Patents Assigned to Nagano Keiki Co. Ltd.
  • Patent number: 9903775
    Abstract: A detector provided on a flat portion of a diaphragm includes a plurality of strain gauges, resistor element connectors connecting adjacent ones of the strain gauges, and an electric conductor covering a part of the resistor element connectors. First linear portions and second linear portions of the resistor element connectors exposed from the electric conductor are orthogonal to the edges of the electric conductor extending across the first linear portions and the second linear portions. Even when a pattern of the resistor element connector and a pattern of electric conductor are misaligned in X direction or in Y direction, an area of the resistor element connector exposed from the electric conductor does not change.
    Type: Grant
    Filed: December 22, 2015
    Date of Patent: February 27, 2018
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Yukihiko Hata, Kaori Miyashita, Eiji Takeda
  • Patent number: 9816890
    Abstract: A pressure sensor includes: a pressure sensor element; a metal adapter integrally attached to the pressure sensor element and defining therein a hole through which a pressure of a fluid to be measured is introduced to the pressure sensor element; a metal fitting member provided with a housing recess receiving the adapter and connectable to a connected member; and an operation member pressing a valve provided to the connected member and defining a communicating path through which a flow path, in which the pressure of the fluid to be measured is introduced, is in communication with the hole of the adapter. The adapter and the fitting member are connected to each other by plastic deformation. The operation member is a synthetic resin member including: a contact portion brought into contact with the adapter; and a pressing portion provided on a side opposite to the contact portion to press the valve.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: November 14, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventor: Nobuaki Yamada
  • Patent number: 9784634
    Abstract: A pressure sensor includes: a pressure sensor element; an adapter integrally attached to the pressure sensor element and defining therein a hole where a pressure of a fluid to be measured is introduced to the pressure sensor element; a fitting member having a housing recess housing the adapter and connectable to a connected member; and a pressing member pressing a valve of the connected member and defining a communicating path through which a flow path where the pressure of the fluid is introduced is in communication with the hole of the adapter. The fitting member is made of a synthetic resin. An O-ring is interposed between a circumferential surface of the adapter and the fitting member. The adapter is a synthetic resin member, and includes a contact portion brought into contact with the adapter and a pressing portion pressing the valve. The pressing member is welded to the fitting member.
    Type: Grant
    Filed: November 11, 2015
    Date of Patent: October 10, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventor: Nobuaki Yamada
  • Patent number: 9778127
    Abstract: A differential pressure sensor includes: a sensor module including: a sensor case including a port through which a target fluid is to be introduced and a base attached with the port; a sensor configured to detect a physical quantity of the target fluid; a sensor substrate attached with the sensor, the sensor substrate having an outer circumferential surface facing an inner circumferential surface of the base; and a cover configured to press the sensor substrate against the base; and a case body including an electric circuit that is housed therein and electrically connectable to the sensor module, the case body having an open end to which the sensor module is externally attached, in which a sensor module clearance is defined between the outer circumferential surface of the sensor substrate and an inner circumferential surface of the sensor case.
    Type: Grant
    Filed: December 18, 2015
    Date of Patent: October 3, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Takayuki Ite, Daiki Aruga, Hideki Muramatsu
  • Patent number: 9772242
    Abstract: A physical quantity measuring sensor includes: a joint having a projection; a ceramic sensor module including a diaphragm and a cylindrical portion integrated with the diaphragm and provided to the projection; and an O-ring interposed between a sensor-module flat portion extending in a direction orthogonal to an axial direction of the cylindrical portion and a joint flat portion extending in a direction orthogonal to an axial direction of the projection.
    Type: Grant
    Filed: December 4, 2014
    Date of Patent: September 26, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hironori Kobayashi, Shuji Tohyama, Yusuke Abe, Haruhiko Sekiya
  • Patent number: 9702777
    Abstract: A detector is provided by coating a fluid conductive material on a flat portion of a diaphragm. The detector includes: a resistor element; resistor element electrodes, which are overlapped and connected with mutually opposed parts of the resistor element; and a linear conductor connected with the resistor element electrodes. The resistor element electrodes each include: a linear portion having a linear inner side facing an inner side of paired one of the resistor element electrodes; and peripheral portions defined at both ends of the linear portion, at least one of the peripheral portions being connected with the linear conductor. All of the linear portions are arranged so that inner sides are arranged mutually in parallel. The resistor element is connected with the linear portion. The peripheral portions are exposed without being connected with the resistor element.
    Type: Grant
    Filed: January 12, 2016
    Date of Patent: July 11, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Kaori Miyashita, Eiji Takeda, Yuuji Nagai, Shinya Matsumura
  • Patent number: 9631991
    Abstract: A device includes: a sensor module; a housing that houses the sensor module; a connector provided to the housing; a terminal provided to the connector; and an elastic electrically conductive member provided in a space between the sensor module and the connector and interposed between the terminal and a pad. The sensor module includes: a ceramic module body including a diaphragm and a cylindrical portion integral with a periphery of the diaphragm; a detector provided on a flat surface of the diaphragm; and the pad and an electronic component provided on a flat surface of the cylindrical portion radially outwardly adjacent to the flat surface of the diaphragm. The pad is electrically connected to the electrically conductive member.
    Type: Grant
    Filed: September 25, 2015
    Date of Patent: April 25, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Shuji Tohyama, Nobutaka Yamagishi, Naoki Yamashita, Yusuke Midorikawa
  • Patent number: 9615458
    Abstract: For producing a three-dimensional circuit component, an electronic component is mounted on a synthetic resin block. A plurality of electrically-conductive patterns used to establish an electrical connection to the electronic component are formed on the block along a three-dimensional shape of the block. An end of each electrically-conductive patterns is provided with a solder-disposed section. A solder is provided between the solder-disposed section and an opposed surface of the electronic component. The section of each electrically-conductive patterns other than the solder-disposed section and a section on which the electronic component is mounted is internally formed in the block. Since the section of each electrically-conductive patterns other than the section on which the electronic component is mounted is internally formed in the block, the electrically-conductive patterns are not unnecessarily exposed.
    Type: Grant
    Filed: July 15, 2013
    Date of Patent: April 4, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Nobutaka Yamagishi, Naoki Yamashita, Atsushi Imai
  • Patent number: 9581518
    Abstract: A plate-shaped circuit board configured to receive a detection signal from a detector is housed in a case and is held by a holder with a flat substrate surface thereof intersecting with a bottom surface of a cover member. The holder is attached to the cover member. The cover member includes a cover body, and elongated supporting portions projecting from the bottom surface of the cover body into the case. The supporting portions each include a pair of support projections that support one of opposite side surfaces of the circuit board along a projecting direction of the supporting portions. The holder includes a flat portion provided with engagement pieces engageable with a second substrate.
    Type: Grant
    Filed: March 24, 2015
    Date of Patent: February 28, 2017
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Hidebumi Seki, Hiroyuki Toba, Tomohiro Rokugawa
  • Patent number: 9389134
    Abstract: A sensor includes: a housing with a terminal; a joint including a projecting portion; a sensor module provided to the projecting portion and including a strain gauge; a conductive member connecting the terminal and the strain gauge; a cap-shaped synthetic resin base provided to the projecting portion, including a top with an opening in which the strain gauge is exposed and lateral portions intersecting the top, and having an inner circumferential surface slidable along an outer circumferential surface of the projecting portion; and an electronic component mounted on the lateral portions. The conductive member includes: a flexible circuit board having a first end connected to the terminal and a second end connected to the base; and a three-dimensional circuit connected to the electronic component, three-dimensionally arranged continuously along the top and the lateral portions of the base, and having one end connected to the flexible circuit board.
    Type: Grant
    Filed: June 5, 2014
    Date of Patent: July 12, 2016
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Yukinobu Iimori, Hironori Kobayashi, Shuji Tohyama
  • Patent number: 9352958
    Abstract: A physical quantity measurement sensor includes: a ceramic package including a plate provided with a flow port through which a fluid to be measured flows; an electronic component including a sensing element housed in the package to detect the pressure of the fluid to be measured having flown through the flow port; a terminal provided on an exterior of the package; a lid attached to a wall of the package; and a metal attachment piece used to attach the package to the mount member, the attachment piece being engaged with the mount member while holding the package.
    Type: Grant
    Filed: November 13, 2014
    Date of Patent: May 31, 2016
    Assignee: NAGANO KEIKI CO., LTD.
    Inventors: Atsushi Imai, Ryouichi Matsumura
  • Patent number: 8436742
    Abstract: A numeral-displaying face provided with a numeral-display and an exterior wall intersecting a periphery of the numeral-displaying face are provided on a cover and a case body of an indicator. A monitor indicator for checking an operating condition of the indicator is provided on the exterior wall. An outer circumference of the monitor indicator is flush with the exterior wall. A fallen object does not collide with the monitor indicator, so that damage on the monitor indicator can be prevented.
    Type: Grant
    Filed: October 14, 2009
    Date of Patent: May 7, 2013
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yuzuru Sato, Takayuki Ite, Toshiaki Kobayashi
  • Patent number: 8286496
    Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.
    Type: Grant
    Filed: February 16, 2010
    Date of Patent: October 16, 2012
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
  • Patent number: 8096189
    Abstract: A physical quantity sensor includes two substrates and a movable electrode that is disposed between the two substrates and is bonded to the two substrates. In the physical quantity sensor, the movable electrode has an elastically deformable diaphragm and one of the two substrates is an electrode substrate having a detection electrode on a detection surface opposite to the diaphragm to detect capacitance between the diaphragm and the detection electrode. In the physical quantity sensor, in a range between a room temperature and a bonding temperature when the two substrates and the movable electrode are bonded, coefficients of thermal expansion of the two substrates are smaller than that of the movable electrode and in a temperature range where the physical quantity sensor is used, a coefficient of thermal expansion of the movable electrode is between a first and second substrates.
    Type: Grant
    Filed: April 7, 2009
    Date of Patent: January 17, 2012
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Daiji Uehara, Yoichi Kobayashi
  • Patent number: 8044898
    Abstract: An LED display apparatus 1 in which at least multiple LEDs are serially-connected to a power circuit part having a constant current power source, each one of the LEDs has a switching element parallel-connected thereto, and a control circuit part is used to selectively turn on/off the switching elements to control the LEDs for a specific display, characterized by the fact that the apparatus comprises a display matrix circuit part 9 constituted by parallel-connecting to the power circuit part 8 multiple LED circuits 7a, 7b, 7c . . . consisting of multiple LEDs 2 . . . and a single first switching element 3a, 3b, 3c . . . serially-connected and second switching element 4 . . . each parallel-connected to one of the LEDs 2 . . . , and a control circuit part 10 turning on the first switching elements 3a . . . for a given time period (Ts) in sequence and turning on/off a row La, Lb, Lc . . . of multiple second switching elements 4 . . . extending across the LED circuits 7a . . .
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: October 25, 2011
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Hiroyuki Sakai, Takehiro Koyama, Hideki Muramatsu, Toshiaki Kobayashi
  • Patent number: 7802468
    Abstract: Disclosed is a pressure sensor 1 for a vehicle including a sensing element 10 for measuring the pressure of brake fluids in fluid passages, a sensor housing 20 for accommodating the sensing element 10, and contact probes 30 that are electrically connected to the sensing element 10 and an electronic control unit 300 (control unit). Each contact probe 30 includes a sleeve 31, a coil spring 32 (elastic member) housed in the sleeve 31, the rod 33 inserted into the sleeve 31. The sleeve 31 is connected to the sensing element 10 in a state that the sleeve 31 is fixed in the sensor housing 20, and the rod 33 is pressed to the electronic unit 300 by pressing force of the coil spring 32.
    Type: Grant
    Filed: August 8, 2008
    Date of Patent: September 28, 2010
    Assignees: Nissin Kogyo Co., Ltd., Nagano Keiki Co., Ltd.
    Inventors: Tatsuya Shinohara, Masahiko Nakano, Atsushi Imai, Yoshihiro Tomomatsu
  • Patent number: 7792657
    Abstract: A pressure display apparatus that includes a detected signal processor for processing a detected signal Si obtained from a pressure detector for detecting a pressure P, a pressure value display for displaying a detected pressure value Pd at least based on a processed signal Dd obtained from the detected signal processor, and a reference point adjuster for adjusting the display for a given reference pressure value Ps. The reference point adjuster has a reference pressure value setting function to set the reference pressure value Ps for a given magnitude, a deviation value setting capability for obtaining and setting a detected pressure value Pd corresponding to the reference pressure value Ps and the deviation value Ed of the reference pressure value Ps, and a correction capability for correcting at least the detected pressure value Pd regarding the pressure P and displayed on the display based on the deviation Ed.
    Type: Grant
    Filed: October 30, 2007
    Date of Patent: September 7, 2010
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Toshiaki Kobayashi, Hideki Muramatsu, Hidebumi Seki, Hiroyuki Sakai
  • Publication number: 20100206085
    Abstract: In a sensor, a joint is provided with a sensor module, and the sensor module is accommodated in a housing. The housing is provided with a terminal, and a flexible circuit board electrically connects a diaphragm of the sensor module with the terminal. The joint is also provided with a cap-shaped base, and the top of the base is provided with an opening through which the diaphragm is exposed. A lateral surface of the base, which is crosswise with the top where the opening is provided, is provided with a part of the flexible circuit board, and the part is provided with an electronic component. With this arrangement, no plate-shaped circuit board for mounting the electronic component is required, thereby reducing the manufacturing cost. Moreover, since the electronic component is provided on the lateral surfaces of the base, the base and the electronic component are horizontally arranged.
    Type: Application
    Filed: February 16, 2010
    Publication date: August 19, 2010
    Applicant: NAGANO KEIKI CO., LTD.
    Inventors: Haruhiko Sekiya, Shuji Tohyama, Hironori Kobayashi, Nobuhiko Akimoto
  • Patent number: 7748276
    Abstract: A manufacturing method of a pressure sensor that includes a pressure detector having a bottomed cylindrical member with a bottom including a thin-wall portion and a strain detecting mechanism provided on one side of the bottom for detecting a strain of the bottom and a pressure-introducing joint for introducing the fluid to be measured into the bottomed cylindrical member is provided. The method includes: first welding for butt-welding an end of the cylindrical portion of the bottomed cylindrical member and an end of the pressure-introducing joint; and second welding for welding the pressure-introducing joint in parallel to a first weld bead formed by the first welding.
    Type: Grant
    Filed: September 5, 2008
    Date of Patent: July 6, 2010
    Assignee: Nagano Keiki Co., Ltd.
    Inventors: Yoshikazu Kaneko, Hiroshi Kodama, Hiroshi Wakabayashi
  • Patent number: 7708051
    Abstract: A physical quantity detector, such as a pressure sensor and a load sensor, includes a cylindrical part of which one end is closed with a strain generating part and a sensor part formed on the strain generating part. The cylindrical part is produced by melting an alloying material having a composition capable of yielding an amorphous alloy, injecting the resultant molten alloy into a metal mold, and cooling the molten alloy in the metal mold to confer amorphousness on the alloy. The metal mold includes a split mold having at least two split parts for forming a cavity and an insert pin to be inserted into the cavity so as to define the inner configuration of the cylindrical part, or further an insert core to be inserted into the mold so as to form the surface of the cavity corresponding to the surface of the strain generating part.
    Type: Grant
    Filed: January 24, 2007
    Date of Patent: May 4, 2010
    Assignees: YKK Corporation, Nagano Keiki Co., Ltd.
    Inventors: Tetsuya Katsumi, Hitoshi Ofune, Tadashi Yamaguchi, Hiroshi Nagasaka, Naoki Yoshida