Patents Assigned to Inphi Corporation
  • Patent number: 10637512
    Abstract: The present invention is directed to data communication. More specifically, an embodiment of the present invention provides an error correction system. Input data signals are processed by a feedforward equalization module and a decision feedback back equalization module. Decisions generated by the decision feedback equalization module are processed by an error detection module, which determines error events associated with the decisions. The error detection module implements a reduced state trellis path. There are other embodiments as well.
    Type: Grant
    Filed: July 18, 2019
    Date of Patent: April 28, 2020
    Assignee: INPHI CORPORATION
    Inventors: Jamal Riani, Farshid Rafiee Rad, Benjamin P. Smith, Yu Liao, Sudeep Bhoja
  • Patent number: 10627574
    Abstract: The present application discloses a Transverse Electric (TE) polarizer. The TE polarizer includes a semiconductor substrate having an oxide layer. The TE polarizer further includes a waveguide embedded in the oxide layer. Additionally, the TE polarizer includes a plate structure embedded in the oxide layer substantially in parallel to the waveguide with a gap distance. In an embodiment, the plate structure induces an extra transmission loss to a Transverse Magnetic (TM) mode in a light wave traveling through the waveguide.
    Type: Grant
    Filed: April 19, 2019
    Date of Patent: April 21, 2020
    Assignee: INPHI CORPORATION
    Inventors: Jie Lin, Masaki Kato
  • Patent number: 10630414
    Abstract: An integrated apparatus with optical/electrical interfaces and protocol converter on a single silicon substrate. The apparatus includes an optical module comprising one or more modulators respectively coupled with one or more laser devices for producing a first optical signal to an optical interface and one or more photodetectors for detecting a second optical signal from the optical interface to generate a current signal. Additionally, the apparatus includes a transmit lane module coupled between the optical module and an electrical interface to receive a first electric signal from the electrical interface and provide a framing protocol for driving the one or more modulators. Furthermore, the apparatus includes a receive lane module coupled between the optical module and the electrical interface to process the current signal to send a second electric signal to the electrical interface.
    Type: Grant
    Filed: June 4, 2019
    Date of Patent: April 21, 2020
    Assignee: INPHI CORPORATION
    Inventor: Radhakrishnan L. Nagarajan
  • Patent number: 10622955
    Abstract: The present invention is directed to electrical circuits and techniques thereof. In various embodiments, the present invention provides a variable gain amplifier architecture that includes a continuous-time linear equalizer (CTLE) section and a variable gain amplifier (VGA) section. The CTLE section provides both a pair of equalized data signals and a common mode voltage. A DAC generates a control signal based on a control code. The VGA section amplifies the pair of equalized data signals by an amplification factor using a transistor whose resistance value is based on both the common mode voltage and the control signal. There are other embodiments as well.
    Type: Grant
    Filed: March 6, 2019
    Date of Patent: April 14, 2020
    Assignee: INPHI CORPORATION
    Inventors: Simon Forey, Rajasekhar Nagulapalli, Parmanand Mishra
  • Patent number: 10615567
    Abstract: A package structure of a directly modulated laser in a photonics module includes a thermoelectric cooler including multiple conductor traces formed in a cool surface. The package structure further includes a directly modulated laser (DML) chip having a first electrode being attached with the cool surface and a second electrode at a distance away from the cool surface. Additionally, the package structure includes an interposer having a plurality of through-holes formed between a first surface to a second surface. The first surface is mounted to the cool surface such that each through-hole is aligned with one of the multiple conductor traces and the second surface being leveled with the second electrode. Moreover, the package structure includes a driver disposed on the second surface of the interposer with at least a galvanically coupled output port coupled directly to the second electrode of the DML chip.
    Type: Grant
    Filed: February 14, 2018
    Date of Patent: April 7, 2020
    Assignee: INPHI CORPORATION
    Inventors: Frank Gelhausen, Ahmed Sanaa Ahmed Awny, Edward Pillai, Ulrich Schacht, Oliver Piepenstock
  • Patent number: 10615880
    Abstract: A method and structure for equalization in coherent optical receivers. Block-based LMS (BLMS) algorithm is one of the many efficient adaptive equalization algorithms used to (i) increase convergence speed and (ii) reduce implementation complexity. Since the computation of the equalizer output and the gradient of the error are obtained using a linear convolution, BLMS can be efficiently implemented in the frequency domain with the constrained frequency-domain BLMS (FBLMS) adaptive algorithm. The present invention introduces a novel reduced complexity constrained FBLMS algorithm. This new approach replaces the two discrete Fourier transform (DFT) stages required to evaluate the DFT of the gradient error, by a simple frequency domain filtering. Implementation complexity can be drastically reduced in comparison to the standard constrained FBLMS. Furthermore, the new approach achieves better performance than that obtained with the unconstrained FBLMS in ultra-high speed coherent optical receivers.
    Type: Grant
    Filed: May 6, 2019
    Date of Patent: April 7, 2020
    Assignee: INPHI CORPORATION
    Inventors: Mario R. Hueda, Nestor D. Campos
  • Patent number: 10613570
    Abstract: A bandgap circuit generates a process and temperature independent voltage. The bandgap circuit includes a bandgap core that generates a temperature independent voltage. The bandgap circuit also includes a resistor ladder that is coupled in parallel to the bandgap core and scales the temperature independent voltage into voltage levels proportional to the temperature independent voltage. An output switch of the bandgap circuit connects the output of the bandgap circuit to one of the voltage level that is substantially equal to a desired voltage level. The bandgap circuit may also include a current mirror that outputs a proportional to absolute temperature current.
    Type: Grant
    Filed: December 17, 2018
    Date of Patent: April 7, 2020
    Assignee: INPHI CORPORATION
    Inventors: Nicola Codega, Fabio Giunco, Giovanni Cesura
  • Patent number: 10605991
    Abstract: The present disclosure provides an optical equalizer for photonics system in an electric-optical communication network. The optical equalizer includes an input port and an output port. Additionally, the optical equalizer includes a filter having a number of stages coupled to each other in a multi-stage series with an output terminal of any stage being coupled to an input terminal of an adjacent next stage while the input terminal of a first stage of the multi-stage series being coupled from the input port. Each stage includes a tap terminal configured to pass an optical power factored by a coefficient of multiplication from the corresponding input terminal of the stage to a tap-output path characterized by a corresponding phase delay. Furthermore, the optical equalizer includes a combiner configured to sum up the optical powers respectively from the number of tap-output paths of the multi-stage series to the output port.
    Type: Grant
    Filed: March 13, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Samira Karimelahi, Masaki Kato
  • Patent number: 10608749
    Abstract: A method and structure for probabilistic shaping and compensation techniques in coherent optical receivers. According to an example, the present invention provides a method and structure for an implementation of distribution matcher encoders and decoders for probabilistic shaping applications. The techniques involved avoid the traditional implementations based on arithmetic coding, which requires intensive multiplication functions. Furthermore, these probabilistic shaping techniques can be used in combination with LDPC codes through reverse concatenation techniques.
    Type: Grant
    Filed: January 24, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Damian Alfonso Morero, Mario Alejandro Castrillon, Ramiro Rogelio Lopez, Cristian Cavenio, Gabriel Infante, Mario Rafael Hueda
  • Patent number: 10606306
    Abstract: A method and circuit are provided to reduce power consumption of high-speed clocks that are distributed across an integrated circuit (IC). Example implementations seek to reduce the amount of power dissipated in typical clock distribution networks by turning the combination of a multi-port electrical network and transmission line into a multi-resonant structure. In an implementation, the multi-port electrical network is coupled between first and second segments of the transmission line. The multi-port electrical network includes series and shunt reactive circuit elements, such as series inductive reactance and a shunt inductive susceptance, configured to produce first and second resonances that cooperate to create a bandpass response across clock distribution frequencies. This bandpass response is created by the multi-resonant structure, which is a combination of the transmission line and the multi-port electrical network.
    Type: Grant
    Filed: January 31, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventor: Tomas Alexander Dusatko
  • Patent number: 10605999
    Abstract: A photonic transceiver apparatus in QSFP package. The apparatus includes a case having a base member, two partial side members, and a lid member to provide a spatial volume with an opening at a back end of the base member. Additionally, the apparatus includes a PCB, installed inside the spatial volume over the base member having a pluggable electrical connector at the back end. Further, the apparatus includes multiple optical transmitting devices in mini-transmit-optical-sub-assembly package, each being mounted on a common support structure and having a laser output port in reversed orientation toward the back end. Furthermore, the apparatus includes a silicon photonics chip, including a fiber-to-silicon attachment module, mounted on the PCB and coupled to a modulation driver module and a trans-impedance amplifier module. Moreover, the apparatus includes a pair of optical input/output ports being back connected to the fiber-to-silicon attachment module.
    Type: Grant
    Filed: September 23, 2019
    Date of Patent: March 31, 2020
    Assignee: INPHI CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Masaki Kato
  • Patent number: 10601518
    Abstract: A circuit and method for mitigating multi-path interference in direct detection optical systems is provided. Samples of an optical signal having a pulse amplitude modulated (PAM) E-field are processed by generating a PAM level for each sample. For each sample, the sample is subtracted from the respective PAM level to generate a corresponding error sample. The error samples are lowpass filtered to produce estimates of multi-path interference (MPI). For each sample, one of the estimates of MPI is combined with the sample to produce an interference-mitigated sample.
    Type: Grant
    Filed: January 28, 2019
    Date of Patent: March 24, 2020
    Assignee: INPHI CORPORATION
    Inventors: Benjamin P. Smith, Jamal Riani, Sudeep Bhoja, Arash Farhoodfar, Vipul Bhatt
  • Patent number: 10601449
    Abstract: For some applications such as high-speed communication over short-reach links, the complexity and associated high latency provided by existing modulators may be unsuitable. According to an aspect, the present disclosure provides a modulator that can reduce latency for applications such as 40G/100G communication over copper cables or SMF. The modulator has a symbol mapper for mapping a bit stream into symbols, and a multi-level encoder including an inner encoder and an outer encoder for encoding only a portion of the bit stream. In some implementations, the multi-level encoder is configured such that an information block size of the inner encoder is small and matches a field size of the outer encoder. Therefore, components that would be used to accommodate larger block sizes can be omitted. The effect is that complexity and latency can be reduced. According to another aspect, the present disclosure provides a demodulator that is complementary to the modulator.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: March 24, 2020
    Assignee: INPHI CORPORATION
    Inventors: Benjamin Smith, Arash Farhoodfar, Stewart Crozier, Frank R. Kschischang, Andrew Hunt
  • Patent number: 10587452
    Abstract: The present invention is directed to data communication. In certain embodiments, the present invention provides switching mechanism for choosing between redundant communication links. Data received from a first set of communication links are processed to have alignment markers removed, and first figure of merit value is determined based on the data without alignment markers. Similarly, a second figure of merit value is determined for the data received from the second set of communication links. A switch selects between the first set of communication links and the second set of communication links based on their respective figure of merit values. Alignment markers are inserted into the data transmitted through the selected set of data links. There are other embodiments as well.
    Type: Grant
    Filed: December 26, 2018
    Date of Patent: March 10, 2020
    Assignee: INPHI CORPORATION
    Inventors: Arash Farhoodfar, Jitendra Swarnkar, Michael Duckering, Andre Sczapanek, Scott Feller, Shaun Lytollis
  • Patent number: 10572425
    Abstract: A method of operating a computer network system configured with disaggregated inputs/outputs. This system can be configured in a leaf-spine architecture and include a router coupled to a network source, a plurality of core switches coupled to the router, a plurality of aggregator switches coupled to each of the plurality of core switches, and a plurality of rack modules coupled to each of the plurality of aggregator switches. Each of rack modules can include an I/O appliance with a downstream aggregator module, a plurality of server devices each with PCIe interfaces, and an upstream aggregator module that aggregates each of the PCIe interfaces. A high-speed link can be configured between the downstream and upstream aggregator modules via aggregation of many serial lanes to provide reliable high speed bit stream transport over long distances, which allows for better utilization of resources and scalability of memory capacity independent of the server count.
    Type: Grant
    Filed: February 5, 2019
    Date of Patent: February 25, 2020
    Assignee: INPHI CORPORATION
    Inventors: Sreenivas Krishnan, Nirmal Raj Saxena
  • Patent number: 10574195
    Abstract: A transimpedance amplifier (TIA) structure includes an input node with a variable inductance component serving to reduce variation in peak amplitude over different gain conditions. According to certain embodiments, an inductor at the TIA input has a first node in communication with a Field Effect Transistor (FET) drain, and a second node in communication with the FET source. A control voltage applied to the FET gate effectively controls the input inductance by adding a variable impedance across the inductor. Under low gain conditions, lowering of inductance afforded by the control voltage applied to the FET reduces voltage peaking. TIAs in accordance with embodiments may be particularly suited to operate over a wide dynamic range to amplify incoming electrical signals received from a photodiode.
    Type: Grant
    Filed: October 11, 2018
    Date of Patent: February 25, 2020
    Assignee: INPHI CORPORATION
    Inventor: Tom Broekaert
  • Patent number: 10574023
    Abstract: The present invention relates to telecommunication techniques and integrated circuit (IC) devices. In a specific embodiment, the present invention provides a laser deriver apparatus that includes a main DAC section and a mini DAC section. The main DAC section processes input signal received from a pre-driver array and generates an intermediate output signal. The mini DAC section provides a compensation signal to reduce distortion of the intermediate output signal. The intermediate output signal is coupled to output terminals through a cascode section and/or a T-coil section. There are other embodiments as well.
    Type: Grant
    Filed: August 22, 2018
    Date of Patent: February 25, 2020
    Assignee: INPHI CORPORATION
    Inventors: Karim Abdelhalim, Jorge Pernillo, Halil Cirit, Michael Le
  • Patent number: 10567005
    Abstract: Multiple data permutation operations in respective different dimensions are used to provide an overall effective data permutation using smaller blocks of data in each permutation than would be used in directly implementing the overall permutation in a single permutation operation. Data that has been permuted in one permutation operation is block interleaved, and the interleaved data is then permuted in a subsequent permutation operation. A matrix transpose is one example of block interleaving that could be applied between permutation operations.
    Type: Grant
    Filed: September 18, 2018
    Date of Patent: February 18, 2020
    Assignee: INPHI CORPORATION
    Inventors: Arash Farhoodfar, Frank R. Kschischang, Benjamin P. Smith, Andrew Hunt
  • Patent number: 10566287
    Abstract: A method for forming a silicon photonics interposer having through-silicon vias (TSVs). The method includes forming vias in a front side of a silicon substrate and defining primary structures for forming optical devices in the front side. Additionally, the method includes bonding a first handle wafer to the front side and thinning down the silicon substrate from the back side and forming bumps at the back side to couple with a conductive material in the vias. Furthermore, the method includes bonding a second handle wafer to the back side and debonding the first handle wafer from the front side to form secondary structures based on the primary structures. Moreover, the method includes forming pads at the front side to couple with the bumps at the back side before completing final structures based on the secondary structures and debonding the second handle wafer from the back side.
    Type: Grant
    Filed: February 2, 2018
    Date of Patent: February 18, 2020
    Assignee: INPHI CORPORATION
    Inventors: Liang Ding, Radhakrishnan L. Nagarajan
  • Patent number: 10559941
    Abstract: A packaged transmitter device includes a base member comprising a planar part mounted with a thermoelectric cooler, a transmitter, and a coupling lens assembly, and an assembling part connected to one side of the planar part. The device further includes a circuit board bended to have a first end region and a second end region being raised to a higher level. The first end region disposed on a top surface of the planar part includes multiple electrical connection patches respectively connected to the thermoelectric and the transmitter. The second end region includes an electrical port for external connection. Additionally, the device includes a cover member disposed over the planar part. Furthermore, the device includes a cylindrical member installed to the assembling part for enclosing an isolator aligned to the coupling lens assembly along its axis and connected to a fiber to couple optical signal from the transmitter to the fiber.
    Type: Grant
    Filed: October 15, 2018
    Date of Patent: February 11, 2020
    Assignees: INPHI CORPORATION, LUXNET CORPORATION
    Inventors: Radhakrishnan L. Nagarajan, Peng-Chih Li, Pi-Cheng Law