Patents Assigned to Octavo Systems LLC
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Publication number: 20210072958Abstract: The present disclosure describes a mixed signal arithmetic logic unit configured to use a combination of analog processing elements and digital processing elements in a cohesive manner. Depending on the signals and the data received for processing, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize computational results and the performance of the mixed signal arithmetic logic unit.Type: ApplicationFiled: February 22, 2019Publication date: March 11, 2021Applicant: Octavo Systems LLCInventors: Erik James WELSH, Laurence Ray SIMAR, Jr., Peter LINDER, Gene Alan FRANTZ
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Publication number: 20200403618Abstract: The present disclosure describes a mixed signal computer unit using a combination of analog and digital components/elements in a cohesive manner. Depending on the signals and data that need to be processed, the analog processing elements and digital processing elements may be used separately, independently or in combination to optimize the computational results and the performance of the computation. Operations may be controlled by one or more digital cores.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Laurence Ray SIMAR, Jr., Erik James WELSH, Peter LINDER, Gene Alan FRANTZ
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Publication number: 20200402601Abstract: The present disclosure describes analog memories for use in a computer, such as a computer using a combination of analog and digital components/elements used in a cohesive manner.Type: ApplicationFiled: February 22, 2019Publication date: December 24, 2020Applicant: Octavo Systems LLCInventors: Peter LINDER, Laurence Ray SIMAR, Jr., Erik James WELSH, Gene Alan FRANTZ
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Patent number: 10867979Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.Type: GrantFiled: December 12, 2018Date of Patent: December 15, 2020Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Gene Alan Frantz
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Publication number: 20200303321Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.Type: ApplicationFiled: June 10, 2020Publication date: September 24, 2020Applicant: Octavo Systems LLCInventors: Masood MURTUZA, Peter Robert Linder, Gene Alan FRANTZ
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Publication number: 20200243451Abstract: High performance modules for use in System-in-Package (SIP) devices, and methods of manufacture for such modules and SIPs. The modules employ one or more interposer substrates on which high performance components and/or devices are operatively mounted and interconnected.Type: ApplicationFiled: October 11, 2018Publication date: July 30, 2020Applicant: Octavo Systems LLCInventors: Gene Alan FRANTZ, Masood MURTUZA, Erik James WELSH, Peter Robert LINDER
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Patent number: 10714430Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.Type: GrantFiled: July 20, 2018Date of Patent: July 14, 2020Assignee: OCTAVO SYSTEMS LLCInventors: Masood Murtuza, Peter Robert Linder, Gene Alan Frantz
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Publication number: 20200134268Abstract: The present disclosure describes a computer using a combination of analogue and digital components/elements used in a cohesive manner. Depending on the signals and data the computer manipulates, the analog processing elements and digital processing elements can be used separately, independently or in combination to optimize the computational results and the performance of the computer.Type: ApplicationFiled: April 16, 2018Publication date: April 30, 2020Applicant: Octavo Systems LLCInventor: Gene Alan Frantz
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Publication number: 20200066702Abstract: Methods and structures for manufacturing one or more System in a Package (SiP) devices. The functionality of a packaged SiP device can be modified according to aspects of the disclosure.Type: ApplicationFiled: August 23, 2019Publication date: February 27, 2020Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Erik James Welsh, Christopher Lloyd Reinert, Gene Alan FRANTZ
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Publication number: 20200058364Abstract: Systems, methods, and computer program products directed to testing a System-in-a-Package (SIP) using an Automatic Test Equipment (ATE) machine. A functional representation of one or more tests to be performed in the SIP is loaded in a memory located on a load board, the load board located on the ATE machine. A test controller located on at least one of the SIP and the load board is caused to retrieve and store the one or more tests to be performed in the SIP. The test controller is instructed to conduct the one or more tests in the SIP.Type: ApplicationFiled: January 31, 2018Publication date: February 20, 2020Applicant: Octavo Systems LLCInventor: Kevin Michael TROY
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Publication number: 20190347378Abstract: Systems and methods to translate or convert a desired circuit into a database that instructs a place and route or wire bonding machine where on a substrate to place components and also where to place bond wires on the pads of a connection matrix on a substrate. During the assembly process, the pads of the connection matrix are populated with bond wires using the database.Type: ApplicationFiled: September 18, 2017Publication date: November 14, 2019Applicant: OCTAVO SYSTEMS LLCInventors: Neeraj Kumar Reddy DANTU, Masood MURTUZA, Gene Alan FRANTZ
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Patent number: 10470294Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.Type: GrantFiled: May 1, 2018Date of Patent: November 5, 2019Assignee: OCTAVO SYSTEMS LLCInventors: Erik James Welsh, Peter Linder
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Publication number: 20190273073Abstract: The present disclosure describes a service module for a System in a Package (SiP) device. This includes methods of manufacture, use, and testing relating to the same.Type: ApplicationFiled: March 5, 2019Publication date: September 5, 2019Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Gene Alan FRANTZ
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Publication number: 20190206779Abstract: A substrate for a SIP is that has a portion of its top surface covered with spaced apart electrically conductive landing pads for electrical connection to components located on the surface and the landing pads serve as interconnection pads for making electrical connections between at least a portion of said pads when interconnected by a segment of bond wire to form at least a portion of the SIP. Methods for use of the universal substrate in SIP system design and manufacture of a SIP.Type: ApplicationFiled: August 31, 2017Publication date: July 4, 2019Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Erik James WELSH, Peter LINDER, Gene Alan FRANTZ
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Publication number: 20190115331Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.Type: ApplicationFiled: December 12, 2018Publication date: April 18, 2019Applicant: OCTAVO SYSTEMS LLCInventors: Masood MURTUZA, Gene Alan FRANTZ
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Publication number: 20190074268Abstract: Methods, systems, and devices for enabling the use of SIP subsystems to make a configurable system with desired characteristics and features are provided. A configurable system's unique interconnecting scheme creates appropriate connections between the SIP components and/or subsystems.Type: ApplicationFiled: September 2, 2016Publication date: March 7, 2019Applicant: Octavo Systems LLCInventors: Masood MURTUZA, Gene Alan FRANTZ, Neeraj Kumar Reddy DANTU
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Patent number: 10204890Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.Type: GrantFiled: August 13, 2015Date of Patent: February 12, 2019Assignee: Octavo Systems LLCInventors: Masood Murtuza, Gene Alan Frantz
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Publication number: 20190027443Abstract: Electromagnetic interference (EMI) shielding structures for use inside an electronic system are provided, which allow access for mold compound or cables by using baffle-like features on the shield's sides and/or top, as well as methods for shielding components from EMI, or for containing EMI. The structures block external RF from sensitive components and reduce EMI emission from internal, RF generating components.Type: ApplicationFiled: July 20, 2018Publication date: January 24, 2019Applicant: Octavo Systems LLCInventors: Masood MURTUZA, Peter Robert Linder, Gene Alan Frantz
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Publication number: 20180321313Abstract: A power management device and microprocessor within a System-in-Package (SiP) are provided with communication signals externally available as outputs from the SiP so that they can be configured by an external device. Methods for the configuration of SiPs and Power Management Integrated Circuits (PMICs) packaged within a SiP are also provided.Type: ApplicationFiled: May 8, 2017Publication date: November 8, 2018Applicant: Octavo Systems LLCInventors: Kevin Michael Troy, Peter Robert Linder, Masood Murtuza, Gene Alan Frantz
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Publication number: 20180317316Abstract: Methods and systems for reducing the number of, and values of, passive components, such as capacitors, in System-in-Package devices below vendor recommendations for an active component are provided.Type: ApplicationFiled: May 1, 2018Publication date: November 1, 2018Applicant: Octavo Systems LLCInventors: Erik James Welsh, Peter Linder
