Heat dissipating device for a semiconductor package

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Description

FIG. 1 is a front view of an embodiment of the heat dissipating device for a semiconductor package;

FIG. 2 is a top plan view thereof;

FIG. 3 is a bottom plan view thereof;

FIG. 4 is a right side view thereof;

FIG. 5 is a perspective view thereof;

FIG. 6 is a sectional view taken along section line 6--6 in FIG. 2; and,

FIG. 7 is the same view as in FIG. 4 showing the heat dissipating device attached to a semiconductor package shown in broken lines since the packages do not form any part of the claimed design.

Referenced Cited
U.S. Patent Documents
D276719 December 11, 1984 Sugimoto et al.
3241605 March 1966 Tabor
3406753 October 1968 Habdas
3572428 March 1971 Monaco
3589046 May 1971 Jordan
3884293 May 1975 Pessolano et al.
4292647 September 29, 1981 Lee
4644385 February 17, 1987 Nakanishi et al.
4716494 December 29, 1987 Bright et al.
5087888 February 11, 1992 Mountz et al.
5155579 October 13, 1992 Yeung
Foreign Patent Documents
0054597 June 1982 EPX
Other references
  • Air-Cooled Module on p. 1007 of IBM Technical Disclosure Bulletin vol. 20 No. 3 Aug. 1977. Heat Removal Module on p. 2249 of IBM Technical Disclosure Bulletin vol. 22 No. 6 Nov. 1979.
Patent History
Patent number: D342721
Type: Grant
Filed: Aug 21, 1992
Date of Patent: Dec 28, 1993
Assignee: Itoh Research & Development Laboratory Co., Ltd. (Osaka)
Inventor: Akira Itoh (Osaka)
Primary Examiner: Wallace R. Burke
Assistant Examiner: Joel Sincavage
Attorneys: W. G. Fasse, D. H. Kane, Jr.
Application Number: 7/933,503
Classifications
Current U.S. Class: Heat Sink (D13/179)