Abstract: An apparatus to insure safe behavior in an inverter system. In one embodiment, the apparatus includes a first high side gate driver, a first low side gate driver, a microcontroller configured to control the first high side and low side gate drivers. A voltage regulator provides a supply voltage to the microcontroller. A first pair of high side voltage regulators provide a first pair of high side supply voltages to the first high side gate driver. A first pair of low side voltage regulators provide a first pair of low side supply voltages to the first low side gate driver.

Abstract: A method for direct memory access includes: receiving a direct memory access request designating addresses in a data block to be accessed in a memory; randomizing an order of the addresses the data block is accessed; and accessing the memory at addresses in the randomized order. A system for direct memory access is disclosed.

Abstract: A system includes an RF signal source configured to output an RF signal at a first frequency, and a first controller configured to generate a first data signal encoding instructions at a second frequency. A first filter is coupled to the RF signal source. The first filter is a low pass filter having a cutoff frequency between the first frequency and the second frequency. The first filter is configured to couple to a first end of a cable. A second filter is coupled to the first controller. The second filter is a high pass filter having a cutoff frequency between the first frequency and the second frequency. The second filter is configured to couple to the first end of the cable. The system includes an impedance matching network configured to couple to a second end of the cable. A first electrode is coupled to the impedance matching network.

Abstract: A GPIO includes a transmitter having an output stage connected to the I/O pad and adapted to supply transmit data to an I/O pad in response to output data generated by a low voltage core logic operating within a functional voltage range for transmit operations; a receiver adapted to supply receive data to the low voltage core logic operating within the functional voltage range in response to input data received at the I/O pad for receive operations; a VLV transmitter adapted to supply VLV transmit data to the output stage of the transmitter and not directly to the I/O pad in response to output test data generated by the low voltage core logic; and a VLV receiver adapted to supply VLV receive data to the low voltage core logic operating within a low core supply voltage range in response to input data received from the output stage of the transmitter.

Abstract: One example discloses a first wireless device, including: a band-steering device including a band-detection element and a band-steering element; wherein the band-detection element is configured to receive a first signal from a second wireless device and detect from the first signal if the second device has multi-band capability; and wherein the band-steering element is configured to respond to the first signal by transmitting a second signal to the second device in a preferred band.

Abstract: Various embodiments relate to a method for power save operation by a non-access point (non-AP) multi-link device (MLD), wherein a plurality of links are established between the non-AP MLD and an AP MLD, including: setting, by the non-AP MLD, a QoS capability for a first access category to a first state on all links of the plurality of links that the non-AP MLD operates; transmitting, by the non-AP MLD, a first management frame to the AP MLD, wherein the first management frame is used to request a multi-link setup with the AP MLD, and wherein the first management frame includes a first element that comprises the setting of the QoS capability for the first access category; receiving, by the non-AP MLD, a second management frame from the AP MLD, wherein the second management frame includes information for an association ID (AID) that corresponds to the non-AP MLD, wherein the AID is assigned to the non-AP MLD regardless of the number of links in the plurality of links; and receiving, by the non-AP MLD, a third m

Abstract: A cost-effective process and structure is provided for a thermal dissipation element for semiconductor device packages incorporating antennas that can incorporate RF/EMI shielding from the antenna elements. Certain embodiments provide incorporated antenna element structures as part of the same process. These features are provided using a selectively-plated thermal dissipation structure that is formed to provide shielding around semiconductor device dies that are part of the package. In some embodiments, the thermal dissipation structure is molded to the semiconductor device, thereby permitting a thermally efficient close coupling between a device die requiring thermal dissipation and the dissipation structure itself.

Abstract: Embodiments of a method and an apparatus for wireless communications are disclosed. In an embodiment, a method for wireless communications involves generating a Physical Layer Protocol Data Unit (PPDU) that includes a resource unit (RU), wherein a size of the RU is less than a signal bandwidth and wherein data corresponding to the RU is distributed onto a disjoint set of subcarriers included in a frequency unit, and transmitting the PPDU using the disjoint set of subcarriers in accordance with a power spectrum density (PSD) limit.

Abstract: Radio frequency (RF) packages containing substrates having coefficient of thermal expansion (CTE) matched mount pads are disclosed, as are methods for fabricating RF packages and substrates. In embodiments, the RF package contains a high thermal performance substrate including a metallic base structure, which has a frontside facing a first RF power die and a first die attach region on the frontside of the base structure. A first CTE matched mount pad is bonded to the metallic base structure and covers the first die attach region. The first CTE mount pad has a CTE greater than the CTE of RF power die and less than the CTE of the metallic base structure. An electrically-conductive bonding material attaches the RF power die to the first CTE matched mount pad, while RF circuitry integrated into first RF power die is electrically coupled to the metallic base structure through the mount pad.

Abstract: One example discloses a first-device: wherein the first-device is configured to be coupled to a second-device over an IEEE 802.11 communications link; and wherein the first-device is configured to, store a current setup between the first-device and the second-device; identify a unique identifier of the second-device; transmit a request frame to a third-device; wherein at least one of the second-device and third-device is a multi-link-device (MLD); wherein the request frame is configured to request an association with the third-device and includes the unique identifier of the second-device; receive a response frame from the third-device; and wherein the response frame includes an indication that request was successful.

Abstract: Various embodiments relate to a method performed by a first wireless device for announcing operating capabilities to a second wireless device, wherein the first wireless device and second wireless device support a first protocol and a second protocol, including: announcing by the first device original capabilities to the second device; receiving an announcement of capabilities from the second device; receiving frames from the second device in PHY Protocol Data Units (PPDUs) following the first protocol and the second protocol; announcing by the first device a change in its capabilities to the second device; and receiving frames from the second device in PPDUs transmitted using the changed capabilities following the first protocol and the second protocol, wherein the change in the capabilities includes a change in a one of a puncture parameter, bandwidth parameter, mode and coding scheme (MCS) parameter, and a number of simultaneous streams (Nss) parameter.

Abstract: A lead-frame assembly is disclosed, for a semiconductor die and comprising a die attach pad and a plurality of elongate leads spaced apart therefrom; wherein each elongate lead has a first proximal end portion, a second distal end portion and a middle portion therebetween; wherein the die attach pad and each of the plurality of elongate leads each comprise a coating-free portion, and a coated portion having a coating material thereon; wherein a part of a perimeter of the die attach pad proximal each lead is comprised in the coating-free portion, and wherein the proximal end portion of each elongate lead is comprised in the coating-free portion. Associated package assemblies and methods are also disclosed.

Abstract: An access point device operable in a wireless network detects multi-band capability of a wireless client based on a probe request received from the wireless client on the non-preferred communication band. The multi-band capability is detected based on a set of parameters included in the received probe request. When the wireless client is detected to have the multi-band capability, the access point device blocks the attempt of the first wireless client to associate on the non-preferred communication band. The access point device allows the wireless client to associate on one of the non-preferred communication band and a preferred communication band based on a count of probe requests received by the access point device from the wireless client on the non-preferred communication band. Upon association on the non-preferred communication band, the access point device steers the associated wireless client to the preferred communication band.

Abstract: A modem for a non-standalone network includes a 5G-NR modem and an E-UTRA modem. The 5G-NR modem includes a cell search module which determines first timing information. The first timing information includes first times indicative of the times of receipt of one or more first radio frames from a first 5G-NR base station measured relative to a network time. The 5G-NR modem also provides for the sending of system frame timing difference (SFTD) information for the first base station to a network controller by sending the first timing information to the E-UTRA modem. The E-UTRA modem then determines and forwards the SFTD information using the first timing information and second timing information. The second timing information is determined by the E-UTRA modem and includes second times indicative of the times of receipt of one or more second radio frames from a second E-UTRA base station.

Abstract: The disclosure relates to a system for transmitting Protocol data units (PDUs). Example embodiments include a system comprises a radio link control (RLC) layer for storing a RLC PDU list of RLC Protocol Data Units (PDUs) received from a ProtocolData Convergence Protocol (PDCP) layer. The control layer comprises a transmission block for transmission to a Media Access Layer (MAC) layer in a transmission event, wherein the transmission block is populated with a subset of PDUs in the RLC PDU list. When the transmission block is near a storage limit, the system scans the RLC PDU list for a PDU that best fits a remaining grant of the transmission block to complete population of the transmission block. The control layer further comprises a priority list for storing PDUs of the RLC PDU list scanned by the system that were greater in size than the remaining grant.

Abstract: A wireless network includes a networking device and various stations. The networking device determines an available bandwidth of each station of the wireless network. Further, the networking device assigns a bandwidth and at least one spatial stream to each station. The bandwidth assigned to each station is less than or equal to the available bandwidth of the corresponding station. Further, the bandwidth assigned to one station is different from and partially overlaps with the bandwidth assigned to another station. Similarly, the spatial stream assigned to one station is different from the spatial stream assigned to another station. The networking device generates a data packet indicative of the bandwidth and the spatial stream assigned to each station of the wireless network, and transmits the data packet to each station to enable multi-user multiple-input-multiple-output (MU-MIMO) communication between the networking device and the stations.

Abstract: A semiconductor device comprises a substrate including a set of interconnect pads, a die mounted on the substrate, wherein the die includes circuitry that cannot withstand typical lead-free (Pb-free) solder reflow temperature during reflow process, and a reinforcing interposer including a first set of interconnect pads and a second set of interconnect pads. Low temperature solder material connects one of the set of interconnect pads on the substrate to a corresponding one of the first set of interconnect pads on the reinforcing interposer. A printed circuit board includes a set of interconnect pads. Low temperature solder material connects one of the set of interconnect pads of the printed circuit board to a corresponding one of the second set of interconnect pads of the reinforcing interposer. The low temperature solder material has a reflow temperature below typical Pb-free solder material.

Abstract: The processor system includes a processor coupled to a memory having a plurality of memory banks and a region configurable as a heap region. At least one memory bank is allocated to the heap region dependent on a predetermined memory size required for execution of at least one cryptographic operation. At least one further memory bank is allocated to the heap region. The processor system may switch between first and second operating states. The first operating state has a lower power consumption than the second operating state. The processor system switches between a first and second operating mode by setting at least one memory bank and at least one further memory bank to an active state. The processor system switches between the second and first operating mode by setting at least one memory bank to a retention state and the at least one further memory bank to a power-down state.

Abstract: Stable switching is disclosed for a power factor correction boost converter using an input voltage and an output voltage. In one example, a boost converter control system includes a gate driver coupled to a switch of a boost converter to generate a drive signal to control switching of the switch, wherein a period of the drive signal is adjusted using a current adjustment signal. A current control loop is coupled to the gate driver to receive a sensed input current from the boost converter and a desired input current and to generate the current adjustment signal to the gate driver. A current limiter is coupled to the gate driver and the current control loop to determine a duty cycle of the switch, to determine a maximum input current in response to the duty cycle, and to restrict the desired input current to below the maximum input current.

Abstract: A method and apparatus are described for controlling the phase of an interleaved boost converter using cycle ring time. In an embodiment, a cycle controller generates a first drive signal to control switching of a first converter and a second drive signal to control switching of a second converter, the controller receives a first cycle signal from the first converter and a second cycle signal from the second converter, wherein the first cycle signal and the second cycle signal have a power phase time and a ringing phase time. The cycle controller determines a master ringing phase time of the first cycle signal and applies the master ringing phase time to the second cycle signal to determine a slave ringing phase time. The cycle controller generates the second drive signal in accordance with the slave ringing phase time.