Patents Assigned to Octavo Systems LLC
  • Publication number: 20180317323
    Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.
    Type: Application
    Filed: May 1, 2018
    Publication date: November 1, 2018
    Applicant: Octavo Systems LLC
    Inventors: Erik James Welsh, Kevin Michael Troy
  • Publication number: 20170287885
    Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.
    Type: Application
    Filed: August 13, 2015
    Publication date: October 5, 2017
    Applicant: Octavo Systems LLC
    Inventors: Masood MURTUZA, Gene Alan FRANTZ
  • Publication number: 20170221871
    Abstract: Systems and processes for flexible and/or low volume product manufacture, including cost effective ways to manufacture low volume system level devices. In one aspect, this disclosure enables the manufacture of a plurality of System in Package (SiP) devices. In one aspect, the devices include one or more of an optical and electrical identifier, corresponding to substrates and/or product designs. The identifiers can be used in the assembly of the devices.
    Type: Application
    Filed: January 31, 2017
    Publication date: August 3, 2017
    Applicant: Octavo Systems LLC
    Inventors: Gregory Michael Sheridan, Gene Alan Frantz, Masood Murtuza, Shankar Jayaraman Panchavati