Patents Assigned to Nippei Toyama Corporation
  • Publication number: 20020007985
    Abstract: A lubricant supply apparatus 1 includes a tank holder portion 3 and a lubricant tank portion 2. In case where a tool holder clamp device 62 provided on a spindle shaft 61 pushes against an abutting member 35 disposed in the lubricant supply apparatus 1, lubricant filled in a pressure chamber 11 formed in the lubricant supply apparatus 1 can be jetted out from injection holes 39, . . . formed in the abutting member 35. The thus jetted-out lubricant is supplied to the tool holder clamp device 62.
    Type: Application
    Filed: June 22, 2001
    Publication date: January 24, 2002
    Applicant: NIPPEI TOYAMA CORPORATION
    Inventor: Mitsuru Nukui
  • Patent number: 6332834
    Abstract: A workpiece 23 formed of a circular thin plate is rotated about its center as an axis L1. Each of disk-shaped rotating grinding wheels 27 and 28, while being rotated about an axis L3 extending in a direction substantially parallel to the plane of the workpiece 23 and perpendicular to the radial direction of the workpiece 23, is made to undergo relative feeding movement on both obverse and reverse surface sides of the workpiece 23 along an outer peripheral edge portion 23a of the workpiece 23. Consequently, the outer peripheral edge portion 23a of the workpiece 23 is ground by an outer peripheral surface of each of the rotating grinding wheels 27 and 28. In this case, it is preferred that two grinding wheels 27 and 28 for rough grinding and finish grinding be provided as the disk-shaped rotating grinding wheels, and that rough grinding and finish grinding are performed by the same station.
    Type: Grant
    Filed: March 31, 2000
    Date of Patent: December 25, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Mitsuru Nukui, Shirou Murai, Michihiro Takata, Tetsuo Okuyama, Muneaki Kaga, Toyotaka Wada
  • Patent number: 6322710
    Abstract: A managing system for managing slurry, which is used to machine workpieces. The slurry contains dispersion liquid and abrasive grains. Slurry that has been used in machining further includes impurities that are smaller than the abrasive grains. A first decanter centrifugally separates a mixture of impurities and dispersion liquid from the used slurry to recover recyclable abrasive grains from the slurry. A second decanter centrifugally separates impurities from the mixture to recover recyclable dispersion liquid from the slurry. A specific gravity gage and a viscosity gage detect properties of the used slurry. The rotating speeds of the first and second decanters are controlled in accordance with the detected properties of the slurry. This always maintains the separating efficiency of both decanters at an optimal value thus effectively recovering and recycling the abrasive grains and dispersion liquid.
    Type: Grant
    Filed: December 22, 1998
    Date of Patent: November 27, 2001
    Assignees: Mitsubishi Kakoki Kaisha Ltd., Nippei Toyama Corporation, Toyobo Co., Ltd.
    Inventors: Noboru Katsumata, Takaharu Nishida, Kazuki Omori
  • Patent number: 6302769
    Abstract: In the wafer chamfering method, there is used a disk-shaped grindstone 8 which includes: a peripheral edge portion serving as a grinding surface 1; a flat portion formed in the central portion of the grinding surface 1 in the width direction thereof; and, two edge portions 5 respectively formed on the two sides of the flat portion 2 in the width direction thereof and made in the form of the shape of the valley portion of the notch portion 4 of a disk-shaped wafer 3 to be chamfered. In operation, in the wafer chamfering method, while rotating the above grindstone 8, the grindstone 8 is revolved in the thickness direction of the wafer 3 to thereby chamfer the wafer 3.
    Type: Grant
    Filed: April 13, 1999
    Date of Patent: October 16, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Shirou Murai
  • Patent number: 6296553
    Abstract: A workpiece receiving hole 60a for fittingly receiving a workpiece 17 is formed in the center of a rotary disk 60 which is thinner than the workpiece 17. A workpiece drive section 60b which engages a notch 17a formed for the purpose of orienting the workpiece 17 relative to crystal orientation is formed along the brim of the hole 60a. A gear 59 is rotated by a gear 62 of a motor 61, thereby rotating the rotary disk 60 and imparting torque to the workpiece 17. Accordingly, both surfaces of the workpiece are ground by means of a double disc surface grinder.
    Type: Grant
    Filed: March 31, 1998
    Date of Patent: October 2, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Mitsuru Nukui, Shirou Murai, Kazuo Nakajima, Toyotaka Wada
  • Patent number: 6220931
    Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.
    Type: Grant
    Filed: April 26, 1999
    Date of Patent: April 24, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Mitsuru Nukui, Kazuo Nakajima, Shirou Murai, Toyotaka Wada
  • Patent number: 6198070
    Abstract: A laser beam machining method includes the steps of, irradiating a laser beam on a machining portion of a workpiece for the machining thereof, blowing out an assist gas toward the machining portion of the workpiece continuously during the irradiating step, and blowing out a blow gas toward the machining portion intermittently during the irradiating step.
    Type: Grant
    Filed: July 22, 1999
    Date of Patent: March 6, 2001
    Assignee: Nippei Toyama Corporation
    Inventor: Masanori Nakayama
  • Patent number: 6182729
    Abstract: An apparatus for manufacturing a plurality of wafers by slicing a cylindrical ingot with a wire saw. The apparatus includes a measuring device for measuring the crystal orientation of the ingot; an adhering device for adhering a support to the surface of the ingot based on the orientation where the support includes an intermediate plate and a support plate, where the support plate is adapted to fit the wire saw, and where the adhering device includes an auxiliary adhering element for adhering the intermediate plate to the surface of the ingot and an adhering element for adhering the support plate to the intermediate plate; a dryer for drying and solidifying an adhesive applied between the ingot and the intermediate plate and an adhesive applied between the intermediate plate and the support plate; and the wire saw for slicing the ingot into the plurality of wafers while the ingot is supported on the support.
    Type: Grant
    Filed: January 29, 1998
    Date of Patent: February 6, 2001
    Assignee: Nippei Toyama Corporation
    Inventors: Yoshiaki Banzawa, Nobuaki Hayashi, Kiyoakira Shimizu
  • Patent number: 6179909
    Abstract: In the work crystal orientation adjusting method, the crystal orientations of a work 22 in the rotational direction and in the horizontal direction thereof are measured by an orientation measuring device 76. In accordance with the measured value of the crystal orientation of the work 22 in the rotational direction, the work 22 is rotated about the axis thereof to thereby adjust the crystal orientation of the work 22 in the rotational direction. On the outer surface of the work 22, there are put marks M1 and M2 indicating reference positions for adhesion of an auxiliary plate B which is used to cut the work 22. The auxiliary plate B is adhered to the outer peripheral surface of the work 22 based on the marks M1 and M2. A work mounting plate 53 is mounted onto a support base 40 to thereby support the work 22 on the support base 40.
    Type: Grant
    Filed: September 11, 1998
    Date of Patent: January 30, 2001
    Assignees: Nippei Toyama Corporation, Sumitomo Sitix Corporation
    Inventors: Yoshiaki Banzawa, Kazunori Onizaki
  • Patent number: 6112737
    Abstract: A wire saw which can improve a working accuracy is provided. When a wire goes to a rightward direction by a rotation of a moving motor, the wire is inclined in such a manner as to be moved toward a right and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Further, when a wire goes to a leftward direction by a rotation of the moving motor, the wire is inclined in such a manner as to be moved toward a left and outer periphery from an inner portion of a work, and a cutting start point of the work becomes a point within the work. Then, the work is cut from the cutting start point by a sufficient slurry containing float abrasive grains supplied to a portion on the wire.
    Type: Grant
    Filed: June 19, 1998
    Date of Patent: September 5, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Kazutomo Kinutani, Shigeo Kobayashi, Etsuo Kiuchi
  • Patent number: 6113489
    Abstract: A method of slicing an ingot wherein a pre-cut work 3 in which a holding member 2 extending over the entire length of a side surface of a cylindrical ingot 1 is bonded to the side surface of the ingot 1 is set on a slicing apparatus 4, and the pre-cut work 3 is split into a multiplicity of pieces over its longitudinal direction so as to obtain disk-shaped works 5 to be ground, characterized in that a retaining member 2 is used in which a retaining layer 7 which is directly bonded to the side surface of the ingot 1 by a first adhesive agent having an adhesive strength sufficient to receive a rotating force due to a grinding apparatus 6 in a subsequent grinding process, an intermediate layer 8 which is bonded to said retaining layer 7 in a superposed manner by a second adhesive agent whose adhesive strength deteriorates more than that of the first adhesive agent under a fixed condition, and a supporting layer 11 which is connected to said intermediate layer 8 and is connected to a supporting portion 10 of said
    Type: Grant
    Filed: March 31, 1999
    Date of Patent: September 5, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Tetsuo Okuyama, Mitsuru Nukui, Kazuo Nakajima, Shirou Murai, Toyotaka Wada, Tomio Nakagawa
  • Patent number: 6095129
    Abstract: There is provided a tension adjusting mechanism which can prevent a dancer arm from being widely rotated and a peripheral roller such as a guide roller from early abrading even in the case a wire is tensioned or loosened in accordance with a speed increase or decrease of the wire. A plurality of dancer rollers are rotatably supported to a front end of a rotatable dancer arm. A plurality of guide rollers are disposed in such a manner as to oppose to the dancer rollers, thereby successively guiding one wire on the dancer roller through the guide rollers. A predetermined tension is applied to the wire by rotating and urging the dancer arm to one direction by an urging member.
    Type: Grant
    Filed: June 24, 1998
    Date of Patent: August 1, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Yukihiro Kanemichi, deceased, Etsuo Kiuchi
  • Patent number: 6077146
    Abstract: A taper correcting apparatus for a grinding machine comprises: workpiece supporting means for supporting a workpiece in parallel with a grinding wheel spindle; a cutting and feeding device which moves back and forth a cylindrical grinding wheel with respect to said workpiece; a wheel slide which is attached to a bed so as to be movable back and forth with respect to said workpiece; a pair of grinding wheel bearing pedestals which rotatably support ends of said grinding wheel spindle via bearings with respect to said wheel slide, respectively; a first grinding wheel bearing pedestal support which is fixed to said wheel slide, and which clampingly supports one of said grinding wheel bearing pedestals; a second grinding wheel bearing pedestal support which is attached so as to be rotatable about a round shaft, and which clampingly supports another one of said grinding wheel bearing pedestals, said round shaft being attached below said grinding wheel spindle to said wheel slide in parallel with the center line of
    Type: Grant
    Filed: October 1, 1998
    Date of Patent: June 20, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Masayuki Sato, Hisao Sasaki, Yoshiharu Oyabe
  • Patent number: 6070496
    Abstract: A chuck (25) for chucking a journal (271) of a crankshaft (27) is attached to the distal end of a main spindle (22) rotated by a drive motor. A phasing rotary shaft (53) is connected to the chuck (25) to rotate about an axis offset from the axis of the main spindle (22). The chuck (25) is provided with a coupling (63) that releasably connects the phasing rotary shaft (53) and the chuck (25). Further, a locking mechanism for locking the phasing rotary shaft (53) is provided. The coupling (63) has a pair of coupling plates (64 and 65) that can be moved closer to and farther from each other. Opposing faces of these coupling plates (64 and 65) have teeth (641 and 651), which are meshed when the coupling plates (64 and 65) are brought close to each other.
    Type: Grant
    Filed: August 17, 1998
    Date of Patent: June 6, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Hiroyuki Uchida, Yukio Kokaji
  • Patent number: 6071220
    Abstract: In the tool change device, a tool change arm 27 for changing a tool 25 with respect to a main spindle 24, a main tool magazine 29 including a plurality of hold grooves 30 arranged linearly for holding the tools 25, and a tool storage member 41 including at least one storage portion 46 for storing the tool 25 are arranged in the back-and-forth direction of the tool change device. In order that the tools 25 can be delivered between the tool change arm 27 and main tool magazine 29, between the main tool magazine 29 and tool storage member 41, and between the tool storage member 41 and tool change arm 27, a single tool loader L is disposed in such a manner that it can be moved in correspondence to the tool change arm 27, main tool magazine 29 and tool storage member 41.
    Type: Grant
    Filed: October 28, 1998
    Date of Patent: June 6, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Tsutomu Sugihara, Hisao Sasaki, Kazuoki Sakai, Kenichiro Morita, Toshio Yasoshima
  • Patent number: 6056031
    Abstract: An apparatus for connecting a cylindrical ingot to a support plate includes means for measuring a crystal orientation of the ingot based on a diffraction of x-rays, means for rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, means for adhering an intermediate plate to the ingot, means for adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and means for attaching the support plate to the intermediate plate.
    Type: Grant
    Filed: November 6, 1998
    Date of Patent: May 2, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Yoshiaki Banzawa, Nobuaki Hayashi, Kiyoakira Shimizu
  • Patent number: 6036585
    Abstract: A spindle 23 of a grinding wheel 28 is rotatively borne by a bench 22 for the grinding wheel through hydrostatic thrust bearings 26 and 27. A pressure regulator 38 for regulating the pressure which must be supplied to at least either of supply ports 26a and 27a opposite to each other in the direction of the axial line of the spindle 23 in the hydrostatic thrust bearings 26 and 27 is provided. The pressure regulator 38 has a changing member for changing a passage for choking the fluid and the length of the choking passage.
    Type: Grant
    Filed: March 26, 1998
    Date of Patent: March 14, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Kenichiro Nishi, Mitsuru Nukui, Kazuo Nakajima, Shirou Murai, Toyotaka Wada
  • Patent number: 6024814
    Abstract: A method for connecting a cylindrical ingot to a support plate includes measuring a crystal orientation of the ingot based on a diffraction of x-rays, rotating the ingot about a center axis based on the crystal orientation so that a center axis of the ingot is held parallel to a first plane and an orientation axis based on the crystal orientation is placed in a plane parallel to the first plane, adhering an intermediate plate to the ingot, adjusting a position of one of the support plate and the ingot in a plane parallel to the first plane based on the crystal orientation so that a mounting axis of the support plate is in a specific relationship with the orientation axis, and attaching the support plate to the intermediate plate.
    Type: Grant
    Filed: November 26, 1996
    Date of Patent: February 15, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Yoshiaki Banzawa, Nobuaki Hayashi, Kiyoakira Shimizu
  • Patent number: 6020573
    Abstract: A laser beam machining apparatus capable of eliminating a complicated unit arranged to vertically move pallets and adapted to a pallet storage unit for making the heights of upper and lower pallets to be constant so as to simplify the structure thereof and improve the working efficiency. A chain drive mechanism is mounted on a frame, and upper and lower machining pallets are connected to intermediate positions of a chain of the chain drive mechanism. When the lower-stage machining pallet has been moved to a lower machining position, a laser-beam machining head is moved downwards toward a work piece placed on the lower machining pallet to machine the lower work piece without vertical movement of the lower-stage machining pallet. The laser machining head is vertically movable in accordance with the height of the workpiece on each of the machining pallets.
    Type: Grant
    Filed: October 31, 1997
    Date of Patent: February 1, 2000
    Assignee: Nippei Toyama Corporation
    Inventor: Yasunori Chabatake
  • Patent number: D421994
    Type: Grant
    Filed: August 12, 1998
    Date of Patent: March 28, 2000
    Assignee: Nippei Toyama Corporation
    Inventors: Shigeo Kobayashi, Yasuhiro Ito