Abstract: A method for drying a substrate after the substrate is rinsed in a rinsing bath in which a rinsing liquid is contained. The substrate is vertically held selectively by first and second holders. The second holder is located between and below the first holders. Each of the first and second holders includes grooves with which the substrate is engageable. When the level of the rinsing liquid downwardly passes past the grooves of the first holders, the substrate is held solely by the second holder. Then, when the level of the rinsing liquid downwardly passes past the grooves of the second holder, the substrate is held solely by the first holder.

Abstract: A method and apparatus for drying a substrate after the substrate is rinsed in a rinsing bath in which a rinsing liquid is contained. The substrate is vertically held selectively by first and second holders. The second holder is located between and below the first holders. Each of the first and second holders includes grooves with which the substrate is engageable. When the level of the rinsing liquid downwardly passes past the grooves of the first holders, the substrate is held solely by the second holder. Then, when the level of the rinsing liquid downwardly passes past the grooves of the second holder, the substrate is held solely by the first holder.

Abstract: An ultrasonic shower cleaning apparatus includes a casing, a nozzle mounted to the downstream end of the casing, a substantially circular ultrasonic transducer operable to emit ultrasonic waves and oriented to face the upstream end of the nozzle, and an inlet port formed in the periphery of the casing to receive a cleaning liquid. The nozzle includes a right circular cylindrical outlet port through which the cleaning liquid along with the ultrasonic waves are released so as to ultrasonically clean an article. The outlet port extends axially through the nozzle and has a fixed diameter. The upstream end face of the nozzle is cone-shaped so as to be tapered in a direction toward the downstream end of the nozzle from its outer edge to the outlet port at a predetermined angle of inclination.

Abstract: A drying apparatus for washed objects is capable of drying the objects in a reduced period of time, effectively preventing contamination of the objects during drying thereof, and attaining energy saving and a reduction in consumption of chemicals used. Mist of an organic solvent is generated by means of an ultrasonic wave in an organic solvent mist generating tank and the objects are immersed in a pure water tank, the pure water tank and organic solvent mist generating tank are then operated to communicate with each other to discharge pure water and place the objects in an atmosphere of the organic solvent mist, and then nitrogen gas is fed to the pure water tank to purge the organic solvent mist with the nitrogen gas.

Abstract: An object levitating apparatus, an object transporting apparatus equipped with said object levitating apparatus, and an object levitating bearing as well as an object levitating process and object transporting process are described which, simultaneous to not placing restrictions on the material and so forth of the objects handled, are able to handle objects having relatively large weights and dimensions, while also being compact in size, inexpensive, preferable in terms of safety and so forth, and easy to control. The above effects are obtained by exciting a vibrator and levitating, transporting or bearing an object above the surface of the vibrator by the radiation pressure of the sound waves of the vibrator.

Abstract: A notched wafer aligning apparatus capable of aligning a number of notched wafers received in a cassette with each other at a predetermined position and facilitating shifting of the thus-aligned wafers to any desired position. A plurality of notch detection rollers are rotatably arranged in juxtaposition to each other on a rotation drive shaft so as to be rotated while being abutted against a lower portion of peripheral edges of the wafers through a lower open end of the cassette. The notch detection rollers are individually rotated due to friction between the notch detection rollers and the rotation drive shaft.

Abstract: An object levitating apparatus, an object transporting apparatus equipped with the object levitating apparatus, and an object levitating bearing as well as an object levitating process and object transporting process are described which, simultaneous to not placing restrictions on the material and so forth of the objects handled, are able to handle objects having relatively large weights and dimensions, while also being compact in size, inexpensive, preferable in terms of safety and so forth, and easy to control.

Abstract: A substrate transport path adjustment method allows adjustment of the transport path of a substrate. The substrate is placed between guide members, and a sensor is used to detect the presence of the substrate. The guide members are driven to approach the substrate until a sensor detects that the edges of the substrate are near the side walls of the guide members. Both guide members are moved in synchronization in the same direction to center the substrate with respect to the centerline of a prescribed path.

Abstract: The present invention discloses a wire bonder that does not require bonding tool replacement to be performed by an experienced worker, is not bothersome and can be completed in an extremely short time, while also enabling time management of the degree of wear of the bonding tool and so forth to be performed reliably, so as to realize improved work efficiency and yield, as well as being able to demonstrate various other effects. In addition, the present invention also discloses a bonding arm and bonding tool that contribute to the achieving of these effects. The above effects are obtained by adding a tool replacement device that removes a used bonding tool (capillary) installed in a bonding arm and installs a new bonding tool. In addition, the above effects are obtained with respect to the bonding arm and bonding tool by forming a tapered surface that guides their mutual insertion.

Abstract: The present invention discloses a wire guiding apparatus and wire guiding method that automatically guide a wire supplied from a wire feeding device through the insertion holes of at least a wire clamp and bonding tool using a guiding jig.

Abstract: A substrate transport path adjustment method allows adjustment of the transport path of a substrate to be completed by placing a magazine between regulating members for regulating the position of the magazine provided roughly in a straight line with respect to guide members which guide a substrate along a prescribed path, positioning the magazine with respect to the prescribed path by moving both regulating members in synchronization and in the same direction after causing the regulating members to engage with the magazine by moving them relatively in the direction in which they approach each other, pushing the substrate out from the magazine to bring it between the guide members, and causing the guide members to approach the substrate.

Abstract: A substrate transport path adjustment apparatus allows adjustment of the transport path of a substrate by placing a magazine between regulating members for regulating the position of the magazine provided roughly in a straight line with respect to guide members which guide a substrate along a prescribed path. The magazine is positioned with respect to the prescribed path by moving both regulating members in synchronization in the same direction after the regulating members engage the magazine by approaching each other. The substrate is pushed out from the magazine to bring the substrate between the guide members, and the guide members are driven to approach the substrate. Both guide members are moved in synchronization in the same direction to position the substrate with respect to the prescribed path.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.This wire bonder is able to compare and evaluate at least one set of image data of either a first bonding point or second bonding point in the form of bonded sites, or a wire spread between said first and second bonding points, with the positional data into which said image data has been incorporated in advance, and automatically perform inspection and make corrections.

Abstract: A substrate transport apparatus and substrate transport path adjustment method are described which allow adjustment of the transport path of a substrate to be completed by placing a magazine between regulating members for regulating the position of the magazine provided roughly in a straight line with respect to guide members which guide a substrate along a prescribed path, positioning the magazine with respect to the prescribed path by moving both regulating members in synchronization and in the same direction after causing the regulating members to engage with the magazine by moving them relatively in the direction in which they approach each other, pushing the substrate out from the magazine to bring it between the guide members, and causing the guide members to approach the substrate.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a bonded indentation is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: The present invention provides an apparatus and its method that is able to effectively use positional data such as coordinates and so forth stored in advance in a bonder.A first or second bonding point in the form of bonded sites is photographed by a camera based on commands from a control device, and inspection is performed as to whether a ball that has been bonded is present within a specified range at a location specified in advance and/or centering on said location.

Abstract: The present invention provides a wire bonder and its method that is able to automatically inspect whether an initial ball set with a keyboard has been formed.Ball formed on the end of a wire fed from capillary is placed on lead by driving of a bonding head, and the diameter of that ball is measured by photographing that ball by a camera after bonding a portion of the wire to which ball is connected.

Abstract: The present invention provides a wire bonder and its method able to reliably and efficiently perform non-contact detection of the misattachment of wires spread between the pads of various types of bonded components and a lead without damage to said bonded component. The present invention is equipped with a clamp provided above a capillary through which is passed a wire, a toroidal coil provided above the capillary without making contact with the wire, a high frequency oscillator that generates a high frequency to the toroidal coil, and a differentiation circuit that detects whether the wire connected to the bonded component is misattached, so that the present invention is able to detect whether the wire to be connected to the bonded component is misattached by this differentiation circuit. Alternatively, the toroidal coil is provided within a path that forms a loop between a clamping device, that performs cutting of the wire, and a bonding stage, without making contact with the line that composes said path.

Abstract: A bonder that allows replacement of the bonding tool, corresponding to changes in the type of bonded component, to be performed both easily and rapidly, while also preventing the occurrence of operator-initiated errors accompanying the changes in bonded component type. As a result of allowing a bonding plate, which jointly applies compressive force to bonded components with a bonding tool, to float freely while being held by a diaphragm, the bonded components are adhered to the pressing surface of the bonding tool by the unrestricted bending of the diaphragm so as to follow its motion, thus eliminating the need for an operator to adjust the inclination of the bonding tool, as is necessary in conventional bonders.