Patents Assigned to Itoh Research & Development Laboratory Co., Ltd.
  • Patent number: 5396947
    Abstract: A radiating device 10 includes a radiating plate 11 having a flat bottom surface 12 serving as a heat receiving surface, a top surface 13, and a column 14 . Column 14 includes a protruding base portion 15 integrally connected to top surface 13 of radiating plate 11 and extending so as to protrude upward, a pipe 16 inserted into a hole of protruding base portion 15, a fin 19 secured to the upper portion of pipe 16 and a working fluid 17 serving as head carrier introduced into pipe 16.
    Type: Grant
    Filed: March 1, 1993
    Date of Patent: March 14, 1995
    Assignee: Itoh Research & Development Laboratory Co., Ltd
    Inventor: Akira Itoh
  • Patent number: 5379830
    Abstract: A heat pipe includes a pipe, a bottom plate, and a cap plate. The cap plate includes a vertical aperture extending so as to be penetrated vertically and a horizontal aperture extending from the side surface to the vertical aperture. A sleeve having a through hole extending vertically is attached to the vertical aperture of the cap plate. A working fluid serving as heat carrier repeating evaporation and condensation is introduced into the pipe from the through hole of the sleeve. The sleeve is deformed by impact externally applied through the horizontal aperture, so that the through hole is closed. A radiating device includes a base block having a plurality of guide grooves on the upper surface, and a plurality of heat pipes having the bottom portions fitted to be secured into the guide groove. The structure of the heat pipes is the same as that of the above-described heat pipe.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: January 10, 1995
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Akira Itoh
  • Patent number: 5345998
    Abstract: A cooling device includes a liquid chamber having a liquid inlet and a liquid outlet. A bent pipe includes a straight tubular heat pipe component provided extending from the inside to the outside of the liquid chamber. A spiral heat pipe component communicating with the straight tubular heat pipe component and extending to surround the same spirally is provided. In an internal space where the spiral heat pipe component and the straight tubular heat pipe component communicate with each other, a working fluid serving as a heat carrier is sealed. An ultrasonic motor for rotating integrally the straight tubular heat pipe component and the spiral heat pipe component is provided. A radiating fin structure is provided on the straight tubular heat pipe component positioned outside the liquid chamber. As a result, it is possible to make the device lighter, smaller and more reliable without decreasing the cooling performance as compared to conventional cooling devices.
    Type: Grant
    Filed: July 8, 1993
    Date of Patent: September 13, 1994
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Akira Itoh
  • Patent number: 5308920
    Abstract: A radiating device for radiating heat of an electronic component to the atmosphere, includes a container body, a cap for tight-sealing the inner space of the container body, and a working fluid serving as a heat carrier kept in the container body. The bottom wall of the container body is flat and serves as a heat receiving portion. The working fluid repeats evaporation and condensation in the container body. In a corner where the inner surface of the bottom wall of the container body meets the inner surface of a vertical cylindrical wall, a loop groove is formed running all along the corner. A plurality of horizontal grooves intersecting the loop groove are formed on the inner surface of the bottom wall. A plurality of second grooves intersecting the loop grooves are formed on the inner surface of the cylindrical wall. The working fluid condensed at the heat radiating portion returns to the bottom wall through the vertical grooves and through the loop groove.
    Type: Grant
    Filed: July 31, 1992
    Date of Patent: May 3, 1994
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Satomi Itoh
  • Patent number: 5213153
    Abstract: A radiating device 10 has a rectangular parallelepiped block 11. Block 11 includes a first group of holes 12 to 19 and a second group of holes 20 to 23 causing convection of air. Passages for circulating gas and liquid serving as a heat pipe, are formed to extend in X, Y and Z directions in block 11. Opening ends of respective passages are closed by pins 51. The air heated in the holes is discharged to the atmosphere from the top surface of the block through the second group of holes. Accordingly, cool air in the atmosphere absorbed in the holes of the first group, carries the heat generated from the inner wall surface of the holes, is discharged to the atmosphere from the top surface of the block. Working fluid sealed in the passage frequently repeats an evaporation and condensation. The liquid condensed at the radiating portion returns to the heated portion along an inner wall surface defining the passage.
    Type: Grant
    Filed: March 17, 1992
    Date of Patent: May 25, 1993
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Satomi Itoh
  • Patent number: D341820
    Type: Grant
    Filed: August 21, 1992
    Date of Patent: November 30, 1993
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Satomi Itoh
  • Patent number: D342721
    Type: Grant
    Filed: August 21, 1992
    Date of Patent: December 28, 1993
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Akira Itoh
  • Patent number: D356067
    Type: Grant
    Filed: August 21, 1992
    Date of Patent: March 7, 1995
    Assignee: Itoh Research & Development Laboratory Co., Ltd.
    Inventor: Akira Itoh