Abstract: An image-forming element includes a base member including a first surface, and a second surface opposite the first surface; and a reflector array located on the base member. The reflector array comprises a plurality of reflector rows, each including a plurality of dihedral corner reflectors arranged along a first direction. The plurality of reflector rows are arranged in a second direction crossing the first direction, the plurality of reflector rows being parallel to each other with a spacing therebetween. Each of the plurality of dihedral corner reflectors includes: a first reflecting surface configured to reflect light from a first surface side, and a second reflecting surface orthogonal to the first reflecting surface and configured to reflect a reflected light from the first reflecting surface toward the first surface side.

Abstract: A light emitting device includes a semiconductor laser element, a base member, and a cover. The base member includes a first alignment mark, a second alignment mark, a third alignment mark, and a fourth alignment mark. The base member has a disposition surface on which the semiconductor laser element is disposed. The cover is bonded to the base member to define a closed space in which the semiconductor laser element is arranged. The first alignment mark and the second alignment mark are arranged outside the closed space. The third alignment mark and the fourth alignment mark are arranged inside the closed space. A straight line connecting the first alignment mark and the second alignment mark is parallel to a straight line connecting the third alignment mark and the fourth alignment mark.

Abstract: A light-emitting device includes: a base including: a mount surface, and a lateral wall located around the mount surface, the lateral wall including: a pair of first protrusions located opposite to each other in a first direction which is parallel to a side of the mount surface, and a pair of second protrusions located opposite to each other in a second direction which is perpendicular to the first direction, the second protrusions being provided lower than the first protrusions; one or more light-emitting elements mounted on the mount surface of the base; a first light-transmissive member sealing a space in which the one or more light-emitting elements are mounted; and one or more wires connecting to the one or more light-emitting elements, the one or more wires being bonded on conduction regions provided on at least one of upper surfaces of the second protrusions.

Abstract: A light source device that supplies a constant current to a diode load that includes a plurality of light-emitting elements connected in series. The light source device includes a power supply circuit connected to the diode load and a peak current limiting circuit connected in series to the diode load. The peak current limiting circuit includes a current detector that is connected in series to the diode load and a current-regulating circuit that controls a current to the diode load by a detection voltage of the current detector. Further, the current detector has a series circuit including a resistor and a coil.

Abstract: A light emitting device includes a package for surface mounting, the package including at least three leads defining a first recess, a second recess, and a third recess. A first light emitting element is disposed in the first recess and emits first light, a second light emitting element is disposed in the second recess and emits second light, and a third light emitting element is disposed in the third recess and emits third light. A first colored resin member is disposed in the first recess, a second colored resin member is disposed in the second recess, and a third colored resin member is disposed in the third. A mold resin including a first lens portion, a second lens portion, and a third lens portion each overlapping a recess of a respective one of the plurality of leads.

Abstract: A method of preparing an anisotropic magnetic powder compression molded product, the method including: compressing a magnetic powder in a mold using a compression punch while magnetically orienting the magnetic powder to obtain a compressed magnetic powder, wherein the compression punch has a contact surface with the magnetic powder that is not perpendicular to a compression direction; and compression molding the compressed magnetic powder using a molding punch having a different shape from the compression punch.

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion as in the specification. The wavelength conversion portion includes a light incident surface and a light-emitting surface as in the specification. The package includes a disposition region as in the specification. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. In a plan view perpendicular to the light-emitting surface, the light-emitting surface has a shape that has a first region as in the specification, and a region of at least 80% or more of the light incident surface overlaps an imaginary line that passes through a point of the light-emitting surface closest to the semiconductor laser element and that is parallel to the second direction.

Abstract: A light-emitting device includes a semiconductor laser element, a wavelength conversion member, and a package. The wavelength conversion member includes a wavelength conversion portion and a reflective portion. The wavelength conversion portion includes a light incident surface and a light-emitting surface. The package includes a disposition region. The wavelength conversion member is disposed at a position away in a first direction from a position at which the semiconductor laser element is disposed. The light-emitting surface has a shape that, in a plan view perpendicular to the light-emitting surface, has a first region decreasing in width in a second direction perpendicular to the first direction from the side closest to the semiconductor laser element toward the first direction.

Abstract: A method of producing a phosphate-coated SmFeN-based anisotropic magnetic powder, the method including stirring a slurry containing a raw material SmFeN-based anisotropic magnetic powder, water, a phosphate source, and an aluminum source to obtain a SmFeN-based anisotropic magnetic powder having a surface coated with a phosphate.

Abstract: A light-emitting device includes a light-emitting element a semiconductor structure body including an n-side layer, a p-side layer, and an active layer, the n-side layer including an n-side exposed surface exposed from the active layer and the p-side layer in a plan view. The semiconductor structure body includes a side surface connecting the n-side exposed surface and an upper surface of the p-side layer. An insulating film includes a first opening exposing the n-side exposed surface, and a second opening positioned above the upper surface of the p-side layer. An n-side electrode includes a first part positioned above the upper surface of the p-side layer with the insulating film interposed, a second part electrically connected with the n-side exposed surface in the first opening and electrically connected with the first part located at the insulating film covering the side surface, and a third opening that exposes the insulating film covering the side surface of the semiconductor structure body.

Abstract: A method of manufacturing a light emitting element includes: an n-side nitride semiconductor layer growing process in which an n-side nitride semiconductor layer is grown; an active layer growing process in which an active layer comprising a plurality of nitride semiconductor well layers and a plurality of nitride semiconductor barrier layers is grown on the n-side nitride semiconductor layer, wherein the active layer is configured to emit ultraviolet light; and a p-side nitride semiconductor layer growing process in which a A-side nitride semiconductor layer is grown on the active layer. The active layer growing process includes: a first barrier layer growing process, a second barrier layer growing process, and a well layer growing process.

Abstract: A light emitting module according to an embodiment of the present disclosure includes a light source, a lens disposed over the light source and configured to transmit light from the light source, and a cover member disposed over the lens, wherein the cover member includes, in a top view, a first region, a second region located around the first region and having a higher light diffusion effect than the first region, and a third region located inward of the first region and on which the light from the light source transmitted through the lens is incident.

Abstract: A light-emitting device includes: a plurality of light-emitting elements arranged in an array on a base member; and a lens that comprises at least four Fresnel lenses disposed above the base member and facing the plurality of light-emitting elements. In a top plan view, a center of each of the plurality of light-emitting elements is offset from a lens center of the corresponding one of the Fresnel lenses of the lens in a direction toward a center of the lens. The plurality of light-emitting elements include at least two first light-emitting elements and at least two second light-emitting elements, wherein an emission color of the first light-emitting elements is different from an emission color of the second light-emitting elements.

Abstract: A light source device includes: a combined body including light emitting portions including: a first light emitting portion including a first light emitting element, and a second light emitting portion provided separately from and along an outer periphery of the first light emitting portion in a plan view, the second light emitting portion including a plurality of second light emitting elements; and a lens disposed above the combined body. The first light emitting element and the plurality of second light emitting elements are arrayed in first and second directions that are perpendicular to each other. The first light emitting element and the plurality of second light emitting elements are controllable to be lit independently.

Abstract: A light emitting device includes a substrate including first, second, third and fourth wiring portions on a top surface of a base member and arrayed in a first direction, and a connection wiring portion connecting the second and third wiring portions. The connection wiring portion includes first and second connection ends respectively connected with the second and third wiring portions, and a connection central portion connecting the first and second connection ends and having a maximum width in a second direction different from each of a maximum width of the first connection end and a maximum width of the second connection end. In the second direction, at least a part of the connection wiring portion has a width narrower than each of a maximum width of the second wiring portion and a maximum width of the third wiring portion.

Abstract: A method for processing a resin member includes: irradiating a first member comprising a resin with first light of a first wavelength that causes electronic excitation of the resin; and irradiating the resin electronically excited through irradiation with the first light with second light of a second wavelength longer than the first wavelength. A wavelength range of the second wavelength is within a wavelength range in which light absorption of the resin increases through electronic excitation of the resin.

Abstract: A method for producing a nickel cobalt complex hydroxide includes first crystallization of supplying a solution containing Ni, Co and Mn, a complex ion forming agent and a basic solution separately and simultaneously to one reaction vessel to obtain nickel cobalt complex hydroxide particles, and a second crystallization of, after the first crystallization, further supplying a solution containing nickel, cobalt, and manganese, a solution of a complex ion forming agent, a basic solution, and a solution containing said element M separately and simultaneously to the reaction vessel to crystallize a complex hydroxide particles containing nickel, cobalt, manganese and said element M on the nickel cobalt complex hydroxide particles crystallizing a complex hydroxide particles comprising Ni, Co, Mn and the element M on the nickel cobalt complex hydroxide particles.

Abstract: A semiconductor device includes: a package including: a heat dissipating body comprising a metal, an insulting part surrounding the heat dissipating body, one or more semiconductor laser elements disposed on the heat dissipating body, at least one outer metal layer that is located on a lower surface of the insulting part and is spaced from a lower surface of the heat dissipating body; a mounting substrate including: at least one first metal pattern located at an upper surface of the mounting substrate, and a second metal pattern located at the upper surface of the mounting substrate; at least one first bonding member located between the at least one outer metal layer and the first metal pattern; and a second bonding member located between the lower surface of the heat dissipating body and the second metal pattern, wherein the second bonding member comprises a metal material.

Abstract: A method for manufacturing a semiconductor element includes preparing a semiconductor structure body that includes a p-side layer and an n-side layer; forming a first carbon film on the p-side layer by vapor deposition, the vapor deposition utilizing carbon ions generated by an arc discharge without introducing a gas to a discharge space, the discharge space being a vacuum; forming a second carbon film on the n-side layer by the vapor deposition; removing the first carbon film; and removing the second carbon film. A first bias voltage of the forming during the first carbon film on the p-side layer is higher than a second bias voltage of the forming during the second carbon film on the n-side layer.

Abstract: A cap has a cavity for accommodating a light-emitting element and includes a front wall defining a front surface of the cavity and made of a material that transmits light emitted from the light-emitting element; a rear wall defining a rear surface of the cavity and located opposite to the front wall; and a main body defining an upper surface and a lateral surface of the cavity and joined with the front wall and the rear wall. A lower end surface of each of the front wall, the rear wall, and the main body defines a bonding surface of the cap, and the main body includes a plurality of portions layered between the rear wall and the front wall.