrough. The recess of the casing is closed with a metal cover member, which is mounted on the casing. The cover member is integrally provided with a contactor which is elastically forced against the base through the window. The base is electrically connected to ground terminals of terminal fitments.

Abstract: A piezoelectric acoustic device capable of permitting an increase in area or space of an operation face section of an electronic equipment required for arranging parts for the electronic equipment, attaining small-sizing of an electronic equipment and minimizing intrusion of water and dust into a front air chamber through a drum. The piezoelectric acoustic device includes a piezoelectric vibrator including a metal vibrating plate and a piezoelectric ceramic element joined to the metal vibrating plate, a casing including a front side wall and a rear side wall arranged on both sides of the piezoelectric vibrator so as to define a space therebetween in which the piezoelectric vibrator is received, and a drum arranged on an outside of the front side wall so as to extend in a direction across the front side wall. The piezoelectric vibrator and front side wall are arranged so as to define a chamber therebetween and the drum is formed therein with a passage in a manner to communicate with the chamber.

Abstract: A capacitance-type pressure sensor unit capable of being assembled without applying a pressure at an increased level to a circuit board. A connector body (6) has a base (6b) received in a peripheral wall section (13b) of a receiving casing (13) constituting a main body of the casing (13) and fixed to an end (13e) of the peripheral wall section (13b) by caulking. A pressure sensor element (3) constituted of a first insulating substrate (1) and a second insulating substrate (2) is arranged in a bottom wall section (13a) of the receiving casing (13) and a fluid chamber (15) into which pressure measured fluid is introduced is defined between a rear surface of the first insulating substrate (1) and the bottom wall section (13a).

Abstract: An electric component unit including a lead wire connection terminal fitment which is capable of being readily fixed on a terminal fitment mounting section of a casing and facilitating connection of a lead wire thereto is provided. A terminal fitment fit section of a terminal fitment mounting section of a casing is formed with a pair of terminal mounting fit grooves, in which a fitted section of a lead wire connection terminal fitment is fitted. The lead wire connection terminal fitment is made of a metal sheet of 0.7 mm in thickness by machining. A terminal section of the terminal fitment is formed into a width equal to or above a thickness of the metal sheet. The lead wire connection terminal fitment also includes a lead wire connection section, which is provided with a lead wire insertion opening which permits a core of a lead wire to be inserted therethrough and a lead wire press-fit groove in which the core of the lead wire displaced from the lead wire insertion opening is press-fitted.

Abstract: A piezoelectric acoustic device capable of keeping a substantial diameter of a metal vibrating plate from being reduced and preventing clogging of a damping cloth member. The piezoelectric acoustic device includes a piezoelectric vibrator including a metal vibrating plate and a piezoelectric ceramic element joined to the metal vibrating plate. The piezoelectric vibrator is arranged in a casing which is formed on an inner peripheral surface thereof with an inclined joint surface section of an annular shape which surrounds an outer peripheral portion of the metal vibrating plate. The piezoelectric acoustic device also includes a pressure-sensitive adhesive layer formed by coating a pressure-sensitive adhesive on the inclined joint surface section. The outer peripheral portion of the metal vibrating plate is joined through the pressure-sensitive adhesive layer to the inclined joint surface section.

Abstract: A lead wire connection terminal fitment capable of permitting a plurality of lead wires to be readily press-fitted in a single lead wire press fit groove. The terminal fitment may be in the form of a relay terminal fitment, which includes a metal plate formed with a lead wire press fit groove by machining in which lead wires are press-fitted. A pair of inner surfaces of the metal plate defining the lead wire press fit groove therebetween are formed thereon with a plurality of projections and recesses engaged with an outer periphery of lead wires. The projections biting into the lead wires are so arranged that a space defined between the projections opposite to each other is reduced in width at a position thereof spaced by a distance in a depth direction of the lead wire press fit groove, resulting in being divided into a first space portion increased in width and a second space portion decreased in width.

Abstract: An acceleration sensor capable of restraining a reduction in output thereof due to an electrostatic capacity between acceleration detecting electrodes and output electrodes. A low-dielectric layer is arranged between a connection line and a piezoelectric ceramic substrate. Another low-dielectric layer is arranged between additional connection lines and output electrodes, and the substrate. The low-dielectric layers are formed of a material substantially reduced in relative dielectric constant as compared with the substrate. The low-dielectric layers reduce an electrostatic capacity generated between wiring patterns and the output electrodes, and a counter electrode pattern, to thereby reduce the amount of spontaneous polarization charges accumulated in the electrostatic capacity.

Abstract: An organic EL device capable of providing an image plane which exhibits increased luminance or brightness while eliminating any difference in luminescence between luminous sections. An electrically insulating layer is arranged so as to cover both a first wiring pattern and a second wiring pattern and formed with a plurality of hole arrays in a manner to respectively correspond to first electrodes. The hole arrays each are constituted of a plurality of holes arranged along the first electrode corresponding thereto and so as to extend through an insulating layer to the first electrode while being kept from extending through second electrodes. A third wiring pattern is arranged which is constituted of a plurality of conductive paths each arranged on the insulating layer so as to be in alignment with each of the hole arrays and electrically connected to each of the first electrodes through connection conductive sections formed in the holes of the hole array corresponding thereto.

Abstract: An electric component unit capable of keeping an operator from feeling a difference in force required for inserting a connection conductor into an electric component unit during insertion of plural connection conductors different in diameter. A terminal fitment includes a conductor holding section provided with four holding elements. Two of the holding elements are so arranged that distal portions thereof are opposite to each other with an end of the connection conductor being interposed therebetween and contacted with the end of the connection conductor. The remaining two of the holding elements are so arranged that distal portions thereof are positioned forwardly or rearwardly in a longitudinal direction of the connection conductor based on a position at which the two holding elements are contacted with the end of the connection conductor while being contacted with the end of the connection conductor and interposing the end of the connection conductor therebetween.

Abstract: A capacitance-type pressure sensor capable of reducing a variation in reference capacitance. The capacitance-type pressure sensor includes insulating spacer (3b) arranged between a main capacitive electrode (4) and a reference capacitive electrode (5) to couple a base substrate (1) and a diaphragm substrate (2) to each other. The insulating spacer (3b) is patterned so as to restrain a variation in distance between the reference capacitive electrode (5) and a counter electrode (10) arranged on the diaphragm substrate (2). Such construction reduces a variation in capacitance between the reference capacitive electrode (5) and the diaphragm electrode (10), to thereby increase accuracy at which a pressure is measured.

Abstract: Pressure sensitive layers are disposed on respective resin films through electrodes to face each other, and include high conductivity flaky carbon particles and low conductivity amorphous-based carbon particles. The two kinds of carbon particles are bound together by a resin-system binder. Accordingly, when a pushing force is applied to the resin films, an average distance between the carbon particles is decreased to cause a tunnel conduction phenomenon, resulting in a decrease in conductive resistance between the electrodes. As a result, a pressure sensing property can be made gentle.

Abstract: An electric component with a soldering-less terminal fitment capable of preventing a contact portion of the terminal fitment from being detached from an electrode on a surface of a circuit board due to slippage thereof on the circuit board. A terminal fitment arranged between a circuit board and an insulating casing includes a connection conductor holding section and a contact terminal section having a proximal portion formed integrally with the connection conductor holding section. The contact terminal section includes a contact portion, which is pressedly contacted with an electrode on the circuit board by elasticity. The contact terminal section includes a curved portion which is curved in a manner to be projected in a direction of insertion of a connection conductor through the terminal fitment and provided on a distal end thereof with the contact portion. The contact portion is constituted by a biting element.