Patents Assigned to Innovative Micro Technology
-
Publication number: 20190173153Abstract: Systems and methods for forming a mm wave resonant filter include a lithographically fabricated high Q resonant structure. The resonant structure may include a plurality of cavities, each cavity having a characteristic frequency that defines its passband. A filter may include a plurality of resonant structures, and each resonant structure may include a plurality of cavities. These cavities and filters may be fabricated lithographically.Type: ApplicationFiled: January 29, 2019Publication date: June 6, 2019Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Patent number: 10302871Abstract: Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.Type: GrantFiled: May 8, 2018Date of Patent: May 28, 2019Assignee: Innovative Micro TechnologyInventor: Christopher S. Gudeman
-
Publication number: 20190137611Abstract: We describe here a scanning optical beam that is comprised of no moving parts The device includes a plurality of microfabricated beam shaping elements disposed in an array wherein each microfabricated beam shaping element is registered with a microfabricated light source but has an optical axis that is offset from the optical axis of the light source by a different amount, wherein the amount is a function of the distance from a center of the arrays. A method of operating the scanning optical beam is also described.Type: ApplicationFiled: October 19, 2018Publication date: May 9, 2019Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Publication number: 20190064060Abstract: Systems and methods for forming a compact gas sensor include a multilayer etalon as a wavelength discriminating element. The position of the etalon may be adjusted to tune its transmission profile. And embodiment directed to carbon dioxide detection is described.Type: ApplicationFiled: August 20, 2018Publication date: February 28, 2019Applicant: Innovative Micro TechnologyInventors: Christopher S. GUDEMAN, Jaquelin K. SPONG
-
Publication number: 20190064061Abstract: Systems and methods for forming a compact gas sensor include using a lithographically fabricated, reflective and lengthy gas channel formed in at least two substrate to make a relatively long gas channel. A VCSEL radiation source may be coupled to the channel and a photodiode detector to measure the transmitted light.Type: ApplicationFiled: August 20, 2018Publication date: February 28, 2019Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Publication number: 20190066937Abstract: Systems and methods for forming a magnetostatic MEMS switch include forming a movable beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. A shunt bar on the movable plate may close the switch when lowered onto the contacts. The switch may generally be closed, with the shunt bar resting on the contacts. However, a magnetically permeable material may also be inlaid into the movable plate. The switch may then be opened by placing either a permanent magnet or an electromagnet in proximity to the switch.Type: ApplicationFiled: August 17, 2018Publication date: February 28, 2019Applicant: Innovative Micro TechnologyInventors: Christopher S. GUDEMAN, Marin SIGURDSON
-
Publication number: 20190068120Abstract: Systems and methods for forming a compact gas sensor include using a lithographically fabricated high Q resonator coupled to at least one of a Gunn diode and an IMPATT diode. The resonator may include a plurality of cavities filled with a sample gas. A detector coupled to the resonator may measure the amplitude of the emitted mm wave radiation.Type: ApplicationFiled: August 17, 2018Publication date: February 28, 2019Applicant: Innovative Micro TechnologyInventors: Christopher S. GUDEMAN, Abbaspour Tamijani
-
Publication number: 20180335575Abstract: Described here is a platform for supporting a fiber optic cable. The platform may be made on a silicon wafer using silicon lithographic processing techniques. The platform may include a substrate having a top planar surface; a trench formed in the substrate in the top planar surface and dimensioned to accept a fiber optic cable carrying radiation; and a reflecting surface formed in the top planar surface, wherein this reflecting surface is configured to reflect the radiation by total internal reflection, wherein the reflecting surface is configured to direct radiation travelling in a first direction into a second direction, substantially orthogonal to the first direction.Type: ApplicationFiled: May 8, 2018Publication date: November 22, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Publication number: 20180294891Abstract: A transceiver and interconnect for connecting a plurality of optical cables. In one embodiment, optical sources are joined to a plurality of fiber optic output cables. The structures may use a plurality of ball lenses to collimate the diverging light from the source and launch it down one of the plurality of fibers. Through holes in a silicon substrate may allow the radiation to pass, and these features may be made very precisely.Type: ApplicationFiled: March 23, 2018Publication date: October 11, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Patent number: 10050409Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.Type: GrantFiled: February 12, 2018Date of Patent: August 14, 2018Assignee: Innovative Micro TechnologyInventor: Christopher S. Gudeman
-
Patent number: 10017381Abstract: A microfabricated pressure transducer is formed in a multilayer substrate by etching a plurality of shallow and deep wells into the layers, and then joining these wells with voids formed by anisotropic etching. The voids define a flexible membrane over the substrate which deforms when a force is applied.Type: GrantFiled: April 3, 2017Date of Patent: July 10, 2018Assignee: Innovative Micro TechnologyInventor: Benedikt Zeyen
-
Patent number: 10011478Abstract: A method for bonding two substrates is described, comprising providing a first and a second silicon substrate, providing a raised feature on at least one of the first and the second silicon substrate, forming a layer of gold on the first and the second silicon substrates, and pressing the first substrate against the second substrate, to form a thermocompression bond around the raised feature. The high initial pressure caused by the raised feature on the opposing surface provides for a hermetic bond without fracture of the raised feature, while the complete embedding of the raised feature into the opposing surface allows for the two bonding planes to come into contact. This large contact area provides for high strength.Type: GrantFiled: June 27, 2017Date of Patent: July 3, 2018Assignee: Innovative Micro TechnologyInventors: Christopher S. Gudeman, Paul J. Rubel
-
Publication number: 20180180829Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. An optical source may be attached to a carrier substrate with the TOSA by a flexible connector, in order to align the optical source before affixing it permanently.Type: ApplicationFiled: February 23, 2018Publication date: June 28, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Publication number: 20180166850Abstract: A microfabricated optical apparatus that includes a light source driven by a waveform, wherein the waveform is delivered to the light source by at least one through silicon via. The microfabricated optical apparatus may also include a light-sensitive receiver which generates an electrical signal in response to an optical signal. The electrical signal may be communicated to external devices by at least one additional through silicon via, and the signals routed to the encapsulated devices by metal traces. The vias may couple a ground plane to a metal trace layer at intervals, effectively quashing the ability of the bondline to interfere with the absorbed or radiated signal frequency.Type: ApplicationFiled: February 12, 2018Publication date: June 14, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Publication number: 20180155184Abstract: We describe here a method that employs through substrate vias (TSVs) to frustrate the standing waves that are formed in the metal trace. TSVs may be formed at intervals in the first substrate, electrically coupling the metal bondline to the ground plane.Type: ApplicationFiled: December 5, 2017Publication date: June 7, 2018Applicant: Innovative Micro TechnologyInventors: Christopher S. GUDEMAN, Marin SIGURDSON
-
Publication number: 20180124913Abstract: We describe below a structure and process that uses through-silicon-vias and wafer-to-wafer bonding to create transmission lines. The method may require one electroplating step, 3 etch steps, 4 lithography steps, one grind and polish step, and one wafer bonding step, totaling ten process steps per transmission line layer.Type: ApplicationFiled: November 1, 2017Publication date: May 3, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN
-
Patent number: 9950923Abstract: Described herein is a method and structure for fabricating vias in a semiconductor substrate. The semiconductor substrate is first doped to make it mildly conducting, via holes are formed therein, and a conductive material is deposited in the holes. Using the moderate conductivity of the substrate, the conductive material may be plated into the holes.Type: GrantFiled: April 11, 2017Date of Patent: April 24, 2018Assignee: Innovative Micro TechnologyInventors: Christopher S. Gudeman, Jeffery F. Summers
-
Patent number: 9953787Abstract: Systems and methods for forming an electrostatic MEMS switch include forming a movable cantilevered beam on a first substrate, forming the electrical contacts on a second substrate, and coupling the two substrates using a hermetic seal. Electrical access to the electrostatic MEMS switch may be made by forming vias through the thickness of the second substrate. The cantilevered beam may be formed by etching the perimeter shape in the device layer of an SOI substrate. An additional void may be formed in the movable beam such that it bends about an additional hinge line as a result of the additional void. This may give the beam and switch advantageous kinematic characteristics.Type: GrantFiled: March 4, 2016Date of Patent: April 24, 2018Assignee: Innovative Micro TechnologyInventors: Christopher S. Gudeman, Paul J. Rubel, Marin Sigurdson
-
Publication number: 20180079640Abstract: Systems and methods for forming an electrostatic MEMS switch that is used to switch a source of current or voltage. At least one surface of the MEMS switch may be rotated on approach to another substrate, such that when the surfaces are separated, the forces are shearing forces rather than static frictional forces.Type: ApplicationFiled: September 11, 2017Publication date: March 22, 2018Applicant: Innovative Micro TechnologyInventors: Christopher S. GUDEMAN, Marin Sigurdson
-
Publication number: 20180075994Abstract: Systems and methods for forming an electrostatic MEMS switch that is used to hot switch a source of current or voltage. At least one surface of the MEMS switch is treated with an ion milling machine to reduce surface roughness to less than about 10 nm rms.Type: ApplicationFiled: September 8, 2017Publication date: March 15, 2018Applicant: Innovative Micro TechnologyInventor: Christopher S. GUDEMAN