Abstract: To provide a semiconductor light emitting device which is capable of accomplishing a broad color reproducibility for an entire image without losing brightness of the entire image. A light source provided on a backlight for a color image display device has a semiconductor light emitting device comprising a solid light emitting device to emit light in a blue or deep blue region or in an ultraviolet region and phosphors, in combination. The phosphors comprise a green emitting phosphor and a red emitting phosphor. The green emitting phosphor and the red emitting phosphor are ones, of which the rate of change of the emission peak intensity at 100° C. to the emission intensity at 25° C., when the wavelength of the excitation light is 400 nm or 455 nm, is at most 40%.

Abstract: A method of manufacturing a light emitting device includes providing an intermediate body having a light emitting element, a bottom part on which the light emitting element is disposed, and a first wall disposed on the bottom part and surrounding the light emitting element apart from a lateral face of the light emitting element. The method further includes disposing a light transmissive member having a height in excess of the height of the first wall and covering the upper face of the first wall and the light emitting element, forming a first groove by removing a portion of the light transmissive member thereby exposing at least a portion of the upper face of the first wall, forming a second wall by disposing a first resin in the first groove, and cutting the second wall along a lengthwise direction of the first groove thereby obtaining the light emitting device.

Abstract: A display driving circuit drives a display unit including a plurality of light-emitting elements connected along respective common lines and arranged in a matrix. The driving circuit includes one or more element drivers for driving the plurality of light-emitting elements of the display unit, a memory that stores lighting period information indicating a lighting period in which each light-emitting element is lit by the one or more element drivers, an element lighting period controller that outputs the lighting period information stored in the memory to each element driver, a switching unit that selects each common line based on the lighting period information stored in the memory, and a common line lighting period controller that is interposed between the memory and the switching unit and controls a lighting period in which each common line is activated according to the lighting period information.

Abstract: A light emitting device includes: a base; a first terminal and a second terminal located at a surface of the base; a light emitting element array chip mounted on the base, the light emitting element array chip including: a support substrate, a plurality of first wirings and a plurality of second wirings disposed on the support substrate, and a plurality of light emitting elements, each of the light emitting elements arranged on the first wiring and the second wiring and electrically connected to the first wiring and the second wiring; and a plurality of wires including a first wire connecting the first wiring to the first terminal, and a second wire connecting the second wiring to the second terminal.

Abstract: A light-emitting module including a substrate, a light-emitting device disposed on the substrate, a lens, and an optical sensor. The light-emitting device includes at least one light-emitting element and a light-transmissive member disposed on a light extraction surface of the at least one light-emitting element. The lens is disposed apart from the light-emitting device at a position where the lens faces the light-emitting device. The optical sensor has an upper surface including a light-receiving surface to receive light through the lens and is disposed on the substrate at a position where at least a part of the light-receiving surface faces the lens. A center of the light-emitting device is located at a center of the lens in a plan view.

Abstract: A method for manufacturing a wavelength conversion member, includes: providing a wavelength conversion layer having a phosphor-containing portion and a light reflecting portion surrounding the phosphor-containing portion, and the wavelength conversion layer having an upper surface, a bottom surface and at least one side surface; forming a light-blocking film on the upper surface of the wavelength conversion layer; and removing a part of the light-blocking film by laser processing to expose at least a part of the phosphor-containing portion from the light-blocking film.

Abstract: A method of producing a positive electrode active material, the method includes: contacting first particles that contain a lithium transition metal composite oxide with a solution containing sodium ions to obtain second particles containing the lithium transition metal composite oxide and sodium element, wherein the lithium transition metal composite oxide has a layered structure and a composition ratio of a number of moles of nickel to a total number of moles of metals other than lithium in a range of from 0.7 to less than 1; mixing the second particles and a boron compound to obtain a mixture; and heat-treating the mixture at a temperature in a range of from 100° C. to 450° C.

Abstract: A light emitting device includes: at least one semiconductor laser element; a base member on which the at least one semiconductor laser element is disposed; a light-transmissive member including: an upper surface, a lower surface, and a light-transmissive region through which laser light emitted from the at least one semiconductor laser element is transmitted from the lower surface to the upper surface; and a lens member through which the laser light emitted from the at least one semiconductor laser element, the lens member being fixed to the base member or the light-transmissive member. At least the light-transmissive region is made of sapphire. The light-transmissive member includes an incident surface on which the laser light is incident, the incident surface being an a-plane of the sapphire.

Abstract: A method for manufacturing a light-emitting element includes: preparing a semiconductor structure body that includes: an n-side layer, a p-side layer, and an active layer positioned between the n-side layer and the p-side layer, where the n-side layer includes a plurality of first regions arranged in a first direction in a top view, the first regions exposed from the active layer and the p-side layer; forming a first insulating film on the p-side layer, between the first regions; forming a second insulating film to continuously cover the first regions, the p-side layer, and the first insulating film; forming an n-side opening in the second insulating film by removing the second insulating film on the first regions and on the first insulating film; and forming an n-side electrode in the n-side opening, the n-side electrode contacting the first regions and the first insulating film.

Abstract: A light-emitting device includes: a substrate having an upper surface; at least one light-emitting element on or above the substrate, the at least one light-emitting element having a rectangular shape in a plan view from above the light-emitting device and having an upper surface serving as a light-emitting surface of the at least one light-emitting element; a plate-shaped light-transmissive member having a rectangular shape in a plan view from above the light-emitting device and having a lower surface that faces the upper surface of the at least one light-emitting element; and a light-guiding member that is disposed between the light-emitting element and the light-transmissive member.

Abstract: A method for manufacturing a ceramic sintered body substrate includes of disposing a first metal paste on a surface of a ceramic substrate, and of firing the ceramic substrate on which the first metal paste is disposed. In the disposing the first metal paste, the first metal paste contains a plurality of first metal powders, a plurality of active metal powders, and a plurality of inorganic fillers excluding metals, and in the firing the ceramic substrate, a firing temperature is equal to or higher than a melting point of the first metal powders.

Abstract: The vehicle light-emitting device includes a light-emitting element having a peak emission wavelength of 400 nm or greater and 510 nm or less, and a fluorescent member including a first phosphor excited by light emitted by the light-emitting element and emitting light having a peak emission wavelength of 480 nm or greater and 530 nm or less a second phosphor excited by the light emitted by the light-emitting element and emitting light having a peak emission wavelength of 540 nm or greater and 600 nm or less. The vehicle light-emitting device emits light in a region AL in a CIE1931 chromaticity diagram as defined in the present disclosure.

Abstract: A semiconductor device includes: a semiconductor element; a submount on which the semiconductor element is mounted, wherein the submount has a first surface on which the semiconductor element is mounted, a second surface located on a side opposite the first surface, and a lateral surface located between the first surface and the second surface, and wherein the submount comprises: a groove located at the second surface, a heat dissipation portion located at the second surface, and an electrode pattern located at the first surface; a package substrate on which the submount is mounted; a first joint member that physically joins the heat dissipation portion to the package substrate; and a connection portion located on the side surface, wherein the connection portion electrically connects the electrode pattern and the package substrate, and the connection portion comprises a second joint member.

Abstract: A planar light source includes: a support member; a light guide member disposed on the support member and having a light source positioning part; and a light source disposed on the support member while being in the light source positioning part of the light guide member. The support member includes: an insulation base having a first face positioned closer to the light source and a second face positioned opposite the first face, a first conductive layer disposed on the first face of the insulation base and electrically connected to the light source, an adhesive layer disposed on and in contact with the first face of the insulation base and the first conductive layer, and a light reflecting sheet disposed on the adhesive layer.

Abstract: A light emitting device includes: a package including a first lead, a second lead, and a molded body; and a light emitting element provided on the second lead. The first lead includes a first electrode terminal having a first thickness in a thickness direction, and a first holding portion connected to the first electrode terminal and having a thickness smaller than the first thickness in the thickness direction, the first holding portion having a front surface and a rear surface opposite to the front surface in the thickness direction. The second lead includes a second electrode terminal facing the first electrode terminal in the thickness direction, and a connection electrically connected to the first lead. The molded body holds the first lead and the second lead and covers the front surface and the rear surface of the first holding portion.

Abstract: A light emitting device includes: a base member having a first surface including a first region; a first electric terminal including a first pin hole, the first pin hole penetrating the base member along a thickness direction of the base member; a second electric terminal including a second pin hole, the second pin hole penetrating the base member along the thickness direction; a first frame provided on the base member and surrounding the first region; a plurality of light emitting elements provided on the base member in the first region; a light-transmissive first member provided inward of the first frame, and covering the plurality of light emitting elements; and a protective element positioned between the base member and the first frame in the thickness direction.

Abstract: A light emitting device includes: an insulating base; a first upper metal part located on an upper surface of the base; a first light emitting element that is disposed on the upper surface of the base with the first upper metal part being interposed between the first light emitting element and the base, and is configured to emit light laterally from a first emission end surface of the first light emitting element; a first reflective member that is disposed on the upper surface of the base without the first upper metal part being interposed between the first reflective member and the base, faces the first light emitting element, and has a first reflective surface configured to reflect the light upward; and one or more lower metal parts located on the lower surface of the base.

Abstract: A method for manufacturing a light-emitting element includes preparing a wafer that includes a semiconductor structure body and a light-transmitting conductive film; forming a first mask on the light-transmitting conductive film; removing the light-transmitting conductive film exposed from the first mask to form an opening in the light-transmitting conductive film, the opening exposing the semiconductor structure body from under the light-transmitting conductive film; forming an n-side exposed part by removing the semiconductor structure body exposed from the first mask; removing the first mask; forming a second mask on the light-transmitting conductive film; removing the light-transmitting conductive film exposed from the second mask; forming an n-side electrode at the n-side exposed part; forming a third mask on the light-transmitting conductive film and on the semiconductor structure body; and removing the semiconductor structure body to form a groove dividing the semiconductor structure body into a plural

Abstract: A method for producing a ceramic complex includes: preparing a raw material mixture that contains 5% by mass or more and 40% by mass or less of first rare earth aluminate fluorescent material particles containing an activating element and a first rare earth element different from the activating element, 0.1% by mass or more and 32% by mass or less of oxide particles containing a second rare earth element, and the balance of aluminum oxide particles, relative to 100% by mass of the total amount of the first rare earth aluminate fluorescent material particles, the oxide particles, and the aluminum oxide particles; preparing a molded body of the raw material mixture; and obtaining a sintered body by calcining the molded body in a temperature range of 1,550° C. or higher and 1,800° C. or lower.

Abstract: A composite substrate includes a base layer formed of a composite material containing diamond and a metal, the base layer a first surface, and a second surface opposite to the first surface; a flat layer having a lower surface bonded to the first surface of the base layer, and an upper surface having a surface roughness Ra of 10 nm or less; and an insulating layer directly bonded to the upper surface of the flat layer.