Abstract: A thin plate storage transport system including a pressure container for containing a thin plate provided with a container main body for containing one or a plurality of thin plates, a lid body attached by covering the container main body, and a seal for airtightly isolating a containing space formed inside from an outside environment when the container main body is closed and covered by the lid body; and a pressure supply device for setting a pressure inside the containing space at a set pressure higher than an outside pressure by supplying a pressure into the containing space of the pressure container for containing a thin plate. As a result, the inside of the containing space can be kept at high cleanliness for a long time.

Abstract: A buckle serves to fix together a lower container part and an upper container part of a thin plate storage container. The buckle includes a plate-shaped main body, an upper hook having a groove engaged with a locking plate of the upper container part, a lower hook having a groove engaged with a locking plate of the lower container part, spring mounting recesses formed at center positions of the upper hook and the lower hook, leaf springs which are fitted in the spring mounting recesses, and locking protrusions at the middle of the leaf springs and fitted into notches formed in the locking plates of the lower container part and the upper container part to position and support the lower container part and the upper container part. The upper hook and the lower hook are vertically and horizontally symmetric.

Abstract: Arbitrary pieces of semiconductor wafers are supported flexibly on either the upper side or the lower side. The present invention is a thin plate container for supporting plural semiconductor wafers for use in carriage, storage, processing, etc. It comprises processing trays plurally stacked in a state of each supporting at least one semiconductor wafer individually and a coupling mechanism for integrally coupling the processing trays in a state where the processing trays are plurally stacked and separating the processing trays at an arbitrary location. Each processing tray has a one-side support for supporting at least one semiconductor wafer on its one side and the other-side support mutually fitted to the one-side support of the other processing tray on the other side to form a housing space sealed off from the external environment for constraining and supporting the thin plate.

Abstract: A single thin plate storage container 1 includes a main body 2 for storing one thin wafer A4 inside and a lid attached to the main body 2. The single thin plate storage container 1 includes a bottom side support member 35 that is located on the main body 2 side and supports the lid 3 from the bottom side, and a front side support member 36 that is located on the lid 3 side and supports the thin wafer 4A from the upper front side. The bottom side support member 35 includes a center support part 37, an outer periphery support part 38, a peripheral edge support part 39, and a ring plate 40 for combining integrally the center support part 37 and the outer support part 38. The front side support member 36 includes a disc 43 for covering the thin wafer 4A from the upper side and abutting parts 44, 45 to sandwich the thin wafer 4A between the two abutting parts and the bottom side support member 35.

Abstract: A wafer container with wafer-mounting cushion sheets prevents breaking and damage of semiconductor wafers due to impacts or repetitive warping by maintaining the semiconductor wafer in a flat state and enables the semiconductor wafer to be removed safely and easily without damage. The surface of each wafer-mounting cushion sheet includes a self-sucking portion for exerting a removable vacuum on the semiconductor wafer and a non-sucking portion for enabling separation of the semiconductor wafer.

Abstract: A wafer-retaining unit (20) has a plurality of vertically superimposed single-wafer retaining sections (21 to 23), each having a wafer-retaining frame (21) abutting against only a lower end edge portion of the outer periphery of a semiconductor wafer (W), a wafer-securing frame (22) disposed vertically movably relative to the wafer-retaining frame (21) to abut against only an upper end edge portion of the outer periphery of the semiconductor wafer (W), and wafer lift members (23) that lift up the semiconductor wafer (W) to a position where it is upwardly separate from the wafer-retaining frame (21) and keep the semiconductor wafer (W) in this position. Consequently, a plurality of semiconductor wafers (W) can be accommodated efficiently and safely without increasing the space between each pair of mutually adjacent semiconductor wafers (W). At the same time, the semiconductor wafers (W) can be loaded and unloaded satisfactorily.

Abstract: A wafer-retaining cushion sheet (5) has a wafer suction-adhering surface (5C) formed on a surface thereof, which adheres by suction to a semiconductor wafer (W). A wafer tray (1) is provided with a plurality of bottom openings (17) opening to the reverse side of the wafer-retaining cushion sheet (5), an air chamber (16) communicating with the bottom openings, and an air inlet (11) for supplying pressurized air into the air chamber (16) from the outside. Consequently, when pressurized air is supplied into the air chamber (16) through the air inlet (11) to increase the air pressure in the air chamber (16), the wafer-retaining cushion sheet (5) is elastically deformed into an inflated form at regions facing the bottom openings (17), thus causing separation between the semiconductor wafer (W) and at least a part of the wafer suction-adhering surface (5C) of the wafer-retaining cushion sheet (5).

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A wafer-retaining cushion sheet (5) has a wafer suction-adhering surface (5C) formed on a surface thereof, which adheres by suction to a semiconductor wafer (W). A wafer tray (1) is provided with a plurality of bottom openings (17) opening to the reverse side of the wafer-retaining cushion sheet (5), an air chamber (16) communicating with the bottom openings, and an air inlet (11) for supplying pressurized air into the air chamber (16) from the outside. Consequently, when pressurized air is supplied into the air chamber (16) through the air inlet (11) to increase the air pressure in the air chamber (16), the wafer-retaining cushion sheet (5) is elastically deformed into an inflated form at regions facing the bottom openings (17), thus causing separation between the semiconductor wafer (W) and at least a part of the wafer suction-adhering surface (5C) of the wafer-retaining cushion sheet (5).

Abstract: A loading tray 13 supports at least one thin plate safely and reliably. It comprises a first loading portion 18, provided on one side thereof, on which at least one thin plate is loaded; a second loading portion 19, provided on the other side thereof, fitted to the first loading portion 18 of adjacent loading tray 13 to form a housing space sealed off from the external environment, for sandwiching the thin plate within the housing space, and for loading the thin plate on the loading tray when the loading tray is placed upside-down; a hook 30, provided on one side thereof, for coupling with an adjacent loading tray 13; and a hook locking mechanism 31, provided on the other side thereof, for coupling with the hook 30 of an adjacent loading tray 13. As many loading trays 13 as the number of the thin plate is stacked to constitute a thin plate container 11. The thin plate container 11 can support the thin plate from both upper and lower sides.

Abstract: An optical sheet of the present invention is constituted by a micro-lens array sheet formed with a flat face and a back face having micro lenses aligned laterally and longitudinally and an anisotropic light-absorbing sheet with different light absorbing properties depending on incident angle of incident light entering an incident face arranged oppositely and proximally to each other. The optical sheet may be constituted by the micro-lens array sheet, the anisotropic light-absorbing sheet, a pinhole array sheet and a light diffusing sheet arranged proximally in this order. In an image display device of the present invention, the optical sheet of the present invention is arranged proximally to a display face of an image display element. The anisotropic light-absorbing sheet of the present invention has through cavities surrounded by light-absorbing side walls mutually sharing the side walls and collected closely in a large number.

Abstract: The present invention is directed to a lid unit having a latching mechanism for firmly fixing the lid unit to a container body for containing semiconductor wafers and the like, which latching mechanism can be easily disassembled for cleaning and drying of its components, and to a wafer presser for retaining the semiconductor wafers in position when the container is shaken. The latching mechanism includes a locking member which, when projected, secures the lid unit to the container body; an actuator for moving the locking member between projected and retracted positions; a tip-side cam for pressing a tip portion of the locking member in one direction relative to the lid unit when the locking member is projected by the actuator; a base-end lower cam for pressing a base-end of the locking member in a second direction, opposite the one direction; and a base-end upper cam and a cam projection follower for pressing the base-end in the second direction.

Abstract: The present invention supports a reticle 12 in a safe and secure manner. A reticle-carrying container 11 includes a pod 13 for storing the reticle 12, a door 14 and a seal 15 for blocking and sealing hermetically the pod 13. A pair of reticle retainers 25 and 45 is provided on the insides of the pod 13 and door 14. Each of the reticle retainers 25 and 45 includes an inclined plane 28 that contacts an upper corner 12A or a lower corner 12B of peripheral edge of the reticle 12 and supports the reticle 12 elastically. The inside of the inclined plane 28 is provided with concave portions 31 and 52 that enables a shock-absorbing function of allowing the deformation of the inclined plane 28 and supporting the reticle elastically, at the time of contact with the upper corner 12A or the lower corner 12B of peripheral edge of the reticle 12.

Abstract: The present invention allows a reticle-carrying container 11 to be fastened in a reticle stocker 2 even if the reticle-carrying container 11 is wrongly oriented. The reticle-carrying container 11 includes an interior with an opening at one end for storing a reticle 12, a door 14 for covering and blocking the opening, and a seal material 15 for sealing the interior hermetically when the door 14 closes the pod 13. The reticle-carrying container 11 is provided with two sets of kinematic pin grooves 61 for positioning and fastening the reticle-carrying container 11, which are turned 180 degrees from each other on the outer surface of the door 14. Receiving parts 22 for receiving and holding the kinematic pin grooves 61 are arranged in the positions corresponding to the kinematic pin grooves 61 on the outer surface of the pod 13 so that the two sets of kinematic pin grooves 61 can be engaged with the pins in both orientations.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: The attaching-and-detaching operation of a lid unit, and the operation of taking in and out semiconductor wafers stored in a container body are facilitated. Thin-plate supporting units for supporting semiconductor wafers are provided in the container body of a thin-plate supporting container, and wafer holding units for pressing and supporting the semiconductor wafers, supported by the thin-plate supporting units, from a lid unit side are provided inside a lid unit. The area of a lower surface of a V-shaped groove of the wafer holding unit is increased. The V-shaped groove easily fits the peripheral portion of the semiconductor wafer when attaching the lid unit to the container body. The lower surface of a V-shaped groove of the thin-plate supporting portion is roughened to enhance slipping property with respect to the semiconductor wafer. The angle of inclination of a ridge is determined to be 2 to 5 degrees with respect to the horizontal direction.

Abstract: A thin plate supporting container includes a container body for housing therein semiconductor wafers, a lid unit for closing the container body, and slotted plates for supporting the semiconductor wafers from opposing sides. There are provided an upper fitting portion for supporting an upper portion of the slotted plate, and a lower fitting portion for supporting a lower portion of the slotted plate. An upper fitting piece of the upper fitting portion has a planar contact face which comes into contact with the slotted plate to thereby position the slotted plate in the front/rear direction while suppressing swing of the slotted plate. The upper receiving element on the slotted plate has a planar contact face. The lower fitting portion provides vertical, horizontal and front/rear positioning.

Abstract: A wafer storage container has a container body and a lid. The container body has lid support inserts in a lid receptacle, and the lid has corner inserts for contact with the lid support inserts to support the lid. A supporting member is attached to the container body. The supporting member includes a base plate portion, side plates extending from the base plate portion, and a handle on each side plate for lifting the container body. The thin plate supporting member has contacting portions to support the thin plates, supporting members which elastically support the contacting portions, and a base support bar to support the supporting portions. The tip end of each supporting portion contacts a support stage, and elastically supports the contacting portions from both sides.