Abstract: A suction-type desoldering device includes an elongated tubular heater assembly secured to the forward end of a hollow handle by a radial flange on the assembly. A removable solder collecting chamber adapted to have a vacuum created therein is disposed within the handle and has an open end connected in solder flow communication with the heater assembly by means of a compressible sealing member disposed between the flange and the open end of the chamber. The heater assembly includes a tubular sleeve secured to and extending through the flange adjacent the seal. A tubular support having a length of electric resistance heating wire wrapped therearound is mounted coaxially within and spaced from the tubular sleeve and has one end thereof extending freely into the collection chamber and the other end thereof receiving a removable tubular desoldering tip.

Abstract: An electric heater assembly for tools having a removable heated tip includes a tubular metal base having an open end adapted to removably receive and hold the end of the tool tip. A coating of ceramic electrical insulation material is provided on a portion of the exterior of the base and a length of Nickel-Iron alloy resistance wire is wound on the ceramic coated portion. Electrical lead wires are connected in lapped relationship to the respective ends of the resistance wire. Each lead wire includes a first portion lying between several turns of resistance wire and the ceramic coating on the base and a second portion bent back and overlaying the several turns of resistance wire. The second portion is wrapped with at least one additional turn of the resistance wire. A coating of ceramic electrical insulation material is provided over the resistance wire and the terminals to seal the same from the deliterious effects of the atmosphere.

Abstract: An improved thermal barrier for rigidly connecting the heater assembly to a handle assembly in a desoldering device. In a preferred embodiment, the thermal barrier includes a slotted spacer portion which is connected to the heater assembly and serves to reduce heat transferred into the thermal barrier by means of radiation, convection and reduced conductivity. The thermal barrier also includes a portion connecting the slotted spacer portions to mounting sections which are connected to the handle assembly such that an indirect path for heat conduction is established between the heater assembly and the handle assembly. In some preferred embodiments, a fin is included to increase the surface area of the thermal barrier and further transfer heat from the thermal barrier to the atmosphere.

Abstract: A thermal tool and tip for the tool are disclosed. The tip includes a twisted loop of heat generating wire where the ends thereof are adapted for insertion into electrical connectors in the end of the tool. The loop is twisted at an intermediate portion and terminates in a working tip end. The flexibility of the working tip end with respect to the legs can be varied by selecting the location of the twisted portion relative to the legs.

Abstract: A portable electronics repair system including a portable container, a motor disposed within the container, an air/vacuum pump disposed within the container and driven by the motor, an electrical power source removably connected to the container for driving the motor, and a desolderer removably connected to the air/vacuum pump, the desolderer including an electrical heater assembly energized by the electrical power source.The desolderer includes a high heat, low energy consumption heater assembly and desoldering tip combination which facilitates rapid heating of the tip to soldering melting temperatures. An improved heater assembly is also provided which may be removably connected to the desolderer handle. The solder collector tube may be disposed within the desolderer handle and mounted with respect to an outer sleeve of the heater assembly. Means are provided for connecting the heating wire to the space outside the solder collector tube.

Abstract: A desolderer and heater assembly therefor wherein the heater assembly includes at least a heating element and a solder transfer means where the forward end of the solder transfer means is adapted to receive a desoldering tip and where the thermal characteristics of the rear end portion of the solder transfer means are such that the heater element raises the rear end portion of the solder transfer means to a solder melting temperature shortly after the tip reaches this temperature. The desolderer includes a solder collection chamber into which molten solder is ejected from the solder transfer means where the solder collection chamber may be disposed either inside or outside the desolderer handle. Various embodiments are described whereby the heater assembly may be adapted to receive a seal mounting member so that the forward end of the solder collection chamber can be sealed at a surface which is removed from the path the molten solder traverses through the solder transfer means.

Abstract: A container having two channel-like members which mate with one another to form an enclosure and a plurality of threadable clip members attached to the channel-like members, each threadable clip member having a threadable slot where (a) the slots of certain ones of the clip members respectively receive predetermined edges of the channel-like members and (b) screws or the like may be threaded in the slots of the remaining ones of the threadable clip members, the screws extending through holes provided in the channel-like members to thereby secure the latter members together.

Abstract: Apparatus including a planar support having a plurality of terminations such as plated through holes arranged therein in an array and a plurality of sensing devices respectively associated with the terminations for measuring a physical quantity thereat such as temperature. The resulting structure is useful for training a person in a manual skill such as soldering. Also disclosed is a common connector plug for receiving at one side of the support a plurality of electrical leads from the sensing devices and an analyzer and indicator connected to the common plug for measuring the time required for the temperature and/or pressure at one of the terminals to rise from an initial value to a final value, the terminal being that to which a device such as a soldering iron is applied to effect the soldering of an electrical connection thereat.

Abstract: A desolderer and heater assembly therefor wherein the heater assembly includes at least a heating element and a solder transfer means where the forward end of the solder transfer means is adapted to receive a desoldering tip and where the thermal characteristics of the rear end portion of the solder transfer means are such that the heater element raises the rear end portion of the solder transfer means to a solder melting temperature shortly after the tip reaches this temperature. The desolderer includes a solder collection chamber into which molten solder is ejected from the solder transfer means where the solder collection chamber may be disposed either inside or outside the desolderer handle. Various embodiments are described whereby the heater assembly may be adapted to receive a seal mounting member so that the forward end of the solder collection chamber can be sealed at a surface which is removed from the path the molten solder traverses through the solder transfer means.

Abstract: A method of laying large surfacing and/or decorative floor panels or sheets upon a sub-floor with hot melt adhesives which have no solvents but are activated by heat and bond immediately upon loss of heat to a predetermined level, which method provides steps of running an adhesive undercoated 4.times. 8 foot sheet, for example, over a low profile heater on the sub-floor, and pressing the sheet to a preselected desired position on the sub-floor before the adhesive cools to mechanical bonding temperature and including removal of damaged or mislaid sheets by inverting the heater and running over the exposed sheet surface to heat the underlying adhesive to an elevated release temperature so manual lifting can remove the sheet without damage to the sub-floor.

Abstract: A system is disclosed for laminating surfacing materials, such as high and low pressure laminates, paper, wood veneers, metal foils and the like to core material, such as plywood, particle board, flake board, hard board, rigid plastic foams and the like.The disclosure includes a machine and a method of laminating, particularly utilizing high viscosity, hot melt adhesives. A sandwich is formed at ambient temperature with the adhesive between the laminate and core either as sheet material or precoated on the laminate or the core. The method employs a progressive heating of the adhesive and adjacent parts of the sandwich from ambient temperature through tackiness to an activating temperature followed immediately by a physical migration of the adhesive to wet out adjacent surfaces followed by a cooling of the sandwich to a mechanical bonding adhesive temperature.

Abstract: A general purpose desolderer and means for converting the general purpose desolderer to either a soldering iron or a special purpose desolderer is disclosed. The general purpose desolderer may be converted to a soldering iron or to a special purpose desolderer by mounting the proper tip over the desoldering tip where the configuration of the distal end of the tip may be any one of various predetermined shapes depending upon the particular application, whereby the general purpose desolderer may be quickly and easily converted to other modes of operation.

Abstract: The inlet and discharge valves of a pump are each comprised of a circular valve plate centered in a circular cutout in a flat valve sheet. Diametrically opposed webs join the valve plate to the main body of the valve sheet and perforations in the webs provide both, spring action and allow for air passage.