Abstract: A replaceable tip for a hand-held pencil-like solder extractor for removing electronic components from a substrate. The tip comprises a tubular member having a first linear section of predetermined length with a first end coaxially receivable within a passageway in a solder extractor, a second linear section of predetermined length and having a free end, and a detent means intermediate the first and second sections for limiting the length of the tubular member received within the solder extractor passageway and for maintaining the free end of the tubular member a fixed distance from the solder extractor. The first and second linear sections each have a respective axis, and the axis of the first section forms an angle with the axis of the second section.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a printed circuit board for melting solder or the like thereon. The device comprises two heat exchange elements having at least one passage through which fluid to be heated passes. A stainless steel etched foil heater is disposed in a plane between the first and second heat exchange elements, and a fluid entry port is provided in flow communication with the first and second heat exchange elements for admitting fluid to be heated into the at least one passage. A fluid exit port is provided in flow communication with the at least one passage for passing heated fluid from the passage to the substrate to melt the solder or the like thereon. The fluid entering through the fluid entry port and exiting through the fluid exit port flows in generally the same direction as the plane of the heater.

Abstract: Heater device suitable for heating a fluid such as air to be contacted with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a printed circuit board or removal therefrom. The device comprises two heat exchange elements having a stainless steel etched foil heater sandwiched therebetween. Each heat exchange element is approximately square in configuration, and has a passageway extending from an outer peripheral point of each element about a central axis parallel to the four sides of each element toward the center. The heat exchange elements may be connected for serial flow whereby air to be heated passes along the passageway of one element and then enters the second heat exchange element and passes through that element and exits therefrom, or for parallel flow whereby a first stream of air to be heated passes through one of the elements and a second stream of air to be heated passes through the second heat exchange element.

Abstract: A positioning apparatus for adjusting the position of a printed circuit board relative to a soldering/desoldering device, said positioning apparatus including elements for adjusting the work in the X and Y directions and the .phi. direction.

Abstract: A replaceable tip for a hand-held pencil-like solder extractor having an axis and a coaxial passageway for removing solder from a planar workpiece. The tip is a tubular member of predetermined outside diameter having a central bore of substantially constant cross-section, the tubular member having a first linear section of predetermined length which is coaxially received within the passageway of the solder extractor, a second linear section of predetermined length having a free end for contacting solder, and an intermediate curved section which acts as a detent for limiting the length of the tubular member which is insertable into the solder extractor passageway and maintains the free end a fixed distance from the solder extractor. The first and second sections are angled with respect to one another so that, in use, when an operator grasps the solder extractor in a pencil-like manner, the second linear section is disposed substantially perpendicularly to the planar surface of a workpiece, e.g.

Abstract: A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changeable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.

Abstract: An apparatus is disclosed for removing or installing at least one through-hole mounted component from a printed circuit board or the like, the apparatus including a compliant mask for contacting and supporting the printed circuit board with the mask having at least one hole extending therethrough and the hole being aligned with the component. A conduit is provided for directing liquid solder into the hole in the mask to contact leads of the component and thus facilitate installation or removal thereof from the board.

Abstract: Circuitry for detecting a pulse having a duration as short as 10 nanoseconds. The circuitry includes a storage device for storing the peak amplitude of the pulse. Signal resolution enhancement circuitry is responsive to the storage device for establishing a plurality of channels respectively corresponding to a plurality of signal amplitude ranges where the range of signal amplitudes for each successive range is larger than that of the range preceding it. Peak signal detecting circuitry is responsive to the signal resolution enhancement circuitry for (a) scanning the channels, (b) selecting one of the channels, the selected channel being such that the peak amplitude falls within the range for the channel, and (c) detecting the peak amplitude of the pulse.

Abstract: Nozzle structure suitable for bringing heated fluid into contact with a plurality of terminals of a modular electronic component to facilitate attachment of the component to a substrate or removal therefrom. The nozzle structure comprises a conduit forming member engageable with the component and with the substrate to form a heated fluid conduit extending around the periphery of the component, and a heated fluid delivery conduit coupled to the conduit forming member for delivering heated fluid to the heated fluid conduit to effect melting of solder or the like at the terminals of the component.

Abstract: The invention is a device for attaching or removing electronic components from a substrate and includes a nozzle for delivering heat to the terminal areas of the substrate. The nozzle includes a first plate, spaced from the component, having openings corresponding to the terminals of the component. The nozzle further includes a second portion below the plate for directing heated fluid to the component. Further, at least one opening in the plate is enlarged to delivery more heat to certain terminals connected to a ground plate, for example.

Abstract: A device is disclosed for attaching to or removing modular electronic components from a substrate which is adjustably positioned beneath a heater means delivering a flow of uniformly heated air. The heated air is directed to the sides of the component to melt solder associated with terminals thereon by a series of changable nozzles which can be moved into or out of registry with the component. Vacuum means is also provided for contacting the component to position it on or remove it from the substrate.

Abstract: An improved solder extractor has a tip temperature sensor coaxially disposed about the hollow tubular tip forward of the electric heat generating assembly into the which the tip is inserted and thermally insulated therefrom. The tip is held within the heat generating assembly by a plurality of springs formed as angular sections of a hollow cylinder which are symmetrically disposed about the tip between the tip and the heat generating element. The tip is also provided with a chamfered end which mates with a corresponding chamfer on a detent within the heat generating assembly to form a vacuum seal with a source of vacuum.

Abstract: A portable machine is disclosed for setting eyelets and the like in printed circuit boards and includes an upper tool connected to a mandrel mounted in a frame and movable into and out of engagement with a lower tool by a toggle means. The lower tool is resiliently mounted in the frame beneath the upper tool and has a support structure beneath it which includes a slidable pressure control means for predetermining the maximum setting pressure applied to a workpiece by the upper and lower tools.

Abstract: A method and apparatus is disclosed for soldering leadless semiconductor modules having contact pads on the bottom thereof to and desoldering them from leaded terminal pads on a printed wiring board. The device includes a housing having a bore in which is slidably mounted a suction head. The suction head is used to raise and lower the module relative to the leaded terminals. The suction head has a passageway connected to a source of vacuum for both holding the module relative to the head as well as exhausting heated air from a source which is directed against the leaded terminals to melt same.

Abstract: An air switch comprises a switch body having a recess thereon and a switching member having an output connection port. The recess is connected to vacuum and pressure outlets through passages in the switch body. The vacuum passage is connected to a port on the wall of the recess while the pressure passage is connected to a partially circularly extending channel on the recess wall. The switching member is rotatably received in the recess and includes a radially extending channel on its inner wall. Positioning of the switching member in the vacuum or pressure modes places the member channel in fluid communication with either the vacuum port or the channel on the recess wall. When in the vacuum mode, the pressure channel is vented to the atmosphere and when in the pressure mode, the vacuum is similarly vented. When in the minimum pressure mode, a portion of the pressure is vented to the atmosphere although this pressure venting is reduced to zero when the switching member is in the maximum pressure mode.

Abstract: Disclosed is a modular power supply having a case made up of top, bottom and side plates. Each plate has either a male or female portion at the edge which is slidably interconnectable with the edge of an adjacent plate. In addition, male and/or female portions located on the top, bottom and side plates matingly engage with similar female and/or male portions on a handle, output device receptacle, etc. The internal portions of the power supply are divided into three modular components. The first modular component includes a transformer and a primary coil select switch and is connected to the rear portion of the case preventing the case sides from slipping apart from the top and bottom plates. A second modular component is a printed circuit board interconnectable with the first modular component and containing a temperature control circuit and an air pump and motor combination. The second modular component is slidably received into the case.