Patents Assigned to NingBo Sunny Opotech Co., Ltd.
  • Patent number: 11575844
    Abstract: A multi-aperture imaging system and application thereof are provided. The multi-aperture imaging system includes a long-focal length camera module, a mid-focal length camera module and a wide-angle camera module. The long-focal length camera module has a field of view-FOV3. The mid-focal length camera module has a field of view-FOV2. The wide-angle camera module has a field of view-FOV1. They satisfy the condition of FOV1>FOV2>FOV3. Besides, a portion of the field of view area of FOV1 is covered by a portion of the field of view area of FOV2, while a portion of the field of view area of FOV2 is covered by a portion of the field of view area of FOV3, so as to enable a better zooming performance.
    Type: Grant
    Filed: January 25, 2021
    Date of Patent: February 7, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Yinli Fang, Mingzhu Wang, Lifeng Yao, Zhenyu Chen, Ang Ji, Yurong Wu
  • Patent number: 11575883
    Abstract: A 3D test chart, an adjusting arrangement, a forming method, and an adjusting method thereof are disclosed. The 3D test chart provides a plurality of test patterns arranged at different depths. When testing a photographic arrangement, the photographic arrangement is only required to move for one time or even does not need to be moved, so as to obtain an image containing information of different depths, so that the testing and adjusting process of the photographic arrangement can be easily achieved.
    Type: Grant
    Filed: December 21, 2020
    Date of Patent: February 7, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Baozhong Zhang, Chunmei Liu
  • Patent number: 11570336
    Abstract: A camera module includes an optical lens, a light-sensitive chip and an electrical support. The electrical support includes a circuit module embedded in a support body to form an integral structure, a connecting member provided on the support body to electrically connect with the circuit module, and a camera component coupled at the support body and electrically connected to the connecting member. Therefore, the electrical support not only forms a circuit board to electrically connect with the camera component but only serves as a base to support the camera component.
    Type: Grant
    Filed: April 27, 2021
    Date of Patent: January 31, 2023
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Feifan Chen, Liang Ding, Nan Guo, Ye Wu, Heng Jiang
  • Publication number: 20220413250
    Abstract: The present disclosure provides a camera module and an optical lens thereof, an optical lens element and a manufacturing method therefor, and a method for assembling a large wide-angle camera module, wherein the camera module comprises a lens and a photosensitive assembly. The lens comprises a lens barrel, at least one first lens element unit and at least one second lens element unit, and is further provided with at least one notch, wherein the first lens element unit and the second lens element unit are disposed in the lens barrel, and the first lens element unit is configured as a non-rotating body, and wherein the notch is provided in the lens barrel, or the notch is formed in the first lens element unit, or the notch is formed in the second lens element unit, and the first lens element unit is marked by means of the notch.
    Type: Application
    Filed: August 28, 2020
    Publication date: December 29, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Kailun ZHOU, Bing WU, Meishan GUO, Wei LI, Wenbin LI, Yu HUANG, Yan JIN
  • Patent number: 11533416
    Abstract: A camera module and an array camera module based on an integral packing process are disclosed. The camera module or each of the camera module units of the array camera module includes a circuit board, an integral base, a photosensitive element operatively connected to the circuit board, a lens, a light filter holder installed at the integral base and a light filter installed at the light filter holder. The light filter is not required to be directly installed to the integral base, so that the light filter is protected and the requiring area of the light filter is reduced.
    Type: Grant
    Filed: September 18, 2019
    Date of Patent: December 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Bojie Zhao, Zhenyu Chen, Nan Guo, Takehiko Tanaka
  • Patent number: 11531183
    Abstract: An optical assembly, a camera module having the optical assembly, and a smart device having the camera module.
    Type: Grant
    Filed: October 16, 2018
    Date of Patent: December 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Zhenyu Chen, Hongde Tu, Yinli Fang, Hui Qiu
  • Patent number: 11531180
    Abstract: A multi-group lens assembly (10), a camera module (100), and an electronic device (200) therefore are provided. The multi-group lens assembly (10) includes at least two group units (11 and 12). At least a first gap (15) is provided between the at least two adjacent group units (11 and 12) to compensate a difference between the multi-group lens assembly (10) and an optical design system, thus allowing an optical system of the multi-group lens assembly conform to the optical design system of the present invention.
    Type: Grant
    Filed: June 15, 2018
    Date of Patent: December 20, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei Liu, Mingzhu Wang, Hailong Liao, Liang Ding
  • Publication number: 20220382070
    Abstract: Provided are a camera module, a camera lens with a mark and a manufacturing method thereof, and an assembly method of an extra-wide-angle camera module. The camera module includes a camera lens and a photosensitive assembly. The camera lens includes a lens tube, at least one first lens unit, at least one second lens unit and at least one mark element. The first lens unit and the second lens unit are provided in the lens tube. The first lens unit is a non-rotational member. The mark element is provided at the lens tube, and is used to position the first lens unit.
    Type: Application
    Filed: August 31, 2020
    Publication date: December 1, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Bing WU, Kailun ZHOU, Wei LI, Yu HUANG, Yan JIN
  • Publication number: 20220375978
    Abstract: A molded photosensitive assembly of a camera module includes at least one supporting member formed by a first substance, at least one photosensitive element, at least one circuit board, at least one set of wires electrically connecting the photosensitive element to the circuit board, and at least one molded base. Two ends of each of the wires are respectively connected to a chip connector of the photosensitive element and a circuit connector of the circuit board. The molded base is formed by a second substance and comprises a molded body and has at least one light window, wherein the photosensitive element and the wires are protected by a supporting member which is provided for avoiding an upper mold of a molding-die pressing on the wires during the molding process.
    Type: Application
    Filed: February 23, 2022
    Publication date: November 24, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu WANG, Zhenyu CHEN, Nan GUO, Bojie ZHAO, Takehiko TANAKA, Zhen HUANG, Zhongyu LUAN, Heng JIANG
  • Publication number: 20220367556
    Abstract: The present application relates to a circuit board assembly, a photosensitive assembly, a camera module, and preparation methods for the circuit board assembly and the photosensitive assembly. The photosensitive assembly includes a circuit board and a photosensitive chip. The circuit board includes a circuit board main body, a through hole formed through the circuit board main body, a set of circuit board electrical connecting terminals disposed on the lower surface of the circuit board main body, a conducting medium disposed on the circuit board electrical connecting terminals, and a non-conducting adhesive covering the conducting medium. The photosensitive chip includes chip electrical connecting terminals disposed in a non-photosensitive area.
    Type: Application
    Filed: October 21, 2020
    Publication date: November 17, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Zhen HUANG, Zhongyu LUAN, Yinbo ZHANG, Fengsheng XI, Hongfeng GAN
  • Publication number: 20220357567
    Abstract: Provided is a periscopic camera module, which includes a first reflective element mounted on a first base, an optical lens mounted on a second substrate, a second reflective element mounted on a third substrate, and a photosensitive chip mounted on a fourth substrate. Particularly, the first reflective element is used to reflect the incident light to make it longitudinally turned; the optical lens is used to receive the reflected light which is longitudinally turned and output an imageable light beam; the second reflective element is a second prism, which is adapted to laterally turn the imageable light beam at least once and has a reflecting surface located on a side surface of the second prism; and the photosensitive chip is adapted to receive the imageable light beam laterally turned by the second reflective element. Also provided is a corresponding electronic device.
    Type: Application
    Filed: August 31, 2020
    Publication date: November 10, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Bojie ZHAO, Lifeng YAO, Dongli YUAN, Sisi YU, Zhen HUANG
  • Patent number: 11493605
    Abstract: Provided are a depth information camera module and a base assembly, a projection assembly, an electronic device and a manufacturing method thereof. The depth information camera module includes: a projection assembly to project a laser to a to-be-detected object; a receiving assembly, including a photosensitive element for receiving the laser reflected from the to-be-detected object; and a base assembly, the base assembly including a circuit board and a base body, the base body being supported by the circuit board, where the photosensitive element is electrically connected to the circuit board, the projection assembly circuit board is supported on a top side of the base body such that the circuit board and the projection assembly circuit board are respectively at different heights of the base assembly. Here, the projection assembly has an integral structure to facilitate assembly of the projection assembly.
    Type: Grant
    Filed: June 3, 2019
    Date of Patent: November 8, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Feifan Chen, Zhongwei Wang, Qi Rong, Junjie Zeng, Hangang Wei, Beibei Dai, Minjie Pan
  • Patent number: 11480754
    Abstract: A multi-group lens assembly includes a plurality of lens group units and at least one assembly structure. The assembly structure is for assembling two adjacent lens group units. Lenses in the lens group units are made of any two or three of a glass material, a resin material, and a glass-resin composite material. Alternatively, the lenses are made of only the glass-resin composite material. The lenses can be assembled and adjusted easily and conveniently and have high pixel densities and small TTLs, thereby improving user experience.
    Type: Grant
    Filed: June 14, 2018
    Date of Patent: October 25, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei Liu, Mingzhu Wang, Zhenyu Chen, Nan Guo
  • Publication number: 20220334339
    Abstract: Provided is a lens assembly, which comprises: a first optical lens module, comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module, comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. A lower end portion of the first carrier extends to the bearing portion, so as to constrain the relative positions of the first optical lens module and the second optical lens module.
    Type: Application
    Filed: July 6, 2022
    Publication date: October 20, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Chunmei LIU, Yiqi WANG, Liang DING, Mingzhu WANG, Hailong LIAO, Nan GUO
  • Publication number: 20220334342
    Abstract: An optical lens (1), comprising a first lens (100) and a lens assembly (110). The first lens (100) includes a first optical area (101) and a first structural area (102) surrounding the first optical area (101), and the first structure area (102) includes a height measurement area (103) not coated with an anti-reflective coating. The lens assembly (110) includes a lens barrel (104) and at least one second lens (105) disposed in the lens barrel (104). The at least one second lens (105) includes a second optical area (106) and a second structural area (107) surrounding the second optical area (106). The first structural area (102) is connected to an end face (109) of the lens barrel (104) near the first lens (100) or the second structural area (107) of the second lens (105) closest to the first lens (100). A manufacturing method of optical lens (1) and a camera module are also disclosed.
    Type: Application
    Filed: August 28, 2020
    Publication date: October 20, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Zhewen MEI, Haipeng PEI, Takehiko TANAKA, Renkang LIN, Hui LI, Lei WANG
  • Patent number: 11477354
    Abstract: A camera module and its molded circuit board assembly and manufacturing method are disclosed, wherein the molded circuit board assembly includes a circuit board and a molded base integrally formed with the circuit board through a molding process. The molded base forms a light window disposed corresponding to a photosensitive element of the camera module, wherein the light window is configured to have a trapezoidal or to multi-stair trapezoidal shape cross section which has diameters increasing from bottom to top to facilitate demoulding, so as to prevent damage to the molded base, and to avoid stray light.
    Type: Grant
    Filed: April 8, 2020
    Date of Patent: October 18, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Zhenyu Chen, Nan Guo, Takehiko Tanaka, Bojie Zhao, Zilong Deng
  • Patent number: 11457135
    Abstract: The present invention provides a camera unit with a light steering mechanism and application thereof, wherein the camera unit includes a long-focal-length camera module and a wide-angle camera module, wherein the wide-angle camera module provides a wide-angle image, and a ratio between an equivalent focal length of the long-focal-length camera module and an equivalent focal length of the wide-angle camera module is not less than 4, wherein the long-focal-length camera module includes a light steering mechanism, a long-focal-length lens and a long-focal-length photosensitive assembly, wherein the light steering mechanism is used for turning the light to pass through the long-focal-length lens to be received by the long-focal-length photosensitive assembly, wherein a height dimension of the long-focal-length camera module does not exceed 5.6 mm.
    Type: Grant
    Filed: June 6, 2019
    Date of Patent: September 27, 2022
    Assignee: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Mingzhu Wang, Yinli Fang, Lifeng Yao, Ang Ji, Yurong Wu
  • Publication number: 20220303443
    Abstract: The present invention provides a TOF camera module and a projection module thereof, and an electronic device, wherein the TOF camera module comprises a projection module and a receiving module, wherein the projection unit of the projection module is controlled by the driver chip to project detection light, and wherein the receiving module is disposed adjacent to the projection module, the receiving module receives reflected light of the detection light, and obtains depth information of an illuminated object based on the reflected light. The projection module comprises a transmitting circuit board, a support, an optical element, at least one projection unit and at least one driver chip, wherein the driver chip is conductively connected to the transmitting circuit board, and the driver chip controls the projection unit through the transmitting circuit board, and wherein the driver chip and the projection unit are located on the same side of the transmitting circuit board.
    Type: Application
    Filed: July 1, 2020
    Publication date: September 22, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD.
    Inventors: Hangang WEI, Feifan CHEN
  • Publication number: 20220299728
    Abstract: An optical lens (1000), comprising a first lens element (110) and a second lens component (200). The first lens element (110) has a first surface (112) located on an object side and a second surface (117) located on an image side, wherein a central region of the first surface (112) protrudes toward the object side to form a protruding portion (111), a top surface (113) of the protruding portion (111) forms an optical area (113a), the first surface (112) further has a first structured area (115) surrounding the protruding portion (111), and a side surface (114) connects the optical area (113a) and the first structured area (115). The second lens component (200) comprises a second lens barrel (220) and at least one second lens element (210) mounted inside the second lens barrel (220), and the at least one second lens element (210) and the first lens element (110) together constitute an imageable optical system.
    Type: Application
    Filed: July 3, 2020
    Publication date: September 22, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Mingzhu WANG, Lifeng YAO, Qi RONG, Zhewen MEI, Meishan GUO, Dongli YUAN, Haipeng PEI, Jun WANG
  • Publication number: 20220303436
    Abstract: The present application relates to a photosensitive assembly, including a circuit board, a photosensitive chip and a metal wire. A first surface of the circuit board has a protrusion structure and a chip attachment area, and the protrusion structure is distributed in the chip attachment area. The photosensitive chip is attached to the first surface by an adhesive, and the adhesive is at least disposed between the top surface of the protrusion structure and the bottom surface of the photosensitive chip. The metal wire electrically connects the photosensitive chip and the circuit board in a wire bonding manner. The present application further provides a corresponding manufacturing method for a camera module and a photosensitive assembly. The present application can avoid or suppress the deformation of the photosensitive chip at a smaller cost of space size. The photosensitive assembly and the camera module of the present application can improve the structural strength of the circuit board.
    Type: Application
    Filed: July 8, 2020
    Publication date: September 22, 2022
    Applicant: NINGBO SUNNY OPOTECH CO., LTD
    Inventors: Zhongyu LUAN, Zhen HUANG, Li LIU, Hongfeng GAN, Tinghua LI, Xinxiang SUN