Abstract: In order to provide a novel oriented apatite-type oxide ion conductor which can achieve an increase in area through suppression of crack generation and preferably can be manufactured more inexpensively by an uncomplicated process, an oriented apatite-type oxide ion conductor composed of a composite oxide represented by A9.33+x[T6?yMy]O26.00+z A in the formula is one kind or two or more kinds of elements selected from the group consisting of La, Ce, Pr, Nd, Sm, Eu, Gd, Tb, Dy, Be, Mg, Ca, Sr, and Ba. T in the formula is an element including Si, Ge, or both of them. M in the formula is one kind or two or more kinds of elements selected from the group consisting of B, Ge, Zn, Sn, W, and Mo.

Abstract: The purpose of the present invention is to provide a beta zeolite which includes zinc and has a small particle size. This beta zeolite includes a silicon oxide and a zinc oxide, and has an average particle size of 50 to 100 nm at a cumulative frequency of 50% in a particle size distribution measured by scanning electron microscope observation.

Abstract: An exhaust gas purifying composition of the present invention contains zeolite that is BEA zeolite having an SiO2/Al2O3 molar ratio of greater than 25 and 600 or less and containing phosphorus. Furthermore, the exhaust gas purifying composition preferably contains zirconium in addition to phosphorus. Furthermore, the zeolite has an SiO2/Al2O3 molar ratio of from 30 to 150. The present invention provides an exhaust gas purifying composition having excellent HC adsorbability for exhaust gas purification in internal combustion engines such as gasoline engines.

Abstract: Disclosed is a method for readily and inexpensively producing zeolite without using an organic structure-directing agent (organic SDA). Specifically disclosed is a method whereby a gel containing a silica source, an alumina source, an alkaline source and water is reacted with zeolite seed crystals, to produce a zeolite with the same kind of skeletal structure as the zeolite. The gel used is a gel of a composition whereby, when a zeolite is synthesized from this gel only, the synthesized zeolite comprises at least one of the kinds of composite building units of the target zeolite.

Abstract: There is provided a surface-treated copper foil including a surface coating layer provided on at least one surface of a copper foil, the surface coating layer being mainly composed of silicon with a hydrogen content of 1 to 35 atomic % and/or a carbon content of 1 to 15 atomic %. This foil can be manufactured by forming a surface coating layer composed mainly of silicon with the above hydrogen and carbon contents on at least one surface of the copper foil by PVD or CVD. The present invention can provide a copper foil with a surface coating layer that can achieve a high bonding strength to a resin layer even if the copper foil has an extremely smooth surface such as one formed by vapor deposition, for example, sputtering and also has a desirable insulation resistance suitable for achieving a fine pitch in a printed wiring board.

Abstract: Provided is a novel crystalline solid electrolyte which can be used as a dispersion medium when slurrying polar solvents such as NMP, acetone, and DMF, and for which a decrease in conductivity when the crystalline solid electrolyte is immersed in said solvents can be suppressed. Proposed is a crystalline solid electrolyte represented by Compositional Formula: LixSiyPzSaHaw (here, Ha includes one or two or more of Br, Cl, I, and F, and 2.4<(x?y)/(y+z)<3.3), in which the content of S is 55 to 73% by mass, the content of Si is 2 to 11% by mass, and the content of a Ha element is 0.02% by mass or more.

Abstract: In this fuel cell electrode catalyst layer, a catalyst is supported on a carrier comprising inorganic oxide particles. The fuel cell electrode catalyst layer is provided with a porous structure. When a mercury penetration method is used to measure the pore size distribution of the porous structure, a peak is observed in the range spanning from 0.005 ?m to 0.1 ?m inclusive, and a peak is also observed in the range spanning from over 0.1 ?m to not more than 1 ?m. When P1 represents the peak intensity in the range spanning from 0.005 ?m to 0.1 ?m inclusive, and P2 represents the peak intensity in the range spanning from over 0.1 ?m to not more than 1 ?m, the value of P2/P1 is 0.2-10 inclusive. It is preferable that the inorganic oxide be tin oxide.

Abstract: Provided is a method of manufacturing a circuit board involves: preparing a composite laminate including a support, a release layer, and a multilayered circuit board; disposing the composite laminate on a stage such that one face of the composite laminate is put into tight contact with the stage; and releasing the support or the multilayered circuit board from the release layer such that the support or the multilayered circuit board forms a convex face with a curvature radius of 200 to 5000 mm while the face of the composite laminate is kept in tight contact with the stage. The method according to the present invention can prevent the occurrences of defects, for example, breaking in the support and cracking and wire disconnections in the multilayered circuit board in manufacturing of circuit boards, such as coreless circuit boards, and ensure stable release of the support or the multilayered circuit board.

Abstract: Disclosed is a tin oxide containing antimony and at least one element A selected from the group consisting of tantalum, tungsten, niobium, and bismuth. The antimony and the at least one element A selected from the group consisting of tantalum, tungsten, niobium, and bismuth are preferably dissolved in a solid state in tin oxide. The ratio of the number of moles of the element A to the number of moles of antimony, i.e., [(the number of moles of the element A/the number of moles of antimony)], is preferably 0.1 to 10.

Abstract: Provided is a sputtering target having extremely low occurrence of arcing or nodules, and a method for manufacturing such a sputtering target. A flat plate-shaped or cylindrical target material (3, 13) is obtained by processing a material composed of an oxide sintered body. In doing so, a grindstone having a specified grade is used to perform rough grinding of a surface of the material that will become a sputtering surface (5, 15) one or more times in accordance to the grade of the grindstone, after which zero grinding is performed one or more times so that the surface roughness of the sputtering surface (5, 15) has an arithmetic mean roughness Ra of 0.9 ?m or more, a maximum height Rz of 10.0 ?m or less, and RzJIS roughness of 7.0 ?m or less. A sputtering target (1, 11) is obtained by bonding the obtained target material (3, 13) to a backing body (2, 12) by way of a bonding layer (4, 14).

Abstract: Provided is a new catalyst structure for exhaust gas treatment including an upper catalyst layer and a lower catalyst layer, in which the catalyst structure can sufficiently exhibit functions as a three way catalyst while maintaining gas diffusibility. Proposed is a catalyst structure including a substrate, an upper catalyst layer, and a lower catalyst layer, the catalyst structure having a first peak or a second peak at a pore volume diameter of 10 nm to 50 nm and a pore volume diameter of 50 nm to 100 nm, respectively, in the logarithmic differential pore volume distribution analyzed by a mercury intrusion porosimeter.

Abstract: There is provided a copper foil provided with a carrier exhibiting a high peeling resistance against the developer in the photoresist developing process and achieving high stability of mechanical peel strength of the carrier. The copper foil provided with a carrier comprises a carrier; an interlayer disposed on the carrier, the interlayer having a first surface adjacent to the carrier and containing 1.0 atom % or more of at least one metal selected from the group consisting of Ti, Cr, Mo, Mn, W and Ni and a second surface remote from the carrier and containing 30 atom % or more of Cu; a release layer disposed on the interlayer; and an extremely-thin copper layer disposed on the release layer.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of separating a substrate without large local warpage of the multilayer wiring layer and thereby improving the reliability of connection in the multilayer wiring layer. This method includes providing a laminated sheet having, in sequence, a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer while interposing a second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: A method of manufacturing a multilayer wiring board is disclosed, the method being capable of reinforcing the multilayer wiring layer and thereby improving the reliability of connection and the flatness on the surface of the multilayer wiring layer. The method includes providing a laminated sheet having a substrate, a first release layer and a metal layer; forming a first wiring layer on the metal layer; alternately stacking insulating layers and wiring layers on the laminated sheet on which the first wiring layer is formed to give a laminate provided with a multilayer wiring layer; stacking a reinforcing sheet on the laminate provided with the multilayer wiring layer at the side opposite to the laminate sheet, while interposing the second release layer; separating the substrate from the metal layer; and separating the reinforcing sheet from the laminate provided with the multilayer wiring layer to give the multilayer wiring board.

Abstract: Proposed is a phosphor capable of effectively inhibiting the occurrence of adverse influence of a sulfur-based gas while improving water resistance of the phosphor and effectively inhibiting the corrosion of a metallic member. A phosphor is proposed, which includes particles or a layer provided on the surface of a sulfur-containing phosphor, which contains sulfur in a host material, and containing a crystalline metal borate containing an IIA-Group element, boron, and oxygen.

Abstract: Provided is a phosphor, which is excited by a wide band of visible light, capable of emitting near-infrared light of high intensity. The phosphor comprises a crystal phase represented by a formula (1): MCuSi2O6 (where M comprises one or more of Ba, Sr and Ca), and a crystal phase represented by a formula (2): MCuSi4O10 (where M comprises one or more of Ba, Sr and Ca), wherein a ratio ? of a diffraction peak intensity of MCuSi4O10 with respect to a diffraction peak intensity of MCuSi2O6 in an X-ray diffraction (XRD) pattern obtained by powder XRD measurement using CuK? rays is 0<??0.50.

Abstract: The objective of the invention is to provide an MSE-type zeolite production method such that an MSE-type zeolite can be produced in a comparatively short heating time by using inexpensive tetraethylammonium ion. The production method of the present invention comprises steps of: (1) mixing a silica source, an alumina source, an alkali source, tetraethylammonium ion, and water in such a manner as to yield a reaction mixture of the composition represented by the molar ratios indicated below: SiO2/Al2O3=between 10 and 100 inclusive (Na2O+K2O)/SiO2=between 0.15 and 0.50 inclusive K2O/(Na2O+K2O)=between 0.05 and 0.7 inclusive TEA2O/SiO2=between 0.08 and 0.20 inclusive H2O/SiO2=between 5 and 50 inclusive; (2) using the MSE-type zeolite as a seed crystal, and adding this seed crystal to the mixture at a proportion of 5 to 30% by mass with respect to the silica component in the reaction mixture; and (3) heating, under hermetic seal at a temperature of 100 to 200° C.

Abstract: A resin composition for use in a dielectric layer of a capacitor device or a capacitor-embedded printed circuit board is provided in which the resin composition can improve stability in capacitance and insulation properties of the capacitor device under high temperature and high humidity and ensures high adhesion of the dielectric layer to the device. The resin composition comprises a resin component and a dielectric filler. The resin component comprises an epoxy resin, an active ester resin, and an aromatic polyamide resin.

Abstract: Disclosed is copper powder having an average primary particle size D of 0.15 to 0.6 ?m, having a ratio of D to DBET, D/DBET, of 0.8 to 4.0 wherein DBET is a sphere-equivalent average particle diameter calculated from a BET specific surface area, and having no layer for preventing agglomeration on the surface thereof. The copper powder is suitably produced by a method which includes a step of mixing (1) hydrazine and (2) a reactant mixture including a monovalent or divalent copper source and a liquid medium which includes water and an organic solvent having water miscibility and capable of reducing the surface tension of water, to reduce the copper source to form copper particles.

Abstract: A material for forming of the capacitor layer which generates no crack in drilling on the dielectric layer of the capacitor in manufacturing of a highly multilayered printed wiring board embedded a capacitor circuit. Copper clad laminate for forming of an embedded capacitor layer of a multilayered printed wiring board including an embedded capacitor circuit having a layer structure of copper layer/dielectric layer of the capacitor/copper layer in an inner layer characterized in that the composite elastic modulus Er of the resin film constituting the dielectric layer of the capacitor along the thickness direction is less than 6.1 GPa is employed.