Patents Assigned to Mitsui Mining & Smelting Co., Ltd.
  • Publication number: 20210327848
    Abstract: A method for producing a semiconductor package, capable of effectively suppressing contamination of a chemical liquid and unintended peeling-off of a reinforcing sheet, is provided. This method includes providing a tacky sheet including a substrate sheet, and a soluble tacky layer and a banking tacky layer on at least one surface of the substrate sheet; making a first laminate including a redistribution layer; using the tacky sheet to obtain a second laminate having a second support substrate bonded to a surface on the redistribution layer side of the first laminate with the tacky layer therebetween; peeling off the first support substrate, pretreating the resulting third laminate; mounting a semiconductor chip on a pretreated surface of the redistribution layer; immersing the third laminate in a solution to dissolve or soften the tacky layer; and peeling off the second support substrate in a state where the tacky layer is dissolved or softened.
    Type: Application
    Filed: November 11, 2019
    Publication date: October 21, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshimi NAKAMURA, Tetsuro SATO
  • Publication number: 20210318278
    Abstract: There is provided a separation method in which a target component in a solution can be separated simply but safely and efficiently without contamination from the environment. This method includes: providing a solution containing a target component, and a reaction reagent; while continuously feeding the solution and the reaction reagent to a flow path, intermittently injecting bubbles into the flow path to produce a gas-liquid slug flow in which a mixed liquid containing the solution and the reaction reagent is segmented into a plurality of droplets by the bubbles; continuing the feed of the gas-liquid slug flow in the flow path, thereby facilitating the mixing of the solution and the reaction reagent, and the gasification of the target component by the mixing, in each droplet, and the movement of a target component-derived gas produced by the gasification to the bubbles; and recovering the target component-derived gas with an absorbing liquid.
    Type: Application
    Filed: November 27, 2019
    Publication date: October 14, 2021
    Applicants: MITSUI MINING & SMELTING CO., LTD., BL TEC K.K.
    Inventors: Makoto NAGAOKA, Fumihiro YOSHINAGA, Atsumi KOYANAGI, Shunichi HATAMOTO, Yozo ISHIHARA, Makiko KUMAGAI, Takashi NISHIMURA
  • Patent number: 11142464
    Abstract: Provided is a beta zeolite also having exceptional catalytic activity as a catalyst other than an olefin epoxidation catalyst. This beta zeolite is synthesized without using an organic structure-directing agent and has titanium in the structural skeleton thereof, the Ti content being 0.10 mmol/g or higher. This beta zeolite preferably has an Si/Ti molar ratio of 20-200. Also, the Si/Al molar ratio is preferably 100 or higher.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: October 12, 2021
    Assignees: Mitsui Mining & Smelting Co., Ltd., NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY
    Inventors: Yoshihiro Kubota, Satoshi Inagaki, Yuya Ikehara, Mei Takeyama, Yasuo Yamazaki
  • Patent number: 11141721
    Abstract: Provided is a porous structure for exhaust purification catalysts having excellent light-off temperature characteristics. The porous structure for exhaust purification catalysts includes an oxygen storage component and an inorganic porous solid. The porous structure has a pore volume distribution such that the ratio of the pore volume of pores with a diameter of from 15 nm to less than 25 nm to the pore volume of pores with a diameter of from 5 nm to less than 15 nm is 1.3 to 2.5 as measured with a mercury porosimeter. The pore volume distribution preferably has at least one peak top in a pore diameter range of from 15 nm to less than 25 nm.
    Type: Grant
    Filed: August 5, 2019
    Date of Patent: October 12, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Yusuke Hosoi, Hironori Iwakura, Takashi Wakabayashi, Yunosuke Nakahara
  • Publication number: 20210313237
    Abstract: There is provided a laminated sheet with which the electrical inspection of a redistribution layer formed later can be efficiently performed, while the laminated sheet is in the form of a sheet useful for the formation of a redistribution layer. This laminated sheet includes a carrier with a release function; a first electrically conductive film provided on the carrier with the release function; an insulating film provided on the first electrically conductive film; and a second electrically conductive film provided on the insulating film. The second electrically conductive film is used for formation of a redistribution layer, and the first electrically conductive film, the insulating film, and the second electrically conductive film function as a capacitor for performing electrical inspection of the redistribution layer.
    Type: Application
    Filed: June 16, 2021
    Publication date: October 7, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori MATSUURA, Takenori YANAI, Rintaro ISHII
  • Patent number: 11123709
    Abstract: To provide a molded article which can have excellent strength, can also have high durability during repeated use, and can maintain high adsorption performance even when the content of a binder resin is reduced. A molded article containing cerium oxide particles and a binder resin, wherein cerium oxide particles which has an average particle diameter of 1 to 15 ?m and in each of which a crystallite size is 40 to 200 ? are used.
    Type: Grant
    Filed: January 31, 2018
    Date of Patent: September 21, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Asuka Sasakura, Katsuhiko Hayashi, Atsushi Kurosaki, Masanori Sato, Kazuya Kinoshita, Takahito Asanuma, Seiji Moriuchi
  • Publication number: 20210288307
    Abstract: The present invention provides a positive electrode active material with which an increase in the interface resistance between the positive electrode active material and a sulfide solid electrolyte over time can be suppressed and also the interface resistance is low. The positive electrode active material of the present invention includes particles that have core particles containing a complex oxide of lithium and a metal element and a coating layer arranged on the surface of the core particles, and is used in a solid-state battery containing a sulfide solid electrolyte. The coating layer is composed of an oxide containing Li and M, where M represents one or two or more elements selected from the group consisting of B, Nb, Ti, Zr, Ta, Zn, W, and Al, or M is B when M represents one element. The molar ratio of Li/M on the surface of the coating layer, as obtained by X-ray photoelectron spectroscopy, is from 0.85 to 3.95.
    Type: Application
    Filed: July 23, 2019
    Publication date: September 16, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yuki NAKAYAMA, Daisuke WASHIDA, Hitohiko IDE
  • Patent number: 11110439
    Abstract: In relation to a Cu-based delafossite-type oxide that is effective as an exhaust gas purification catalyst, Cu is placed in a high catalytic activity low-valence state, whereby a novel Cu-based delafossite-type oxide having higher activity than in the past is provided. Proposed is a delafossite-type oxide for an exhaust gas purification catalyst that is represented by a general formula ABO2, wherein Cu and Ag are contained in the A site of the general formula, one or two or more elements selected from the group consisting of Mn, Al, Cr, Ga, Fe, Co, Ni, In, La, Nd, Sm, Eu, Y, V, and Ti are contained in the B site of the general formula, and Ag is contained at a ratio of 0.001 at. % or more and less than 20 at. % in the A site of the general formula.
    Type: Grant
    Filed: December 22, 2017
    Date of Patent: September 7, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Sumio Kato, Masataka Ogasawara, Toshiharu Moriya, Katsuya Iwashina, Hironori Iwakura
  • Publication number: 20210274650
    Abstract: There is provided a laminate that can suppress the warpage of a laminated product when used for the manufacture of the laminated product. This laminate includes a float glass substrate having a top surface and a bottom surface; and a metal layer provided on the top surface side of the float glass substrate.
    Type: Application
    Filed: May 11, 2021
    Publication date: September 2, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Rintaro ISHII, Toshimi NAKAMURA, Yoshinori MATSUURA
  • Patent number: 11108084
    Abstract: A novel sulfide solid electrolyte containing Li, P, S, and a halogen, which can be used as a solid electrolyte for a lithium secondary battery or the like, and is able to suppress the generation of a hydrogen sulfide gas even when exposed to moisture in the atmosphere. The sulfide solid electrolyte comprises a crystal phase or a compound having an argyrodite-type structure and containing Li, P, S, and a halogen; and a compound composed of Li, Cl, and Br and having a peak at each position of 2?=29.1°±0.5° and 33.7°±0.5° in an X-ray diffraction pattern.
    Type: Grant
    Filed: November 6, 2019
    Date of Patent: August 31, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Tsukasa Takahashi, Takahiro Ito, Takashi Chikumoto, Teruaki Yagi
  • Patent number: 11097260
    Abstract: A substrate (11) includes an inflow-side cell (21), an outflow-side cell (22), and a porous, gas-permeable partition wall (23) that separates the inflow-side cell (21) and the outflow-side cell (22) from each other, and also includes a first catalyst portion (14) that is provided on a side of the partition wall (23) that faces the inflow-side cell (21) at least at a portion in upstream side in an exhaust gas flow direction, and a second catalyst portion (15) that is provided on a side of the partition wall that faces the outflow-side cell at least at a portion in downstream side.
    Type: Grant
    Filed: March 19, 2019
    Date of Patent: August 24, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hiroki Kurihara, Yu Sakurada, Yusuke Nagai, Yoshinori Endo, Takeshi Nabemoto, Shingo Akita
  • Patent number: 11071214
    Abstract: Provided is a method of manufacturing a multilayer wiring board, in which electrical inspection can be performed with accurate probing while warpage of a multilayer laminate is reduced. This method includes providing a laminated sheet including a first support, a first release layer and a metal layer; alternately stacking wiring layers and insulating layers on a surface of the metal layer, wherein an n-th wiring layer being the uppermost layer includes an n-th connection pad; bonding a second support having an opening on a surface, remote from the laminated sheet, of the multilayer laminate with a second release layer therebetween such that at least a part of the n-th connection pad is disposed within the opening; releasing the first support from the reinforced multilayer laminate at the first release layer; and putting conductors into contact with the n-th connection pads of the reinforced multilayer laminate to perform electrical inspection.
    Type: Grant
    Filed: December 22, 2016
    Date of Patent: July 20, 2021
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoshinori Matsuura, Yasuhiro Seto, Toshimi Nakamura
  • Patent number: 11065606
    Abstract: The purpose of the present invention is to provide a metal-substituted beta zeolite that exhibits a more excellent catalytic performance than conventional one, and a method for producing the same. The present invention provides a metal-substituted beta zeolite by subjecting an alkali metal-form beta zeolite produced without using an organic structure-directing agent to ion exchange with ammonium ion and then, using a filter cake procedure, to ion exchange with copper ion or iron(II) ion. The present invention also provides a metal-substituted beta zeolite which has been ion exchanged with copper ion or iron(II) ion and in which the amount of Lewis acid sites is greater than the amount of Bronsted acid sites when the amount of Bronsted acid sites and the amount of Lewis acid sites are measured by ammonia infrared-mass spectroscopy temperature-programmed desorption on the as-produced state.
    Type: Grant
    Filed: October 25, 2018
    Date of Patent: July 20, 2021
    Assignees: Mitsui Mining & Smelting Co., Ltd., NATIONAL UNIVERSITY CORPORATION TOTTORI UNIVERSITY, NATIONAL UNIVERSITY CORPORATION YOKOHAMA NATIONAL UNIVERSITY
    Inventors: Yoshihiro Kubota, Satoshi Inagaki, Naonobu Katada, Satoshi Suganuma, Yasuo Yamazaki, Takahiro Kogawa
  • Patent number: 10994331
    Abstract: There is provided a copper powder containing an organic compound containing carbon and nitrogen. The powder has a ratio of carbon content PC (mass %) to specific surface area SSA (m2/g), PC/SSA, of 0.005 to 0.1 and a ratio of nitrogen content PN (mass %) to specific surface area SSA (m2/g), PN/SSA, of 0.001 to 0.05. The organic compound preferably contains two or more of nitrogen atom per molecule and is preferably capable of forming a five-membered ring complex with copper. The organic compound preferably includes one or more of dimethyl glyoxime, ethylenediamine, and polyethyleneimine.
    Type: Grant
    Filed: January 19, 2016
    Date of Patent: May 4, 2021
    Assignee: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Yoichi Kamikoriyama, Mami Yoshida, Hiroshi Imamura, Yuji Asano
  • Publication number: 20210127503
    Abstract: An extremely thin copper foil is provided that enables formation of highly fine different wiring patterns with a line/space (L/S) of 10 ?m or less/10 ?m or less on two sides of the copper foil and is thus usable as an inexpensive and readily processable substitution for silicon and glass interposers. The extremely thin copper foil includes, in sequence, a first extremely thin copper layer, an etching stopper layer, and the second extremely thin copper layer. Two sides of the extremely thin copper foil each have an arithmetic average roughness Ra of 20 nm or less.
    Type: Application
    Filed: October 18, 2018
    Publication date: April 29, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventor: Yoshinori MATSUURA
  • Publication number: 20210126272
    Abstract: A solid electrolyte assembly is obtained by joining a solid electrolyte layer having oxide ion conductivity and containing lanthanum and a first electrode layer made of an oxide that is represented by ABO3?? and has a cubic perovskite structure to each other, where A represents an alkaline-earth metal element, B represents a transition metal element, and ? represents a fraction that occurs depending on the valences and amounts of A, B, and O. The oxide contains lanthanum at a part of the A site, and an atom ratio of lanthanum to all the elements occupying the A site is 0.01 or greater and 0.80 or less.
    Type: Application
    Filed: April 16, 2019
    Publication date: April 29, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Shingo IDE, Kengo SHIMANOE, Ken WATANABE, Koichi SUEMATSU
  • Patent number: 10938064
    Abstract: Sulfide-type compound particles microparticulated, having an argyrodite-type crystal structure, and including lithium (Li), phosphorus (P), sulfur (S), and a halogen (Ha). As sulfide-type compound particles that can inhibit generation of hydrogen sulfide gas even upon contact with moisture in the atmosphere, provided are sulfide-type compound particles having D50 in a volume-basis particle size distribution of 50 ?m or less and having an occupancy of sulfur (S) and the halogen (Ha) in the S3 (4a) site, as calculated by a neutron diffraction measurement, of 85% or more.
    Type: Grant
    Filed: September 3, 2019
    Date of Patent: March 2, 2021
    Assignee: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Takahiro Ito, Tsukasa Takahashi, Masaru Hyakutake, Teruaki Yagi
  • Publication number: 20210059057
    Abstract: An extremely thin copper foil with a carrier is provided that can keep stable releasability even after being heated for a prolonged time at a high temperature of 350° C. or more. The extremely thin copper foil with a carrier includes a carrier composed of a glass or ceramic material; an intermediate layer provided on the carrier and composed of at least one metal selected from the group consisting of Cu, Ti, Al, Nb, Zr, Cr, W, Ta, Co, Ag, Ni, In, Sn, Zn, Ga, and Mo; a release layer provided on the intermediate layer and including a carbon sublayer and a metal oxide sublayer or containing metal oxide and carbon; and an extremely thin copper layer provided on the release layer.
    Type: Application
    Filed: December 3, 2018
    Publication date: February 25, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Rintaro ISHII, Takenori YANAI, Yoshinori MATSUURA
  • Publication number: 20210039080
    Abstract: A substrate (11) of an exhaust gas purification catalyst (10) includes inflow-side cells (21), outflow-side cells (22), and porous partition walls (23), each porous partition wall separating the cells (21, 22) from each other. A first catalyst portions (14) is provided at least on a portion of a side of the partition wall (23) that faces the inflow-side cell (21), the portion being located on an upstream side in an exhaust gas flow direction, and a second catalyst portion (15) is provided at least on a portion of a side of the partition wall that faces the outflow-side cell, the portion being located on a downstream side in the exhaust gas flow direction.
    Type: Application
    Filed: March 19, 2019
    Publication date: February 11, 2021
    Applicant: Mitsui Mining & Smelting Co., Ltd.
    Inventors: Hiroki KURIHARA, Yu SAKURADA, Yusuke NAGAI, Yoshinori ENDO, Takeshi NABEMOTO, Shingo AKITA
  • Publication number: 20210029823
    Abstract: There is provided a copper-clad laminate in which transmission characteristics exhibited by a resin layer can be further improved while sufficient peel strength between a copper foil and the resin layer is ensured. The laminate includes a copper foil; an adhesive layer including a polyphenylene ether resin, a polyimide resin, an olefin-based resin, a liquid crystal polymer, a polyester resin, a polystyrene resin, a hydrocarbon elastomer, a benzoxazine resin, an active ester resin, a cyanate ester resin, a bismaleimide resin, a butadiene resin, a hydrogenated or non-hydrogenated styrene butadiene resin, an epoxy resin, a fluororesin, a vinyl-group-containing resin, or the like; and a resin layer. The maximum height Sz at a copper foil surface on the adhesive layer side is 6.8 ?m or less. The dielectric loss tangent value of the adhesive layer at 1 GHz, ?a, is equal to or less than that of the resin layer, ?r.
    Type: Application
    Filed: March 7, 2019
    Publication date: January 28, 2021
    Applicant: MITSUI MINING & SMELTING CO., LTD.
    Inventors: Toshihiro HOSOI, Toshifumi MATSUSHIMA