Abstract: A plasma lamp for use in a laser-sustained plasma (LSP) light source is disclosed. The plasma lamp includes a gas containment structure for containing a gas, a gas seal positioned at a base of the gas containment structure, a gas inlet, and a gas outlet. The plasma lamp includes a gas swirler including a set of nozzles configured to generate a vortex gas flow and a swirler shaft including an inlet channel for delivering the gas from the gas inlet to the nozzles and an outlet channel for delivering the gas from the gas containment structure to the gas outlet. The plasma lamp includes a distributor including one or more plenums to distribute the gas from the gas inlet into the swirler. The plasma lamp may also include a deflector fluidically coupled to the swirler shaft and extending above the set of nozzles and configured to direct gas flow around the swirler.

Abstract: A device used for semiconductor metrology includes a substrate and a plurality of pieces from one or more semiconductor wafers. Each piece of the plurality of pieces is bonded to the substrate at a respective position on the substrate. Each piece of the plurality of pieces includes a respective instance of a measurement test structure and an alignment mark. Each piece of the plurality of pieces has a known location from the one or more semiconductor wafers.

Abstract: A system for mask design repair may develop a simulation-based model of a layer thickness after one or more process steps for fabricating features on a sample, develop a transformed model of the fabrication process that emulates the simulation-based model and has a faster evaluation speed than the simulation-based model, and where the inputs to the transformed model include the input mask design, and where the outputs of the transformed model include one or more output parameters associated with fabrication of the input mask design as well as one or more sensitivity metrics describing sensitivities of the one or more output parameters to variations of the input mask design. The system may further receive a candidate mask design and generate a repaired mask design based on the transformed model and the candidate mask design.

Abstract: A beam of light is directed from a light source at a wafer on a chuck. The beam of light is reflected off the wafer toward a 2D imaging camera. Movable focus lenses in the path of the beam of light can independently change the illumination conjugate and the collection conjugate. A structured mask in an illumination path can be used and the beam of light can be directed through apertures in the structured mask. A gray field image of a wafer in a zone without direct illumination is generated using the 2D imaging camera and locations of defects on the wafer can be determined using the gray field image.

Abstract: An image of a portion of a semiconductor die is obtained that shows one or more structures in a first process layer and one or more structures in a second process layer. Using machine learning, a first region is defined on the image that at least partially includes the one or more structures in the first process layer. Also using machine learning, a second region is defined on the image that at least partially includes the one or more structures in the second process layer. An overlay offset between the one or more structures in the first process layer and the one or more structures in the second process layer is calculated using the first region and the second region.

Abstract: A system is disclosed, in accordance with one or more embodiments of the present disclosure. The system includes a metrology tool configured to acquire one or more measurements of a portion of a sample. The system includes a controller including one or more processors configured to execute program instructions causing the one or more processors to: generate a surface kinetics model output based on a surface kinetics model; determine an expected response of the surface kinetics model output to excitation by polarized light; compare the determined expected response to the one or more measurements; generate one or more metrics based on the comparison between the determined expected response and the one or more measurements of the sample; adjust one or more parameters of the surface kinetics model to generate an adjusted surface kinetics model; and apply the adjusted surface kinetics model to simulate on-sample performance during plasma processing.

Abstract: A wafer map is classified using the machine learning based model and a signature on the wafer map. The machine learning based model uses transfer learning. The machine learning based model can be trained using images from various sources that are extracted and augmented and their features extracted. These extracted features can be classified into defects that occur during semiconductor manufacturing.

Abstract: A product includes a semiconductor substrate, with at least first and second thin-film layers disposed on the substrate and patterned to define a matrix of dies, which are separated by scribe lines and contain active areas circumscribed by the scribe lines. A plurality of overlay targets are formed in the first and second thin-film layers within each of the active areas, each overlay target having dimensions no greater than 10 ?m×10 ?m in a plane parallel to the substrate. The plurality of overlay targets include a first linear grating formed in the first thin-film layer and having a first grating vector, and a second linear grating formed in the second thin-film layer, in proximity to the first linear grating, and having a second grating vector parallel to the first grating vector.

Abstract: An optical characterization system is disclosed. The optical characterization system may comprise a synchrotron source, an optical characterization sub-system, and a sensor configured to receive a projected image from a set of imaging optics. The optical characterization sub-system may include at least the set of illumination optics, a set of imaging optics, and a diffractive optical element, a temporal modulator or an optical waveguide configured to match an etendue of a light beam output by the synchrotron source to the set of illumination optics. A method of matching the etendue of a light beam is also disclosed.

Abstract: Methods and systems for realizing a high speed, rotating anode based x-ray illumination source suitable for high throughput x-ray metrology are presented herein. A high speed rotating anode includes a water cooled rotating platen supported by radial and thrust air bearings employing cascaded differential pumping. A very high bending stiffness of the rotating assembly is achieved by spacing radial air bearings far apart and locating a rotary motor and thrust bearings between the radial air bearings. The high bending stiffness increases the mechanical stability of the rotating assembly during high speed operation, and thus decreases vibration at the location of impingement of the electron beam on the rotating anode material. In some embodiments, magnetic thrust bearings are employed and the air gap is controlled to maintain a desired gap over an operational range of up to three millimeters.

Abstract: A thermo-pump includes a sealed casing, divided into a main casing volume and one or more secondary volumes. A thermo-pump includes a shaft. A thermo-pump includes a displacer, coupled to the shaft and oscillates to create a pressure gain between a high-pressure phase and a low-pressure phase. A thermo-pump includes one or more displacer rings, wherein the displacer rings are made from a material with thermal properties below a threshold. A thermo-pump includes an insert, wherein the insert is configured to form a perimeter of the main casing volume, wherein the insert is made from a material with thermal properties below the threshold. A thermo-pump includes one or more bushings, wherein the one or more bushing separate the main casing volume and the one or more secondary volumes. A thermo-pump includes one or more gas bearings configured to prevent contact between the shaft and the sealed casing.

Abstract: To measure the resistance area product of a high resistivity layer using a microscopic multi point probe, the high resistivity layer is sandwiched between two conducting layers. A plurality of electrode configurations/positions is used to perform three voltage or resistance measurements. An equivalent electric circuit model/three layer model is used to determine the resistance area product as a function of the three measurements.

Abstract: A pulse-assisted LSP broadband light source in flowing high-pressure liquid or supercritical fluid is disclosed. The light source includes a fluid containment structure for containing a high-pressure liquid or supercritical fluid. The light source includes a primary laser pump source and a high-repetition pulse-assisting laser light source. wherein the primary laser pump source is configured to direct a primary pump beam into a plasma-forming region of the fluid. The primary beam and the pulsed-assisting beam are configured to sustain a plasma within the plasma-forming region of the fluid within the fluid containment structure. A light collector element is configured to collect broadband light emitted from the plasma for use in downstream applications.

Abstract: A metrology system may include a metrology tool to selectively perform metrology measurements in a static mode in which one or more metrology targets on a sample are stationary during a measurement or a scanning mode in which one or more metrology targets are in motion during a measurement, and a controller communicatively coupled to the translation stage and at least one of the one or more detectors. The controller may receive locations of metrology targets on the sample to be inspected, designate the metrology targets for inspection with the static mode or the scanning mode, direct the metrology tool to perform metrology measurements on the metrology targets in the static mode or the scanning mode based on the designation, and generate metrology data for the sample based on the metrology measurements on the metrology targets.

Abstract: The present disclosure provides an inspection system and a method of stray field mitigation. The system includes an array of electron beam columns, a first permanent magnet array, and a plurality of shielding plates. The array of electron beam columns each includes an electron source configured to emit electrons toward a stage. The first permanent magnet array is configured to condense the electrons from each electron source into an array of electron beams. The first permanent magnet array is arranged at a first end of the array of electron beam columns. The plurality of shielding plates extend across the array electron beam columns downstream of the first permanent magnet array in a direction of electron emission. The array of electron beams pass through a plurality of apertures in each of the plurality of shielding plates, which reduces stray magnetic field in a radial direction of the array of electron beams.

Abstract: An array of localized auto-focus sensors provides direct measurement of the working distance between each microscope column in the array and the substrate being imaged below. The auto-focus sensors measure the working distance between each column and the imaging substrate as it passes over a point on the substrate to be imaged. The working distance measurement from the sensors is input into a control system, which in turn outputs the required working distance adjustment to the microscope column. The control system independently adjusts microscope working distance and/or physical distance of an individual microscope column in a multi-column microscope based on auto-focus sensor input. The individual microscope columns in the multi-column microscope can also be used as the auto-focus sensor itself.

Abstract: A system for generating pump illumination for laser sustained plasma (LSP) is disclosed. The system may include an illumination source configured to output a pump beam, one or more focusing optics, and one or more beam shapers configured to reshape the pump beam to provide a shaped pupil power distribution at an illumination pupil plane of the one or more focusing optics. The shaped pupil power distribution may include at least one of a flat-top distribution or an inverted distribution with a central local intensity minimum. Further, the one or more focusing optics may receive the pump beam from the one or more beam shapers and direct the pump beam to a plasma-forming material, whereby the pump beam at least one of forms or maintains a plasma that emits broadband illumination.

Abstract: A method of forming a high-pressure plasma lamp includes providing a lamp bulb. The lamp bulb includes a top channel and a bottom channel. The method includes inserting a top electrode element into the top channel of the lamp bulb. The method includes providing a glass tubular structure attached to a bottom electrode element. The method includes filling the lamp bulb with a liquified gas through the bottom channel of the lamp bulb. The method includes inserting the bottom electrode element and the glass tubular structure into the bottom channel.

Abstract: A metrology system includes one or more through-focus imaging metrology sub-systems communicatively coupled to a controller having one or more processors configured to receive a plurality of training images captured at one or more focal positions. The one or more processors may generate a machine learning classifier based on the plurality of training images. The one or more processors may receive one or more target feature selections for one or more target overlay measurements corresponding to one or more target features. The one or more processors may determine one or more target focal positions based on the one or more target feature selections using the machine learning classifier. The one or more processors may receive one or more target images captured at the one or more target focal positions, the target images including the one or more target features of the target specimen, and determine overlay based thereon.

Abstract: A context-based inspection system is disclosed. The system may include an optical imaging sub-system. The system may further include one or more controllers communicatively coupled to the optical imaging system. The one or more controllers may be configured to: receive one or more reference images; receive one or more test images of a sample; generate one or more probabilistic context maps during inspection runtime using an unsupervised classifier; provide the generated one or more probabilistic context maps to a supervised classifier during the inspection runtime; and apply the supervised classifier to the received one or more test images to identify one or more DOIs on the sample.