Abstract: A patch antenna is constituted by a radiation element disposed on a substrate and a ground conductor disposed in the substrate. A dielectric member is disposed to cover the radiation element and a body of a resin material is disposed to cover the dielectric material as viewed from above. The dielectric member is disposed on a side opposite a side on which the ground conductor is disposed as viewed from the radiation element. When a direction of a normal line to the radiation element is assumed as a height direction, a line which links centroids of horizontal sectional surfaces of the dielectric member in the height direction leans with respect to the direction of the normal line to the radiation element.

Abstract: An RFID tag is provided that transmits and receives a communication signal. The RFID tag includes a base material, an antenna pattern provided on the base material, and an expansion member. The expansion member is disposed adjacent to the antenna pattern and has a coefficient of linear expansion that is higher than coefficients of linear expansion of the antenna pattern. When the RFID tag is subjected to an electromagnetic wave heating microwave, and thus the temperature of each portion rises, the antenna pattern breaks at a position of the expansion member. With this configuration, ignition and combustion are able to be prevented even in a situation in which the RFID tag is subjected to high-frequency power for heating a food item while being attached to the food item.

Abstract: An inductor component that includes a core that includes a substantially column-shaped shaft part and a pair of support parts at both ends of the shaft part; terminal electrodes that are respectively provided on the pair of support parts; and a wire that is wound around the shaft part and has end portions that are respectively connected to the terminal electrodes on the pair of support parts. The inductor component exhibits an impedance value of 2100? or higher for an input signal having a frequency of 500 MHz.

Abstract: An inductor component includes a lamination of an insulating layer and a conductive layer. The insulating layer includes a base made of glass and inorganic particles dispersed in the base. Some of the inorganic particles partially project through the surface of the base into the conductive layer.

Abstract: A circuit module includes a substrate, a DC/DC converter mounted on the substrate, and a capacitor including a pair of electrodes each including an upper electrode portion facing the second main surface, a lower electrode portion opposing the upper electrode portion, and a side-surface electrode portion connecting the upper electrode portion and the lower electrode portion. The circuit module includes metal plates connected to the substrate and exposed to the outside. The metal plates are in contact with the lower electrode portion and the side-surface electrode portion. The metal plates are in contact with the lower electrode portion and the side-surface electrode portion.

Abstract: A first substrate have recesses respectively provided at corner portions of a bottom surface. Outer electrodes each have electrode body portion provided around an associated one of the recesses on the bottom surface. The electrode body portion has a protruding portion extending along a short-side ridge portion between the bottom surface and a side surface.

Abstract: A method to produce a multilayer ceramic electronic component includes forming supports by an ink jet printing method to produce a green multilayer ceramic capacitor. A green ceramic layer and outer electrodes of the multilayer ceramic electronic component are formed by the ink jet printing method while the supports define peripheries of the green ceramic layer and the outer electrodes. When fired, the green multilayer ceramic electronic component is converted to a sintered multilayer ceramic electronic component, and the supports disappear by heating.

Abstract: An acoustic wave device includes an IDT electrode on a piezoelectric body and the IDT electrode includes first and second busbars, and first and second electrode fingers. A first dielectric film extends from a region between tip end portions of the first electrode fingers and the piezoelectric body to a region between the second busbar and the piezoelectric body with a first gap in between. The second electrode fingers are in direct contact with the piezoelectric body at a center of an overlap width, and a permittivity of the first dielectric film is lower than a permittivity of the piezoelectric body.

Abstract: A positive electrode active material includes positive electrode active material particles including a composite oxide with a hexagonal crystal structure. The composite oxide includes Li, Co, and at least one element M1 selected from the group consisting of Ni, Fe, Pb, Mg, Al, K, Na, Ca, Si, Ti, Sn, V, Ge, Ga, B, As, Zr, Mn and Cr, and the at least one element M1 is provided on a surface of the positive electrode active material particles. An atomic ratio of a total amount of the at least one element M1 to an amount of Co on the surface of the positive electrode active material particles is from 0.6 to 1.3.

Abstract: A radio frequency filter includes at least a first sub-filter and a second sub-filter connected in parallel between a first port and a second port. Each of the sub-filters has a piezoelectric plate having front and back surfaces, the back surface attached to a substrate, and portions of the piezoelectric plate forming diaphragms spanning respective cavities in the substrate. A conductor pattern is formed on the front surface of the plate, the conductor pattern includes interdigital transducers (IDTs) of a respective plurality of resonators, with interleaved fingers of each IDT disposed on a respective diaphragm of the plurality of diaphragms. A thickness of the portions of the piezoelectric plate of the first sub-filter is different from a thickness of the portions of the piezoelectric plate of the second sub-filter.

Abstract: An inductor component includes an element body and inductor wiring. Among outer surfaces of the element body, one specific surface is defined as a first main surface, one surface perpendicular to the first main surface is defined as a first end surface, and one surface perpendicular to the first main surface and the first end surface is defined as a bottom surface. The inductor wiring includes a winding portion. The winding portion includes an upper side portion, a lower side portion, and a first lateral side portion. The first lateral side portion linearly extends from an end of the lower side portion facing the first end surface to the same position as that of an end of the upper side portion facing the first end surface in a direction perpendicular to the first end surface.

Abstract: An inductor component includes an element body and inductor wiring. The element body has first and second electrodes connected to first and second ends of the inductor wiring, respectively. One outer surface of the element body is a first main surface, one surface perpendicular to the first main surface is a first end surface, and one surface perpendicular to the first main and end surfaces is a bottom surface. The first electrode includes a first bottom surface electrode portion and a first end surface electrode portion. A size of the first bottom surface electrode portion in a direction perpendicular to the bottom surface is a thickness, and a portion of the first bottom surface electrode portion farthest from the first end surface is a leading end. The thickness of at least part of the first bottom surface electrode portion including the leading end decreases toward the leading end.

Abstract: A pulse-shaping network configured for use in a radio frequency (rf) power amplifier system, the pulse-shaping network comprising: a coupled magnetic element comprising a first inductive element magnetically coupled to a second inductive element, the first inductive element comprising a first winding disposed about a first portion of a core, and the second inductive element comprising a second winding disposed about a second portion of a core, wherein the first and second inductive elements are electrically coupled to provide three output terminals of the coupled magnetic element.

Abstract: A coil component in which stress is relieved and a coil is stably positioned is to be provided. A coil component of the present disclosure includes a base body; and a coil provided in the base body. The base body includes a plurality of laminated magnetic layers. The coil includes a plurality of laminated coil wirings. The magnetic layers and the coil wirings are alternately laminated. A gap portion is provided between each of the magnetic layers and each of the coil wirings. Part of the coil wirings contacts the magnetic layers, and a region containing a metal oxide is present on part of a surface of each of the coil wirings on a side of the gap portion.

Abstract: An inductor component includes an element body and an inductor wiring. The element body has a planar first main surface. The inductor wiring extends inside the element body. The inductor wiring includes a plurality of wiring portions arrayed in a direction perpendicular to the first main surface. The element body includes a plurality of interlayer insulating layers filling spaces between the wiring portions that are adjacent to each other in a direction perpendicular to the first main surface. The interlayer insulating layers each contain an insulating base material and a plurality of filler particles dispersed within the base material. In a first interlayer insulating layer, which is one of the plurality of interlayer insulating layers, the average particle size of the filler particles is less than or equal to the standard deviation of the thickness of the first interlayer insulating layer.

Abstract: A power amplifier circuit includes a first amplifier, a second amplifier, a third amplifier, and a harmonic suppression circuit. The first amplifier operates on power supplied through a first supply line, and amplifies a first transmit signal in a first frequency band. The second amplifier operates on power supplied through a second supply line connected to the first supply line, and amplifies a second transmit signal in a second frequency band different from the first frequency band. The third amplifier shares an antenna with the second amplifier, and amplifies a receive signal in the second frequency band received from the antenna. The harmonic suppression circuit generates, based on a harmonic of the first transmit signal, a suppression signal to suppress the harmonic to be transferred to the first supply line, and outputs the suppression signal to the first supply line or the second supply line.

Abstract: Described is a power transmission gate which includes a charge pump, an NMOS transistor, and a gate driver circuit configured to power (or bias or “drive”) a gate of the NMOS transistor. With this arrangement, a power transmission gate capable of achieving substantially the same resistance provided by prior art power transmission gates while having a footprint of just over one NMOS size unit is provided.

Abstract: A composite component includes an Si base layer that has first and second main surfaces that are opposite to each other, a rerouting layer on the first main surface, a through-silicon via that is electrically connected to the rerouting layer, and that extends through the Si base layer, and an electronic component layer on the second main surface of the Si base layer, and that includes electronic components each including an electronic component body and a component electrode on the electronic component body. The component electrode is connected to the through-silicon via. One or more of the electronic components have a curved shape that is curved to protrude in a mount direction in a cross-sectional view. A mount surface of the composite component corresponds to the curved shape in a cross-sectional view, and includes one or more first curved surfaces that are curved to protrude in the mount direction.

Abstract: A circuit board of a switching power supply device includes a positive terminal circuit pattern and a negative terminal circuit pattern that are provided on a component mount surface and respectively supply currents from input parts to two input terminals of a common mode choke coil. The positive terminal circuit pattern and the negative terminal circuit pattern are positioned in parallel and close to each other. The component mount surface of the circuit board includes a component mount surface side ground pattern arranged below the common mode choke coil. A heat dissipation ground surface of the circuit board includes a ground pattern and a plurality of heat dissipation conductor patterns. Input terminals and output terminals of the common mode choke coil are respectively electrically and thermally connected to the heat dissipation conductor patterns via through-hole conductors provided between the component mount surface and the heat dissipation ground surface.

Abstract: A noise reduction circuit includes a surface-mount common mode choke coil mounted on a circuit board. Output terminals of the common mode choke coil are connected to an input capacitor via second circuit patterns. Two terminals of the input capacitor are connected to two input ends of a switching circuit via third circuit patterns. Path lengths of the second circuit patterns are longer than path lengths of the third circuit patterns. Of a plurality of current paths, the path lengths of the third circuit patterns are shortest in comparison with path lengths of other current paths. First circuit patterns are parallel and face each other to form a first parasitic capacitance, and the second circuit patterns are parallel and face each other to form second parasitic capacitances.