Patents Assigned to Kaijo Corporation
  • Patent number: 11901329
    Abstract: A wire bonding method for connecting a wire to two different surfaces by bonding with a single wire bonding step. The wire bonding method includes: bonding one end of a wire fed from a distal end of a capillary to a first bonding surface; moving the capillary in the Z direction; moving the capillary the X and/or Y direction; moving the capillary in the X, Y, and/or Z direction, a plurality of times; moving the capillary to a highest position; and bonding another end of the wire to the second bonding surface. The wire bonding method includes, at any timing, rotating the first bonding surface about a rotation axis to move the second bonding surface to a position capable of bonding. An angle formed by the first bonding surface and the second bonding surface on a side where the wire is stretched is 200° or more.
    Type: Grant
    Filed: June 17, 2019
    Date of Patent: February 13, 2024
    Assignee: KAIJO CORPORATION
    Inventors: Mami Kushima, Tamanari Yasuda
  • Patent number: 11791304
    Abstract: Provided is a method for bonding an insulated coating wire, which is capable of stably bonding a metal wire in an insulated coating wire and an electrode. One aspect of the present invention provides a method for bonding an insulated coating wire for electrically connecting a first electrode 12 and a second electrode to each other by an insulated coating wire 11 in which a metal wire is coated with an organic substance, the method including: a step (a) for placing the insulated coating wire 11 onto the first electrode 12; a step (b) for exposing a metal wire from the insulated coating wire; and a step (c) for forming a first bump over the exposed metal wire and the first electrode to electrically connect the metal wire to the first electrode.
    Type: Grant
    Filed: November 7, 2019
    Date of Patent: October 17, 2023
    Assignee: KAIJO CORPORATION
    Inventors: Akio Sugito, Susumu Majima, Mami Kushima
  • Patent number: 11618060
    Abstract: An ultrasonic cleaning apparatus capable of cleaning large-sized objects includes: a casing having a bottom surface that forms a tilted surface to oppose the object to be cleaned and having an ultrasonic transducer provided at an inner lower surface; a cleaning liquid supply device configured to supply cleaning liquid to a casing bottom surface; and a flow-speed accelerator that ejects the cleaning liquid by accelerating the flow speed of the cleaning liquid from the cleaning liquid supply device. The casing is formed by a main body including an upper plate, a projected part attached to a lower part of the upper plate, an outer lateral face extended from the projected part in a downward direction, and the bottom surface connected integrally at a lower end part of the outer lateral face. The bottom surface is formed to be tilted at a prescribed angle with respect to a horizontal plane.
    Type: Grant
    Filed: August 21, 2018
    Date of Patent: April 4, 2023
    Assignee: KAIJO CORPORATION
    Inventors: Keisuke Ohata, Noriyuki Sakamoto
  • Patent number: 11458442
    Abstract: An ultrasonic homogenizer includes an ultrasonic transducer; an ultrasonic horn that irradiates an ultrasonic wave generated by the ultrasonic transducer; a holder that receives an irradiating surface of the ultrasonic horn; an intake port that is provided on a bottom face of the holder and intakes a mixture liquid into the holder; and an ejection port that is provided on the holder above the intake port and discharges the mixture liquid supplied inside the holder; an opening area of the intake port being smaller than an irradiating area of the ultrasonic horn and the irradiating surface of the ultrasonic horn being disposed above the intake port whereby facing the intake port.
    Type: Grant
    Filed: November 20, 2020
    Date of Patent: October 4, 2022
    Assignee: KAIJO CORPORATION
    Inventors: Mineyuki Sekimoto, Hitoshi Yamamoto, Hiroshi Hasegawa, Takashi Kawamura
  • Patent number: 11404393
    Abstract: A wire bonding method includes bringing a capillary and a wire inserted through the capillary into pressure contact with a bonding point of a lead placed on an XY stage to bond the wire to the lead, including moving the XY stage in a state in which the capillary is in pressure contact with the lead to move the capillary along a movement locus including a plurality of arc portions.
    Type: Grant
    Filed: August 23, 2018
    Date of Patent: August 2, 2022
    Assignee: KAIJO CORPORATION
    Inventors: Eiji Kimura, Hiroaki Suzuki, Yoshikazu Tashiro
  • Patent number: 11302667
    Abstract: To provide a wire bonding apparatus, which is insusceptible to a bonding state at a second bonding point due to a wire cut error or the like, or to members such as a capillary and a wire, and is capable of automatically protruding the wire from a leading end of the capillary, provided is a wire bonding apparatus including: a capillary (6) having a through hole through which a wire (40) is to be inserted; a holding unit, which is provided above the capillary (6), and is configured to hold the wire (40) inserted through the capillary (6); and a vibrating unit configured to vertically vibrate the capillary (6). Under a state in which the holding unit holds the wire (40), the vibrating unit vertically vibrates the capillary (6) so that the wire (40) is protruded from the leading end of the capillary.
    Type: Grant
    Filed: August 26, 2020
    Date of Patent: April 12, 2022
    Assignee: KAIJO CORPORATION
    Inventors: Riki Jindo, Akio Sugito
  • Publication number: 20210331215
    Abstract: An ultrasonic cleaning apparatus capable of cleaning large-sized objects includes: a casing having a bottom surface that forms a tilted surface to oppose the object to be cleaned and having an ultrasonic transducer provided at an inner lower surface; a cleaning liquid supply device configured to supply cleaning liquid to a casing bottom surface; and a flow-speed accelerator that ejects the cleaning liquid by accelerating the flow speed of the cleaning liquid from the cleaning liquid supply device. The casing is formed by a main body including an upper plate, a projected part attached to a lower part of the upper plate, an outer lateral face extended from the projected part in a downward direction, and the bottom surface connected integrally at a lower end part of the outer lateral face. The bottom surface is formed to be tilted at a prescribed angle with respect to a horizontal plane.
    Type: Application
    Filed: August 21, 2018
    Publication date: October 28, 2021
    Applicant: KAIJO CORPORATION
    Inventors: Keisuke OHATA, Noriyuki SAKAMOTO
  • Patent number: 11154914
    Abstract: An ultrasonic transducer includes: a piezoelectric element having a plate-like shape and an area expansion vibration mode; and a vibration surface separated from main surfaces thereof and arranged in parallel to the main surfaces so as to be brought into contact with a liquid; a piezoelectric element receiving portion held in contact with a side surface of the piezoelectric element and configured to fix the piezoelectric element; and a vibration transmitting portion; and the vibration member having a space for surrounding the main surface formed by the vibration surface, the piezoelectric element receiving portion, and the vibration transmitting portion, wherein a vibration generated by the piezoelectric element is transmitted to the vibration surface through the piezoelectric element receiving portion and the vibration transmitting portion, and the vibration surface is vibrated in a direction orthogonal to a vibration direction in the area expansion vibration mode.
    Type: Grant
    Filed: December 21, 2017
    Date of Patent: October 26, 2021
    Assignee: KAIJO CORPORATION
    Inventor: Akihisa Nakano
  • Patent number: 11148355
    Abstract: Provided are a three-dimensional shaped object production device and method capable of producing a predetermined three-dimensional shaped object by forming a ball at a leading end of a conductive wire through use of the conductive wire based on scanned data or designed data and aligning and stacking the balls.
    Type: Grant
    Filed: September 12, 2017
    Date of Patent: October 19, 2021
    Assignee: KAIJO CORPORATION
    Inventor: Akihisa Nakano
  • Patent number: 11127709
    Abstract: A capillary transport device is capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. The capillary transport device includes: a first tube for transporting a capillary; an ultrasonic horn with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end of the first tube; and a mechanism for blowing gas into a second end of the first tube.
    Type: Grant
    Filed: November 25, 2019
    Date of Patent: September 21, 2021
    Assignee: KAIJO CORPORATION
    Inventor: Go Takemoto
  • Publication number: 20210154630
    Abstract: An ultrasonic homogenizer includes an ultrasonic transducer; an ultrasonic horn that irradiates an ultrasonic wave generated by the ultrasonic transducer; a holder that receives an irradiating surface of the ultrasonic horn; an intake port that is provided on a bottom face of the holder and intakes a mixture liquid into the holder; and an ejection port that is provided on the holder above the intake port and discharges the mixture liquid supplied inside the holder; an opening area of the intake port being smaller than an irradiating area of the ultrasonic horn and the irradiating surface of the ultrasonic horn being disposed above the intake port whereby facing the intake port.
    Type: Application
    Filed: November 20, 2020
    Publication date: May 27, 2021
    Applicant: Kaijo Corporation
    Inventors: Mineyuki SEKIMOTO, Hitoshi YAMAMOTO, Hiroshi HASEGAWA, Takashi KAWAMURA
  • Patent number: 10746725
    Abstract: Endotoxin is detected by electrochemical measurement. A detection device 15 of endotoxin detects endotoxin contained in a fluid to be tested (for example, a dialysate) specifically in the following manner. First, the fluid to be tested is brought into contact with an adsorbent 17 that adsorbs endotoxin to cause the adsorbent 17 to adsorb the endotoxin. Then, a basic solution is brought into contact with the adsorbent 17 to desorb the endotoxin. Electrochemical measurement of the basic solution containing the desorbed endotoxin is performed. The endotoxin can be detected by the electrochemical measurement with high sensitivity at low cost.
    Type: Grant
    Filed: June 27, 2018
    Date of Patent: August 18, 2020
    Assignees: SHINSHU UNIVERSITY, KAIJO CORPORATION, SHIBUYA CORPORATION
    Inventors: Jiye Jin, Nobuyuki Kurashina, Junichiro Soejima, Toshiharu Sawada
  • Patent number: 10629563
    Abstract: A ball forming device includes a first current control circuit to control discharge current arranged between a leading end of a wire and one electrode of a discharge continuing power source for causing discharge current to flow after dielectric breakdown, a second current control circuit to control shunting of discharge current arranged between a discharge electrode and the other electrode of the discharge continuing power source, and a fixed resistor connected to the second current control circuit in parallel as a shunt and controls current flowing through the second current control circuit, thereby a discharge voltage value is adequately changed.
    Type: Grant
    Filed: May 3, 2015
    Date of Patent: April 21, 2020
    Assignee: KAIJO CORPORATION
    Inventor: Yusuke Sakurai
  • Patent number: 10600754
    Abstract: There is provided a bonding method capable of accurately positioning a bonding stage. According to an aspect of the present invention, a bonding method using a bonding apparatus including a rotation drive mechanism for rotating a bonding stage 1 about a ?-axis includes the steps of: (e) locking the bonding stage with respect to the ?-axis, and bonding a wire or bump onto a certain area of a substrate held on the bonding stage; (f) unlocking the bonding stage with respect to the ?-axis, and rotating the bonding stage about the ?-axis with the rotation drive mechanism; and (g) locking the bonding stage with respect to the ?-axis, and bonding a wire or bump onto a remaining region of the substrate.
    Type: Grant
    Filed: February 28, 2017
    Date of Patent: March 24, 2020
    Assignee: KAIJO CORPORATION
    Inventors: Hideki Yoshino, Masaaki Miura
  • Patent number: 10529684
    Abstract: There is provided a capillary transport device capable of inserting, without manpower, a capillary into a mounting section of an ultrasonic horn. According to an aspect of the present invention, a capillary transport device includes: a first tube 17 for transporting a capillary 13; an ultrasonic horn 11 with a mounting section for mounting the capillary; a first movement mechanism for relatively moving the ultrasonic horn and a first end 17a of the first tube; and a mechanism for blowing gas into a second end 17b of the first tube.
    Type: Grant
    Filed: October 6, 2016
    Date of Patent: January 7, 2020
    Assignee: KAIJO CORPORATION
    Inventor: Go Takemoto
  • Patent number: 10262969
    Abstract: [Problem] To provide a bonding device capable of adequately controlling a leading end of a capillary when a ball formed at a leading end of a wire is pressed and bonded to an electrode of a semiconductor chip with scrub vibration.
    Type: Grant
    Filed: November 7, 2017
    Date of Patent: April 16, 2019
    Assignee: KAIJO CORPORATION
    Inventor: Akio Sugito
  • Patent number: 10022821
    Abstract: To provide a wire bonding method and a wire bonding device capable of stably forming a free air ball having a large ball diameter while suppressing oxidation of the free air ball, in addition to supply of an oxidation prevention gas from gas supply means (10) into an insertion portion (32), an oxidation prevention gas is supplied from a gas supply nozzle (40), which is arranged outside the insertion portion (32), so as to cover an inlet of the insertion portion (32). Under a state in which a leading end of a wire (74) is positioned inside the insertion portion (32), and in which a leading end of a capillary (3) is positioned outside the insertion portion (32), spark discharge is generated. With this, a free air ball (75) having a large ball diameter can be formed while suppressing oxidation of the free air ball (75) and stabilizing the free air ball (75).
    Type: Grant
    Filed: April 28, 2015
    Date of Patent: July 17, 2018
    Assignee: KAIJO CORPORATION
    Inventors: Hikaru Yoshida, Mizuho Shiroto
  • Patent number: 9935078
    Abstract: [Problem] To provide a bonding device in which a capillary can perform stable vibration from a low frequency to a high frequency while achieving lightening and downsizing of a load to be driven by a piezoelectric element and in which stable vibration can be transmitted to the capillary without disturbing operation of expansion and contraction of the piezoelectric element as keeping preliminary pressure to the capillary constant.
    Type: Grant
    Filed: February 19, 2015
    Date of Patent: April 3, 2018
    Assignee: KAIJO CORPORATION
    Inventor: Akio Sugito
  • Patent number: D867610
    Type: Grant
    Filed: April 30, 2018
    Date of Patent: November 19, 2019
    Assignee: KAIJO CORPORATION
    Inventors: Keisuke Ohata, Noriyuki Sakamoto
  • Patent number: D889593
    Type: Grant
    Filed: June 7, 2018
    Date of Patent: July 7, 2020
    Assignee: KAIJO CORPORATION
    Inventor: Akihisa Nakano