Abstract: An inorganic coating may be applied to bond optically scattering particles or components. Optically scattering particles bonded via the inorganic coating may form a three dimensional film which can receive a light emission, convert, and emit the light emission with one or more changed properties. The inorganic coating may be deposited using a low-pressure deposition technique such as an atomic layer deposition (ALD) technique. Two or more components, such as an LED and a ceramic phosphor layer may be bonded together by depositing an inorganic coating using the ALD technique.

Abstract: A LED lighting module is described that is realized as a printed circuit assembly. The LED lighting module has a carrier with a strip of dielectric material and conductive circuit tracks printed on the dielectric material. Bare LED dies are mounted in a linear formation on the carrier. The width of the LED die formation does not exceed 0.75 mm and the area of the emission face of an LED die does not exceed 0.0625 mm2. Drivers are mounted on the carrier and are connected to drive the LED dies.

Abstract: A lighting module includes a first light source that generates a low beam with a bright/dark cut-off line and a second light source. First optics redirects a first part of light from the first light source to create a main part of the low beam substantially below the bright/dark cut-off line. Second optics is spaced apart from the first optics and redirects a second part of light from the first light source to create a zone III beam of the low beam substantially above the bright/dark cut-off line and redirects a fourth part of light from the second light source to create a concentrated beam of the high beam in front of the vehicle. Third optics redirects a third part of light from the second light source to create a main part of a high beam.

Abstract: A reflective layer for use in lighting devices and methods of forming the reflective layer are provided. The reflective layer may include a dielectric layer including one or more insulating materials. An intermediate layer may be formed on the dielectric layer. The intermediate layer may include one or more materials having a higher enthalpy of reaction than the one or more insulating materials. Because of the higher enthalpy of reaction, atoms of the one or more materials in the intermediate layer may form bonds with atoms of the one or more insulating materials. A metal layer may be formed on the intermediate layer to reflect light emitted from an active region of a light emitting diode (LED).

Abstract: A sensor system comprises an LED arranged to emit light and to detect a portion of the emitted light that is scattered or reflected back to the LED. A sensing method comprises detecting with an LED light emitted by the LED and scattered or reflected back to the LED and determining a change in voltage-current characteristics of the LED resulting from detection of the scattered or reflected light. The sensor system and the sensing method may be used, for example, to determine properties of particles in a fluid into which the LED emits light or to determine the presence or absence of an object located between the LED and a reflective or scattering surface.

Abstract: A method is described for low temperature curing of silicone structures, including the steps of providing patterning photoresist structures on a substrate. The photoresist structures define at least one open region that can be at least partially filled with a condensation cure silicone system. Vapor phase catalyst deposition is used to accelerate the cure of the condensation cure silicone, and the photoresist structure is removed to leave free standing or layered silicone structures. Phosphor containing silicone structures that are coatable with a reflective metal or other material are enabled by the method.

Abstract: A wavelength converting layer may have a glass or a silicon porous support structure. The wavelength converting layer may also have a cured portion of wavelength converting particles and a binder laminated onto the porous glass or silicon support structure.

Abstract: This specification discloses LED arrays comprising a grid structure that physically and optically isolates adjacent LEDs or groups of LEDs in the array from each other. The grid structure comprises an arrangement of walls defining cells. Individual LEDs or groups of LEDs in the array are positioned within different ones of the cells, separated from adjacent LEDs or groups of LEDs by the grid walls. This specification also discloses fabrication processes for such LED arrays. In these fabrication processes, the grid structure is formed as a separate monolithic structure. The LEDs or pcLEDs are arranged on and attached to a substrate (for example, a printed circuit board), after which the grid structure is attached to the substrate in registry with the arrangement of LEDs or pcLEDs.

Abstract: An optical isolation material may be applied to walls of a first cavity and a second cavity in a wafer mesh. A wavelength converting layer may be deposited into the first cavity to create a first segment and into the second cavity to create a second segment. The first segment may be attached to a first light emitting device to create a first pixel and the second segment to a second light emitting device to create a second pixel. The wafer mesh may be removed.

Abstract: An apparatus and method for displaying an image are disclosed. The apparatus includes independently-controllable microLED unit cells including sets of microLEDs each emitting light and at least one lens to control an emission angle and emission profile of the light emitted by the microLED unit cells. A display controller controls an intensity distribution of the microLED unit cells in accordance with a video data signal such that a first portion of the emitted light is emitted at a first emission angle with a first emission profile and a second portion of the emitted light is emitted at a second emission angle with a second emission profile. The first and second light portions form three-dimensional stereoscopic images.

Abstract: Various embodiments include combined lens and safety enclosure apparatuses and methods for forming the apparatuses. In one example a combined lens and safety enclosure apparatus for a light-emitting diode (LED) module is disclosed. The enclosure apparatus includes at least one plastic-material-based optical-lens element mounted over a plurality of LED elements, where a distance between the optical-lens element and any portion of any one of the plurality of LED elements is spaced away from each other by at least 0.8 mm. A driver-on-board (DoB) subsystem, including an electronic circuit configured to provide power to the plurality of LED elements, has a plastic-material-based optical enclosure mounted over the DoB subsystem. A distance between the optical enclosure and any portion of any of the electronic circuit is spaced away from optical enclosure by at least 0.8 mm. Other devices and methods are described.

Abstract: A device may include a metal contact between a first isolation region and a second isolation region on a first surface of an epitaxial layer. The device may include a first sidewall and a second sidewall on a second surface of the epitaxial layer distal to the first isolation region and the second isolation region. The device may include a wavelength converting layer on the epitaxial layer between the first sidewall and the second sidewall.

Abstract: An LED array comprises a first mesa comprising a top surface, at least a first LED including a first p-type layer, a first n-type layer and a first color active region and a tunnel junction on the first LED, a second n-type layer on the tunnel junction, the second n-type layer comprising at least one n-type III-nitride layer with >10% Al mole fraction and at least one n-type III-nitride layer with <10% Al mole fraction. The LED array further comprises an adjacent mesa comprising a top surface, the first LED, a second LED including the second n-type layer, a second p-type layer and a second color active region. A first trench separates the first mesa and the adjacent mesa, cathode metallization in the first trench and in electrical contact with the first and the second color active regions of the adjacent mesa, and anode metallization contacts on the n-type layer of the first mesa and on the anode layer of the adjacent mesa.

Abstract: An automotive headlight is disclosed including: an optical unit including a plurality of optical elements, each optical element having a different central direction; a segmented light-emitting diode (LED) chip including a plurality of LEDs that are separated by trenches formed on the segmented LED chip and arranged in a plurality of sections, each section being aligned with a different respective optical element, and each section including at least one first LED and at least one second LED; and a controller configured to: apply a forward bias to each of the first LEDs, apply a reverse bias to each of the second LEDs, and change a brightness of the first LEDs in any section based on a signal generated by the second LED in that section.

Abstract: A method according to embodiments of the invention includes creating a three-dimensional profile of a scene, calculating a relative amount of light for each portion of the scene based on the three-dimensional profile, and activating a light source to provide a first amount of light to a first portion of the scene, and a second amount of light to a second portion of the scene. The first amount and the second amount are different. The first amount and the second amount are determined by calculating a relative amount of light for each portion of the scene.

Abstract: A micro-light emitting diode (uLED) device comprises: a mesa comprising: a plurality of semiconductor layers including an n-type layer, an active layer, and a p-type layer; a p-contact layer contacting the p-type layer; a cathode contacting the first sidewall of the n-type layer; a first region of dielectric material that insulates the p-contact layer, the active layer, and a first sidewall of the p-type layer from the cathode; an anode contacting the top surface of the p-contact layer; and a second region of dielectric material that insulates the active layer, a second sidewall of the p-type layer, and the second sidewall of the n-type layer from the anode. The top surface of the p-contact layer has a different planar orientation compared to the first and second sidewalls of the n-type layer. Methods of making and using the uLED devices are also provided.

Abstract: A light source includes a first light emitting diode (LED) die configured to emit a first die color and a second LED die configured to emit a second die color, the first and second LED dies provided on a substrate. A first filling covering the first LED die, and includes a first phosphor to convert the first die color to a first illuminous color. A second filling covering the second LED die and extending to the first filling, and includes a second phosphor to convert the second die color to a second illuminous color that has a higher absorption energy than an illumination energy of the first illuminous color.

Abstract: A system, method and device for use as a reflector for a light emitting diode (LED) are disclosed. The system, method and device include a first layer designed to reflect transverse-electric (TE) radiation emitted by the LED, a second layer designed to block transverse-magnetic (TM) radiation emitted from the LED, and a plurality of ITO layers designed to operate as a transparent conducting oxide layer. The first layer may be a one-dimension (1D) distributed Bragg reflective (DBR) layer. The second layer may be a two-dimension (2D) photonic crystal (PhC), a three-dimension (3D) PhC, and/or a hyperbolic metamaterial (HMM). The 2D PhC may include horizontal cylinder bars, vertical cylinder bars, or both. The system, method and device may include a bottom metal reflector that may be Ag free and may act as a bonding layer.

Abstract: Light emitting devices having a first LED with a first phosphor, a second LED with a second phosphor and a third LED with a third phosphor to emit a composite white light are described. The first LED and first phosphor emit the red spectral component, the second LED and the second phosphor emit the blue spectral component and the third LED and third phosphor emit the green spectral component of the composite white light. The green spectral component has at least 30% radiant flux in a deep red spectral wavelength region.

Abstract: A light emitting diode (LED) device comprises: an interposer comprising: an interposer body, a plurality of pillars on a first surface of the interposer body, and two or more local fiducials on the first surface of the interposer body; an LED die comprising a die body and a first die surface comprising a plurality of light emitting diodes (LEDs), the LED die being mounted on the plurality of pillars; and a flux material located between each of the pillars and a second die surface of the die body, the second die surface of the die body being opposite the first die surface, there being no flux material on a fiducial surface of each of the local fiducials. Methods of manufacturing a light emitting diode (LED) devices comprise: printing a flux material onto the pillars of the interposer, attaching an LED die to the pillars, and washing away excess flux material.