Abstract: Systems and methods for the design and use of a System-in-Package (SiP) device with a connection layout for minimizing a system Printed Circuit Board (PCB) using the SiP are provided.
Abstract: Methods, systems, and devices for enabling the use of a special, generic, or standard substrate for similar system SIP assemblies are disclosed. The required customization, which is defined by a system's interconnecting scheme, is done during package assembly by creating appropriate connections using wire bonds on pads that are placed on the substrate and intentionally left open for purpose of customization. The wire bond links can be changed as required for a given system design.
Abstract: Systems and processes for flexible and/or low volume product manufacture, including cost effective ways to manufacture low volume system level devices. In one aspect, this disclosure enables the manufacture of a plurality of System in Package (SiP) devices. In one aspect, the devices include one or more of an optical and electrical identifier, corresponding to substrates and/or product designs. The identifiers can be used in the assembly of the devices.
Type:
Application
Filed:
January 31, 2017
Publication date:
August 3, 2017
Applicant:
Octavo Systems LLC
Inventors:
Gregory Michael Sheridan, Gene Alan Frantz, Masood Murtuza, Shankar Jayaraman Panchavati