Patents Assigned to JSR Corporation
  • Patent number: 11747725
    Abstract: A radiation-sensitive resin composition includes: a resin including a structure unit having an acid-dissociable group; a radiation-sensitive acid generator; and a solvent. The radiation-sensitive acid generator includes at least two of compounds represented by formulae (1) to (3), provided that the compound represented by formula (1) and the compound represented by formula (3) within the scope of the compound represented by formula (2) are excluded. In the formulae (1) to (3), R1, R2 and R3 are each independently a group having a cyclic structure; X11, X12, X21, X22, X31 and X32 are each independently a hydrogen atom, a fluorine atom, or a fluorinated hydrocarbon group, provided that both X11 and X12, both X21 and X22, and both X31 and X32 are not a hydrogen atom, respectively.
    Type: Grant
    Filed: April 16, 2018
    Date of Patent: September 5, 2023
    Assignee: JSR CORPORATION
    Inventor: Ken Maruyama
  • Patent number: 11745216
    Abstract: A method for producing a film includes: coating a surface of a substrate with a composition containing a polymer having a structural unit represented by formula (1) and having a number average molecular weight of 13000 or more and a solvent, heating a coating film formed by the coating, and removing, with a rinsing liquid, a part of the coating film after the heating, wherein the rinsing liquid to be used contains a basic compound. In the formula (1), Y1 is a single bond, —CO—NR2—, a divalent aromatic ring group, a divalent group containing —O—, or a divalent group containing —CO—NR2—. A1 is a single bond, —O—, —S—, or —NR3—. R1 is a hydrogen atom, a monovalent hydrocarbon group, a monovalent halogenated hydrocarbon group, or a monovalent group having a heterocyclic structure.
    Type: Grant
    Filed: June 23, 2022
    Date of Patent: September 5, 2023
    Assignee: JSR CORPORATION
    Inventors: Ryo Kumegawa, Sosuke Osawa, Miki Tamada, Ken Maruyama, Motohiro Shiratani
  • Publication number: 20230273519
    Abstract: Provided is a radiation-sensitive resin composition capable of exhibiting sensitivity and CDU performance at a sufficient level when a next-generation technology is applied, and a pattern formation method. A radiation-sensitive resin composition containing: a radiation-sensitive acid generating resin comprising a repeating unit A having an acid-dissociable group represented by the following formula (1) and a repeating unit B including an organic acid anion moiety and a sulfonium cation moiety containing an aromatic ring structure having a fluorine atom; and a solvent; in the formula (1), RT is a hydrogen atom, a fluorine atom, a methyl group, or a trifluoromethyl group; RX is a monovalent hydrocarbon group having 2 to 20 carbon atoms; and Cy represents an alicyclic structure having 3 to 20 ring members and formed together with a carbon atom to which this is bonded.
    Type: Application
    Filed: August 17, 2021
    Publication date: August 31, 2023
    Applicant: JSR CORPORATION
    Inventor: Ken MARUYAMA
  • Publication number: 20230257701
    Abstract: A method of culturing human induced pluripotent stem cells includes inoculating human induced pluripotent stem cells in a culture medium at an inoculation density of 1.0×104 to 1.0×106 cells/cm2 in a culture vessel and subjecting the human induced pluripotent stem cells to two-dimensional culturing. A method of producing cerebral organoids includes culturing a culture of the human induced pluripotent stem cells obtained by the method of culturing human induced pluripotent stem cells in a culture medium containing a BMP inhibitor and a transforming growth factor ? (TGF?) inhibitor to form cell aggregates, culturing the cell aggregates in a culture medium containing a Wnt signal transduction pathway potentiator and an extracellular matrix, and subjecting the culturing obtained in the culturing the cell aggregates to spinner culturing.
    Type: Application
    Filed: February 9, 2023
    Publication date: August 17, 2023
    Applicants: JSR CORPORATION, KEIO UNIVERSITY
    Inventors: Hayato HIRAMINE, Seiji SHIOZAWA, Hideyuki OKANO, Mitsuru ISHIKAWA
  • Publication number: 20230259032
    Abstract: A composition includes: at least one polymer represented by formula (1), formula (2), or both; and a solvent. A1 and A2 are each independently a structural unit having 2 or more carbon atoms; a plurality of A's are the same or different and a plurality of A2s are the same or different; n1 and n2 are each independently an integer of 2 to 500; R1, R2, and R3 are each independently an organic group having 1 or more carbon atoms, or R1 and R2 taken together represent a ring together with X1, Y1, and P; R1 and R2 are the same or different; X1, Y1, and Y2 are each independently a single bond, —O—, or —NR4—; R4 is an organic group having 1 or more carbon atoms; and Z1 and Z2 are each independently hydrogen or an organic group having 1 to 15 carbon atoms.
    Type: Application
    Filed: April 25, 2023
    Publication date: August 17, 2023
    Applicant: JSR CORPORATION
    Inventors: Miki TAMADA, Ryo KUMEGAWA, Hiroyuki KOMATSU, Motohiro SHIRATANI, Ken MARUYAMA, Sosuke OSAWA
  • Publication number: 20230250238
    Abstract: A silicon-containing composition includes a polysiloxane compound and solvent. The polysiloxane compound includes a fluorine atom and a group including an ester bond. The polysiloxane compound preferably includes a first structural unit represented by formula (1), and a second structural unit represented by formula (2). X represents a monovalent organic group having 1 to 20 carbon atoms and comprising a fluorine atom; R1 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms; Y represents a monovalent organic group having 1 to 20 carbon atoms and comprising an ester bond; and R2 represents a halogen atom, a hydroxy group, or a monovalent organic group having 1 to 20 carbon atoms.
    Type: Application
    Filed: August 15, 2022
    Publication date: August 10, 2023
    Applicant: JSR CORPORATION
    Inventors: Ryuichi SERIZAWA, Kengo HIRASAWA
  • Publication number: 20230244143
    Abstract: A radiation-sensitive resin composition includes: a polymer including a structural unit including an acid-labile group; and a compound represented by formula (1). R1, R2, and R3 each independently represent a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms; X1, X2, and X3 each independently represent a group represented by formula (2); a sum of d, e, and f is no less than 1; R4 represents a hydrocarbon group having 1 to 20 carbon atoms and R5 represents a hydrocarbon group having 1 to 20 carbon atoms, or R4 and R5 taken together represent a heterocyclic structure having 4 to 20 ring atoms, together with the sulfur atom to which R4 and R5 bond; n is 0 or 1; A? represents a monovalent sulfonic acid anion; and Y represents —COO—, —OCO—, or —N(R7)CO—.
    Type: Application
    Filed: June 30, 2022
    Publication date: August 3, 2023
    Applicant: JSR CORPORATION
    Inventors: Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Hayato NAMAI, Kazuya KIRIYAMA, Ken MARUYAMA
  • Publication number: 20230242787
    Abstract: A method for forming a protective film includes directly or indirectly coating only a periphery of a substrate with a composition. The composition includes a compound having an aromatic ring, and a solvent. The solvent includes a first solvent having a normal boiling point of 156° C. or higher and lower than 300° C. A content of the first solvent in the solvent is preferably 20 mass % or more and 100 mass % or less. The first solvent is preferably an ester, an alcohol, an ether, a carbonate, or a combination of two or more of an ester, an alcohol, an ether, and a carbonate.
    Type: Application
    Filed: March 28, 2023
    Publication date: August 3, 2023
    Applicant: JSR CORPORATION
    Inventors: Kazunori TAKANASHI, Hiroyuki Miyauchi, Nao Okumura, Tomoharu Kawazu, Satoshi Dei
  • Publication number: 20230236501
    Abstract: A radiation-sensitive resin composition includes: a polymer, solubility of which in a developer solution is capable of being altered by an action of an acid; a radiation-sensitive acid generator; and a compound represented by formula (1). Ar1 represents a group obtained by removing (a+b+2) hydrogen atoms from an aromatic hydrocarbon ring having 6 to 30 ring atoms; R1 represents a halogen atom or a monovalent organic group having 1 to 20 carbon atoms; L1 represents a divalent linking group; R2 represents a substituted or unsubstituted monovalent aromatic hydrocarbon group having 6 to 20 carbon atoms; a is an integer of 0 to 10, b is an integer of 1 to 10, wherein a sum of a and b is no greater than 10; and X+ represents a monovalent radiation-sensitive onium cation.
    Type: Application
    Filed: January 23, 2023
    Publication date: July 27, 2023
    Applicant: JSR CORPORATION
    Inventors: Natsuko KINOSHITA, Takuhiro TANIGUCHI, Katsuaki NISHIKORI, Kazuya KIRIYAMA
  • Publication number: 20230236506
    Abstract: A radiation-sensitive resin composition includes a polymer and a compound. The compound includes a first structural unit including an aromatic carbon ring to which no less than two hydroxy groups bond, and a second structural unit including an acid-labile group which is dissociable by an action of an acid to give a carboxy group. The compound is represented by formula (1). R1 represents a monovalent organic group having 1 to 30 carbon atoms; and X+ represents a monovalent radiation-sensitive onium cation. A weight average molecular weight of the polymer is no greater than 10,000.
    Type: Application
    Filed: July 19, 2022
    Publication date: July 27, 2023
    Applicant: JSR CORPORATION
    Inventors: Katsuaki NISHIKORI, Kazuya KIRIYAMA, Takuhiro TANIGUCHI, Ken MARUYAMA
  • Patent number: 11709428
    Abstract: A radiation-sensitive resin composition includes: a resin containing a structural unit A represented by formula (1); at least one radiation-sensitive acid generator selected from the group consisting of a radiation-sensitive acid generator represented by formula (2-1) and a radiation-sensitive acid generator represented formula (2-2); and a solvent. At least one R3 is an acid-dissociable group; and R41 is a hydrogen atom or a protective group to be deprotected by action of an acid. At least one of Rf1 and Rf2 is a fluorine atom or a fluoroalkyl group; R5a is a monovalent organic group having a cyclic structure; X1+ is a monovalent onium cation; R5b is a monovalent organic group, and X2+ is a monovalent onium cation whose atom having a positive charge is not an atom forming a cyclic structure.
    Type: Grant
    Filed: March 5, 2021
    Date of Patent: July 25, 2023
    Assignee: JSR CORPORATION
    Inventor: Natsuko Kinoshita
  • Publication number: 20230229082
    Abstract: A radiation-sensitive resin composition includes: a polymer which has a first structural unit including a phenolic hydroxyl group, and a second structural unit represented by formula (1); and a radiation-sensitive acid generating agent which has a compound represented by formula (2). R1 represents a hydrogen atom, or the like; R2 represents a hydrogen atom or the like; and R3 represents a divalent monocyclic alicyclic hydrocarbon group having 3 to 12 ring atoms. Ar1 represents a group obtained by removing (q+1) hydrogen atoms on an aromatic ring from an arene formed by condensation of at least two benzene rings; R4 represents a monovalent organic group having 1 to 20 carbon atoms; q is an integer of 0 to 7; and R5 represents a halogen atom, a hydroxy group, a nitro group, or a monovalent organic group having 1 to 20 carbon atoms, or the like.
    Type: Application
    Filed: December 7, 2021
    Publication date: July 20, 2023
    Applicant: JSR CORPORATION
    Inventor: Katsuaki NISHIKORI
  • Patent number: 11705331
    Abstract: A composition for use in selective modification of a base material surface includes a polymer having, at an end of a main chain or a side chain thereof, a group including a first functional group capable of forming a bond with a metal, and a solvent.
    Type: Grant
    Filed: January 14, 2021
    Date of Patent: July 18, 2023
    Assignee: JSR CORPORATION
    Inventors: Hiroyuki Komatsu, Tomohiro Oda, Hitoshi Osaki, Masafumi Hori, Takehiko Naruoka
  • Publication number: 20230220240
    Abstract: Provided are abrasive grains and a composition for chemical mechanical polishing which are for selectively polishing a silicon nitride film, and which are applicable not only to silicon oxide films but also to amorphous silicon films and polysilicon films. This method for manufacturing abrasive grains includes: a first step of heating a mixture which contains particles having a sulfanyl group (—SH) fixed to the surface thereof via covalent bonds, and which contains a compound having carbon-carbon unsaturated double bonds; and a second step, which is performed after the first step, of further adding a peroxide and carrying out heating.
    Type: Application
    Filed: May 25, 2021
    Publication date: July 13, 2023
    Applicant: JSR CORPORATION
    Inventors: Takanori Yanagi, Pengyu Wang, Kouji Nakanishi, Yuuya Yamada, Atsushi Baba
  • Publication number: 20230203439
    Abstract: A method is provided for producing oligodendrocyte-like cells, including (A) increasing abundances of oligodendrocyte transcription factor 2 (OLIG2) mutant and SRY-box transcription factor 10 (SOX10) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells in which the abundances of the OLIG2 mutant and the SOX10 are increased and consequently differentiating the human pluripotent stem cells into oligodendrocyte-like cells, in which the OLIG2 mutant lacks a serine residue of wild-type OLIG2 at position 147, or the serine residue of the wild-type OLIG2 at position 147 is substituted with an amino acid other than serine.
    Type: Application
    Filed: March 2, 2023
    Publication date: June 29, 2023
    Applicants: JSR Corporation, KEIO UNIVERSITY
    Inventors: Mitsuru ISHIKAWA, Hideyuki OKANO
  • Publication number: 20230203344
    Abstract: A composition for chemical mechanical polishing and a polishing method allow a semiconductor substrate containing at least one of a polysilicon film and a silicon nitride film to be polished at a high speed, while being capable of reducing the incidence of surface defects in the polished surface. The composition for chemical mechanical polishing contains (A) abrasive grains having plural protrusions on their surfaces and (B) a liquid medium, wherein the absolute value of the zeta-potential of the component (A) in the composition for chemical mechanical polishing is 10 mV or more.
    Type: Application
    Filed: May 21, 2021
    Publication date: June 29, 2023
    Applicant: JSR CORPORATION
    Inventors: Yuuya Yamada, Kouhei Yoshio
  • Publication number: 20230205082
    Abstract: A radiation-sensitive composition includes a polymer including first and second structural units, a first compound that generates a first acid upon irradiation with radioactive ray, and a second compound that generates a second acid upon irradiation with radioactive ray. The first structural unit includes an acid-labile group, the first acid does not substantially dissociate the acid-labile group under 110° C. and a period of 1 min, the second acid dissociates the acid-labile group under 110° C. and a period of 1 min, and the second structural unit includes a monovalent group of formula (X), where Ar1 is a group obtained by removing (a+b) hydrogen atoms from an unsubstituted aryl group, RXA is a monovalent iodine atom, an iodinated alkyl group or an iodinated alkoxy group, RXB is a monovalent organic group, a is an integer of 1 to 10, and b is an integer of 1 to 10.
    Type: Application
    Filed: April 28, 2022
    Publication date: June 29, 2023
    Applicant: JSR CORPORATION
    Inventor: Ken MARUYAMA
  • Publication number: 20230203438
    Abstract: A method is provided for producing astrocyte-like cells, including (A) upregulating transcription factors including SRY-box transcription factor 9 (SOX9), nuclear factor IA (NFIA), and nuclear factor IB (NFIB) in human pluripotent stein cells and (B) culturing the human pluripotent stem cells, in which the transcription factors are upregulated, and consequently differentiating the human pluripotent stern cells into astrocyte-like cells.
    Type: Application
    Filed: March 2, 2023
    Publication date: June 29, 2023
    Applicants: JSR Corporation, KEIO UNIVERSITY
    Inventors: Mitsuru ISHIKAWA, Hideyuki OKANO
  • Publication number: 20230204586
    Abstract: A method for predicting efficacy of treatment of a lung cancer patient using an immune checkpoint inhibitor includes isolating exosomes from a biological sample derived from the lung cancer patient, and determining an expression level of a protein present in the exosomes by a mass spectrometry method, in which the protein is one or more proteins selected from the group of proteins shown in Table 1-1 to Table 1-6.
    Type: Application
    Filed: March 25, 2021
    Publication date: June 29, 2023
    Applicants: JSR Corporation, KEIO UNIVERSITY
    Inventors: Masaru UENO, Seiki WAKUI, Motoaki MIZUUCHI, Araki WAKIUCHI, Yutaka KAWAKAMI, Shigeki OHTA
  • Publication number: 20230203229
    Abstract: A composition includes a polymer (1) having a partial structure represented by formula (1), and a solvent. X is a hydrogen atom, a halogen atom, a hydroxyl group, an alkyl group having 1 to 5 carbon atoms, a hydroxyalkyl group having 1 to 5 carbon atoms, or a halogenated alkyl group having 1 to 5 carbon atoms. Y is a monovalent organic group having 1 to 12 carbon atoms and containing a hetero atom or a monovalent inorganic acid group. Z is a linking group represented by —O—, —S—, or —NR—, where R is an organic group having 1 to 20 carbon atoms. R1 and R2 are each independently a hydrogen atom, a halogen atom, or an organic group having 1 to 20 carbon atoms, or the like.
    Type: Application
    Filed: February 10, 2023
    Publication date: June 29, 2023
    Applicant: JSR CORPORATION
    Inventors: Miki TAMADA, Ryo KUMEGAWA, Motohiro SHIRATANI, Hiroyuki KOMATSU, Ken MARUYAMA, Sosuke OSAWA