Abstract: The present invention provides a camera module and a molding circuit board assembly, circuit board and application thereof, the circuit board comprising a digital circuit unit, an analog circuit unit and a substrate. The digital circuit nit and the analog circuit unit are respectively formed on the substrate, and the digital circuit unit and the analog circuit unit are conductively connected to each other, wherein at least one part of the analog circuit unit has a safe distance from the digital circuit unit, so as to prevent an electromagnetic wave generated by a circuit of the digital circuit unit from interfering with an electrical signal transmitted and processed by the analog circuit unit, thereby improving the stability and reliability of the transmission and the processing of the electrical signal by the circuit board.

Abstract: Disclosed are a split camera lens (20) and an assembly method thereof, a camera module (10), and a terminal device (100). The split camera lens (20) includes: a first lens portion (21) including a first optical lens (211), and a second lens portion (22): wherein the first lens portion (21) is assembled on the second lens portion (22), and the second lens portion (22) includes a lens barrel (222) and at least one second optical lens (221) mounted in the lens barrel (222); and the second optical lens (221) at the topmost side is completely exposed on the top of the lens barrel (222), thus, a “lens barrel top face” structure of the first lens portion (21) and the second lens portion (22) is removed so as to enlarge an adjustment range of the split camera lens (20).

Abstract: Disclosed is a periscopic camera module, including: a first reflective element including a first reflective surface and used to reflect incident light and make the incident light longitudinally turn; an optical lens used to receive the light reflected by the first reflective element and output an imageable light beam to an image space; a second reflective element including at least one second reflective surface and adapted to make the imageable light beam transversely turn at least once; and a photosensitive chip adapted to receive the transversely turned imageable light beam, wherein at least one of all optical surfaces of the first reflective element and the second reflective element is provided with a light blocking structure, and the light blocking structure is arranged at an edge region of the at least one optical surface; and the optical surface includes a reflective surface, an incident surface, or an eixt surface.

Abstract: A camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method are provided. The photosensitive assembly includes a photosensitive chip having a photosensitive area and an electric connection area located around the photosensitive area, at least one resistance-capacitance device, a conducting element, an expanded wiring layer, and a molded base. The expanded wiring layer has a top surface and a bottom surface. The at least one resistance-capacitance device is electrically connected to the bottom surface of the expanded wiring layer. The conducting element extends between the bottom surface of the expanded wiring layer and the electric connection area of the photosensitive chip, so as to electrically connect the photosensitive chip to the expanded wiring layer by means of the conducting element. A light hole is formed in the expanded wiring layer, and the light hole corresponds to at least the photosensitive area of the photosensitive chip.

Abstract: Disclosed are a camera module and a photosensitive assembly thereof, an electronic device, and a manufacturing method. The photosensitive assembly includes a photosensitive chip, at least one resistance-capacitance device, an extended wiring layer, a filter element assembly, and a molded base. The filter element assembly includes a filter element and a bonding layer bonded around the filter element. The filter element assembly is attached to a top surface of the extended wiring layer, and the filter element of the filter element assembly corresponds to a light transmission hole of the extended wiring layer, so that external light is filtered by the filter element before reaching a photosensitive area of the photosensitive chip through the light transmission hole.

Abstract: An assembly device for an optical assembly comprises: a grasping mechanism (310) configured to grasp a first sub-lens to be assembled, and to move the grasped first sub-lens in multiple degrees of freedom; a first fixing mechanism (320) configured to fix a second sub-lens to be assembled, wherein the grasping mechanism (310) is movable relative to the first fixing mechanism (320), so that the first sub-lens and the second sub-lens form an optical system capable of imaging; a second fixing mechanism (330) configured to fix a photosensitive assembly; a data acquiring assembly (340) configured to be electrically connected to the photosensitive assembly fixed by the fixing mechanism (330) and acquire image data output by the photosensitive assembly; and a material connecting assembly (210) configured to fix the first and second sub-lenses together.

Abstract: A camera lens module includes a lens assembly. The lens assembly may comprise a first optical lens module comprising a first carrier and at least one first optical lens received in the first carrier; and a second optical lens module comprising a second carrier, at least one second optical lens received in the second carrier, and a bearing portion connected to the second carrier. When the first optical lens module and the second optical lens module are assembled together, an adjustable clearance exists between the first carrier and the bearing portion, and between bottom surfaces of the first carrier and a lowermost lens of the first optical lenses and a top surface of an uppermost lens of the second optical lenses.

Abstract: A photosensitive assembly includes a circuit board and a photosensitive chip, as well as a molded base. The molded base is integrally formed on the circuit board and the photosensitive chip, and forms a light window for providing a light path for the photosensitive chip. For a portion of the molded base corresponding to a first end side of the molded base adjacent to a flexible region, a distance between outer and inner edges thereof is a; for a portion of the molded base corresponding to an opposite second end side of the molded base away from the flexible region, a distance between outer and inner edges thereof is c, wherein 0.2 mm?a?1 mm, and 0.2 mm?c?1.5 a. The dimensions a and c enable a corresponding forming groove in a molding process to be filled with molding material.

Abstract: Disclosed in the present application are a camera module, and a photosensitive assembly and a manufacturing method therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, and a shaping member provided on the circuit board. A lower surface of the photosensitive chip is attached to the shaping member to form an accommodating space with the shaping member and the circuit board. The accommodating space is configured so that the photosensitive chip is bent downward during a process of assembling the photosensitive assembly. In this way, the photosensitive chip is bent into a shape adapted to the actual focal plane during the assembly process, so as to improve the imaging quality.

Abstract: An optical lens (1000) includes a first lens (110) and a second lens component (200). A central area of a first surface (112) of the first lens (110) protrudes to an object side to form a protrusion portion (111), and a top surface (113) of the protrusion portion (111) forms an optical area (113a), and a first structural area (115) surrounds the protrusion portion (111). The second lens component (200) includes a second lens barrel (220) and at least one second lens (210), and a top of the second lens barrel (220) is provided with an extension portion (221) extending inwards, so as to form a light inlet hole (222) of the second lens component (200). Moreover, the topmost second lens (210) has a third surface (211) located at the object side, and the third surface (211) includes an optical area (211a) at center, an inner structural area (211b) surrounding the optical area (211a), and an outer structural area (211c).

Abstract: Disclosed are a molded circuit board and a camera module, and a manufacturing method thereof and an electronic device comprising the same. The molded circuit board includes a circuit board main body and a molded structure. The circuit board main body includes at least one circuit layer and at least one substrate layer, wherein the circuit layer and the substrate layer are stacked in a manner of being spaced apart.

Abstract: The present application relates to a photosensitive assembly, a camera module and manufacturing methods therefor. The photosensitive assembly comprises a circuit board, a photosensitive chip electrically connected to the circuit board, at least one electronic component disposed on the circuit board, and a molded body integrally formed on the circuit board. The molded body has at least one slot formed therein in a recessed manner, and the slot is located outside the photosensitive chip. In this way, the magnitude of stress that the molded body acts on the photosensitive chip is reduced by means of the slot being disposed in the molded body, so as to effectively reduce the amount of deformation of the photosensitive chip due to the stress.

Abstract: A variable aperture device, which is suitable for photographing and filming of a camera module, includes a main body, a fluid passage, and a fluid accommodation cavity, wherein the main body is used to be provided in the camera module, and the main body has a light-transmitting region, the fluid passage is provided in the light-transmitting region of the main body, the fluid accommodation cavity is in communication with the fluid passage for an light-impermeable fluid to be driven to flow back and forth between the fluid accommodation cavity and the fluid passage to enlarge or reduce the light transmission area of the light-transmitting region.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: A camera module includes an optical assembly, a filter and a molded photosensitive assembly mounted under the optical assembly and the filter, wherein the molded photosensitive assembly comprises a main body, a plurality of electronic components, a photosensitive chip, and a circuit board electrically connected with the electronic components and the photosensitive chip, wherein the electronic components, the photosensitive chip and the circuit board are positionally fixed with each other by the main body, wherein the photosensitive chip is fixed and surrounded by the bottom of the main body to keep distance with the filter, wherein the main body comprises a container body supporting the optical assembly thereon and a lower body supporting the filter thereon, wherein the lower body is extended from the inner side of the container body.

Abstract: An adjustable camera module and an assembly test method therefor. The assembly test method for the adjustable camera module comprises: measuring a static tilt amount between the optical lens sheet group and the photosensitive assembly by performing a defocus curve test on the adjustable camera module; analyzing a static adjusting electric quantity of each adjustment coil of an adjustment coil group according to the static tilt amount; and burning the static adjusting electric quantity required by each adjustment coil so as to reduce process requirements.

Abstract: A method for manufacturing a semiconductor module for an image-sensing device is disclosed. The method may comprise forming a first molding component on a first surface of a printed circuit board (PCB); mounting at least a photosensitive member to a second surface of the PCB; and forming a second molding component on the second surface of the PCB. The PCB may comprise at least an electric component on the first surface of the PCB. The first molding component may encapsulate the at least one electric component with the PCB. The second molding component may secure the photosensitive member on the PCB.

Abstract: A camera module includes a circuit board, a photosensitive element mounted on the circuit board, and a support body formed on the circuit board and surrounding the photosensitive element. The support body extends towards the photosensitive element and contacts the photosensitive element. The support body and the circuit board are fixed together to form a combined body, and the combined body has a side face including an indented surface indented towards the direction of the photosensitive element, one end of the indented surface being located at the bottom surface of the circuit board. A method is used for manufacturing a camera module and an intelligent terminal with built-in camera module. The screen-to-body ratio of the intelligent terminal is increased, which allows the thickness of the intelligent terminal to be further decreased, enables easy processing, and allows for a miniaturized camera module having a good structural strength.

Abstract: Provided is a camera module and a photosensitive component thereof and a manufacturing method thereof, said photosensitive component comprising: a circuit board, a photosensitive element, and a molding base; the molding base is integrally formed on the circuit board and photosensitive element to form a light window; a first end side corresponding to the molding base adjacent to the flexible region has a first side surface facing the light window; said first side surface comprises a first partial surface arranged adjacent to the photosensitive element and a second partial surface connected to said first portion surface; a first angle between said first partial surface and the optical axis of the camera module is greater than a second angle between the second partial surface and the optical axis; a second end side opposite to and away from the flexible region of the molding base has a second side surface facing the light window; said second side surface comprises a third partial surface arranged adjacent to the

Abstract: A camera lens module includes an image sensor and a lens assembly. The image sensor includes a photosensitive chip defining a photosensitive path, wherein the lens assembly is coupled to the image sensor along the photosensitive path of the photosensitive chip. The lens assembly includes at least one optical lens module and an aperture member coupled at the optical lens module, wherein the optical lens module includes a lens barrel and at least an optical lens supported within the lens barrel. A relative position of the lens assembly with respect to the image sensor is adjustable for calibration and the relative position of the optical lens module is permanently fixed after calibration.