Abstract: An electronic component includes a base body including a plurality of voids, a protective material covering a part or a whole of an outer surface of the base body, and an external electrode covering a part of an outer surface of the protective material. The protective material is glass containing a silane compound having a carbon chain with 3 or more carbon atoms. The protective material includes a filling portion occupying at least some of the voids, and a film portion covering the outer surface of the base body.

Abstract: A first radiation conductor layer is provided in a multilayer body. A second radiation conductor layer is provided in or on the multilayer body, is located above the first radiation conductor layer, and overlaps the first radiation conductor layer when viewed in an up-down direction. A first floating conductor has a shape surrounding at least a part of a periphery of the first radiation conductor layer when viewed in the up-down direction, is located on a same layer as or above the first radiation conductor layer and on a same layer as or below the second radiation conductor layer in the up-down direction, and is not electrically connected to any conductor present in or on the multilayer body. A second floating conductor has a shape surrounding at least a part of a periphery of the second radiation conductor layer.

Abstract: An electronic component includes a base body and a glass film covering an outer surface of the base body. The glass film has a groove extending on an outer surface of the glass film. The groove is recessed from the outer surface of the glass film toward the outer surface side of the base body in a specific section in a direction orthogonal to the outer surface of the glass film. The bottom portion of the groove is located closer to the outer surface side of the glass film than the outer surface of the base body. In addition, the bottom portion of the groove has an arc shape in the specific section.

Abstract: A radio frequency circuit supports a first power class and a second power class whose maximum output power is lower than that of the first power class, and includes: a first power amplifier; and a variable load matching circuit connected to an output end of the first power amplifier. Under a condition that the first power class is applied, a first power supply voltage is supplied to the first power amplifier, and a load impedance viewed from the first power amplifier is adjusted to a first impedance by the variable load matching circuit. Under a condition that the second power class is applied, a second power supply voltage is supplied to the first power amplifier, and the load impedance viewed from the first power amplifier is adjusted to a second impedance by the variable load matching circuit.

Abstract: A coil component comprises a first wire including a winding portion wound around a winding core portion of a core, a first end portion electrically connected to a terminal electrode provided in a first flange portion, and a first extended portion connecting the winding portion and the first end portion. In a first direction, the first end portion is positioned on a first side with respect to a central axis of the winding core portion, and a first boundary portion which is a boundary portion between the first extended portion and the winding portion is positioned on a second side with respect to the central axis. A corner of the winding core portion is positioned between the first boundary portion and the first end portion in a circumferential direction. A gap is interposed between the first extended portion and the corner.

Abstract: A multilayer resin substrate includes resin layers that are laminated, a first copper foil on the resin layers and including first and second main surfaces having first and second surface roughnesses, respectively, and a second copper foil on the resin layers and including third and fourth main surfaces having third and fourth surface roughnesses, respectively. A distance between the first main surface and the second copper foil is shorter than a distance between the second main surface and the second copper foil. When the first, second, third, and fourth surface roughnesses are denoted as SR1, SR2, SR3, and SR4 respectively, a relationship SR1<SR3?SR4<SR2 is satisfied.

Abstract: An acoustic wave device includes a support substrate, a piezoelectric body including LiTaO3, a first electrode on a first main surface of the piezoelectric body, a second electrode on a second main surface, an acoustic-layer laminated body between a support substrate and the piezoelectric body. The azimuth angle of the piezoelectric body is (about 85° to 95°, about 85° to 95°, about 5° to 65°) represented in Euler angles.

Abstract: An inductor component includes an element body having magnetism, a resin layer provided inside the element body, and inductor wirings provided inside the element body and having a contact surface that is in contact with the resin layer. A configuration ratio of the inductor wirings is equal to or less than about “0.9”. In a transverse plane of the inductor wirings perpendicular to an extending direction of the inductor wirings, in a case where a largest dimension among dimensions in a height direction perpendicular to the contact surface is defined as a maximum dimension, the configuration ratio is a ratio of the largest dimension to a dimension of the contact surface in the transverse plane.

Abstract: Filter devices and methods are disclosed. A single-crystal piezoelectric plate is attached to substrate, portions of the piezoelectric plate forming a plurality of diaphragms spanning respective cavities in the substrate. A conductor pattern formed on the piezoelectric plate defines a low band filter including low band shunt resonators and low band series resonators and a high band filter including high band shunt resonators and high band series resonators. Interleaved fingers of interdigital transducers (IDTs) of the low band shunt resonators are disposed on respective diaphragms having a first thickness, interleaved fingers of IDTs of the high band series resonators are disposed on respective diaphragms having a second thickness less than the first thickness, and interleaved fingers of IDTs of the low band series resonators and the high band shunt resonators are disposed on respective diaphragms having thicknesses intermediate the first thickness and the second thickness.

Abstract: A multilayer circuit board includes a board body including insulator layers stacked upon each other, a first land pattern at the board body to mount a passive component, a second land pattern at the board body to mount an active component, and a heat-dissipation layer between the insulator layers and extending along main surfaces of the insulator layers. The heat-dissipation layer includes a hole extending therethrough in a stacking direction of the insulator layers. In a plan view from the stacking direction, an outer edge of the hole of the heat-dissipation layer is on an outer side of the first land pattern, or overlaps the first land pattern.

Abstract: A common mode choke coil includes an element body of laminated insulating layers; electrically insulated first and second coils in the element body; first and second outer electrodes on the element body electrically connected to ends of the first coil; and third and fourth outer electrodes on the element body electrically connected to ends of the second coil. The first coil includes first to third coil conductors on first to third insulating layers. The second coil includes fourth to sixth coil conductor on fourth to sixth insulating layers. The second and third coil conductors are electrically connected via a via conductor overlapping at outer ends of the conductors. A dummy conductor overlapping the via conductor is provided on at least one of the first, fourth, fifth, and sixth insulating layers other than between the second and third insulating layers and electrically insulated from all the coil conductors.

Abstract: A conductive two-dimensional particle of a layered material comprising one layer or one layer and plural layers, wherein the layer includes a layer body represented by: MmXn, and a modifier or terminal T exists on a surface of the layer body, wherein T is at least one selected from the group consisting of a hydroxyl group, a fluorine atom, a chlorine atom, an oxygen atom, or a hydrogen atom, M of the layer is bonded to at least one selected from the group consisting of PO43?, I, or SO42?, the total content of chlorine and bromine is 1,500 ppm by mass or less, and an average value of major diameters of two-dimensional surfaces of the conductive two-dimensional particles is 1.0 ?m or more.

Abstract: An electronic device includes: an exterior case that has a first case and a second case engaged with each other; a first lead wire and a second lead wire extended from the inside of the exterior case; a first grommet through which the first lead wire is penetrated; and a second grommet through which the second lead wire is penetrated, where the first grommet is inserted in a first notch formed in the first case, the second grommet is inserted in a second notch formed at a position that substantially faces the first notch in the second case, and a continuous O-ring is interposed between the first case and the second case and between the first grommet and the second grommet.

Abstract: A common mode choke coil includes a core, and first and second coils opposed to each other and wound on the core. The core can have a square shape, or an elongated shape having a long axis and a short axis when viewed in a direction along a central axis of the core. Each of the first and second coils is a single-layer coil. An area of a cross-section of the core taken perpendicular to a circumferential direction of the core is constant in the circumferential direction of the core. The cross-section of the core has a quadrilateral shape.

Abstract: A multilayer substrate module includes a first substrate portion including a first substrate portion body including first insulator layers stacked in a vertical direction and a first conductor layer and/or a first interlayer connection conductor provided at the first substrate portion body. A second substrate portion includes a second substrate portion body including second insulator layers stacked in the vertical direction and a second conductor layer and a second interlayer connection conductor provided at the second substrate portion body, and is mounted on an upper surface of the first substrate portion. A mount device is mounted on an upper surface or a lower surface of the second substrate portion. At least a portion of an inductance component is defined by the first conductor layer and the first interlayer connection conductor.

Abstract: A directional coupler includes a main line, a sub line electromagnetically coupled to the main line, a coupling output terminal, a first filter connected to one end of the sub line, and a second filter connected to the one end of the sub line and the coupling output terminal and having a pass band different from that of the first filter. The first filter and the second filter are constituent elements of a multiplexer. The first filter is terminated.

Abstract: A multilayer coil component includes a body formed by multiple insulating layers stacked in a direction of stacking and having first and second end surfaces opposite each other in a length direction, first and second main surfaces opposite each other in a height direction, perpendicular to the length direction, and first and second lateral surfaces opposite each other in a width direction, perpendicular to the length direction and to the height direction; a coil inside the body and including multiple coil conductors electrically coupled together; and a first outer electrode extending from at least part of the first end surface of the body to part of the first main surface and electrically coupled to the coil. The direction of stacking of the insulating layers and the direction of the coil axis of the coil are parallel with the first main surface, which is the mounting surface, of the body.

Abstract: A multilayer ceramic capacitor includes a multilayer body including a laminate chip and side gap portions. The laminate chip includes an inner layer portion in which dielectric layers and internal electrode layers are alternately laminated, and outer layer portions respectively on both sides of the inner layer portion in a lamination direction. Side gap portions are on both sides of the laminate chip in a width direction. The multilayer ceramic capacitor further includes external electrodes respectively on both sides of the multilayer body in a length direction. When a thickness of one of the outer layer portions is defined as T1, and a thickness of one of the side gap portions is defined as W1, W1 and T1 are about 20 ?m or less, and about 0.1<|(W1-T1)|/T1<about 0.3 is satisfied.

Abstract: A multilayer ceramic capacitor includes an external electrode including an underlying electrode layer, a lower plating layer on the underlying electrode layer at a first end surface and a second end surface, and an upper plating layer on the lower plating layer. The underlying electrode layer is a thin film electrode including at least one selected from Ni, Cr, Cu, and Ti. The lower plating layer is a Cu plating layer including a lower layer region located closer to the multilayer body and an upper layer region located between the lower layer region and the upper plating layer, and the Cu plating layer in the lower layer region has a metal grain diameter smaller than that of the Cu plating layer located in the upper layer region.

Abstract: A common-mode choke coil includes a multilayer body, a first coil, a second coil, a first terminal electrode, a second terminal electrode, a third terminal electrode, and a fourth terminal electrode. The multilayer body includes plural non-conductor layers. The first and second coils are incorporated in the multilayer body. The first and second terminal electrodes are connected to the first coil. The third and fourth terminal electrodes are connected to the second coil. The first coil has a path length L1, the second coil has a path length L2, and the sum of the path length L1 and the path length L2 is less than or equal to 3.5 mm. The non-conductor layers each have a relative permittivity of less than or equal to 11.