Abstract: Disclosed is a method of producing vias and through holes through a metal laminate. The laminate is a multi-layer, for example, a trilayer of a relatively hard metal between two layers of a relatively soft metal. The method includes the steps of first etching a clearance hole through the soft metal on one side of the trilayer laminate, followed by partially etching the hard metal layer. Next, drilling the remaining thickness of the hard metal, and drilling through the second layer of soft metal.

Abstract: An enhanced intervention list is used in a data communication network used to route messages from a source or originating user to a destination user in the network. The enhanced intervention list includes an intervention type field which defines how an intercepted distribution is to be processed. For an Associative Redirection intervention type, the message is redirected to a destination user identified in the intervention list. For a Predirecting Intervention type, the message is diverted to an intervening agent or program identified in the intervention list. After the message is processed by the intervening agent, it is routed to a user directory which identifies the destination node serving the destination user. For a Postdirecting Intervention type, the message is sent to the local user directory first and is then checked against the intervention list entries to see if intervention is still warranted.

Abstract: Method and product resulting therefrom of controlling the residual resistivity of an electrolessly deposited metal by first, calculating the mathematical relationship between the residual resistivity of the deposited metal and its rate of deposition and second, depositing said metal at a rate to produce a predetermined residual resistivity.

Abstract: A ceramic chip carrier is disclosed which preferably includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and at least one pin which is mechanically and electrically connected to a contact pad on the circuitized surface. Each mechanical/electrical connection between a pin and a contact pad includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

Abstract: A heat pipe structure is incorporated directly into the metal baseplate of a circuit card thereby eliminating thermal contact resistance between the baseplate and the heat pipe assembly. Components are mounted on a copper circuit layer bonded to a dielectric layer in a first portion of the baseplate with a second portion of the baseplate/heat pipe assembly extending into a heat sink/cold plate condensing area for removal of heat generated in the component portion.

Abstract: An optical disk drive apparatus includes a magnet-optic optical disk, laser generator, optical system, first and second photodetectors, data detecting and amplifying device connected to the photodetectors and a laser generator control device. The photodetectors each have first and second detecting sections receiving leading and trailing light beam segments, respectively, and each photodetector producing a magnitude proportional output signal. The control device includes a mode setting device for operating in a read only mode using both first and second sections and a read while performing a write mode using only the second sections.

Abstract: A ceramic chip carrier is disclosed which includes a ceramic substrate having a circuitized surface, at least one semiconductor chip mounted on the circuitized surface, and a lead frame or edge clip which is mechanically and electrically connected to contact pads on the circuitized surface. Each mechanical/electrical connection between the lead frame or edge clip and the contact pads includes a conventional solder connection. In addition, each such solder connection is at least partially encapsulated in a material, including an epoxy resin, which is chosen in relation to the solder connection to enable the solder connection to withstand a standard thermal fatigue test.

Abstract: A strippable thin film of Cu is applied above the surface features of a microelectronic circuit package to protect the features during mechanical working, for example drilling, the panel. The thin film is then stripped off of the panel. The thin film may be stripped off of the panel either prior to or after circuitization.

Abstract: An error log request is generated by a component of a communication software system. The error log request is analyzed and compared to entries in one of a plurality of records in a message look-up table. If there is a match between the fields of the error log request and selected entries of a record in the look-up table, a user message request is generated which facilitates the display of a pre-existing user friendly message as modified with data included in the generated user message request.

Abstract: Customized screens are generated in accordance with the invention for interfacing with an application program in an information processing system. During a panel definition phase when a panel designer creates a customized panel, panel actions are selected from a default list of panel operations and commands, including searching, adding, changing or deleting data from a database, showing long fields, blanking out a panel, displaying a prior panel, and printing. The actions are specified in a pop-up window during panel definition. Mnemonics and function keys may be specified for each action. The invention dynamically creates pull-down windows based on the actions specified which become part of the panel interface available to the run time user from an application action bar. Users may select actions to interact with the panel in like manner to interaction with other portions of the application user interface by means of cursor selection, input of the action number, mnemonics, or activation of a function key.

Abstract: This invention relates to a method of establishing a staple relationship between two documents within a context of an application program. An end user indicates to the system that a staple relationship is to be established between two identified documents. The end user enters a definition of the staple relationship which includes any attributes to be associated with the identified documents within the staple relationship and the identity of at least one application within whose context the relationship is to exist. The system will create the staple relationship and file the identified documents in a library within the context of the specified application. The system then maintains the staple relationship between the identified documents within the context of the specified application.

Abstract: A process improvement for enabling the development of low cost transistor devices, particularly MOS FETs, in annealed polysilicon formed on an insulator; the improvement resulting from the use of silicon ribbons as substrates.