Patents Assigned to PLATECH CO., LTD.
  • Patent number: 11879181
    Abstract: Provided is an electroplating solution of tin or a tin alloy in which the thickness variation of wafer bumps is maintained at a low level even in various changes of plating conditions and thus the mass productivity is improved. The electroplating solution of tin or a tin alloy may include tin ions as metal ions, a conductive salt, a carboxylic acid as a structure refiner, and a combination of a flavone compound and a quaternary ammonium compound as a thickness variation improving agent.
    Type: Grant
    Filed: September 26, 2022
    Date of Patent: January 23, 2024
    Assignee: HOJIN PLATECH CO., LTD.
    Inventors: Woon Suk Jung, Jong Uk Kim, Jin Gyu Lee
  • Patent number: 11794669
    Abstract: A fastening structure for a vehicle includes an upper trim of which an outer clip inserted into a panel is formed thereon, and a lower trim of which an inner clip inserted into the outer clip is formed thereon.
    Type: Grant
    Filed: August 18, 2021
    Date of Patent: October 24, 2023
    Assignees: HYUNDAI MOTOR COMPANY, KIA CORPORATION, A-SUNG PLATECH CO., LTD.
    Inventors: Han Shin, Janghyun Cho, Kyusung Park, Giung Park
  • Publication number: 20220388875
    Abstract: A water treatment device includes: an electrode structure installed in a storage space in which water is stored or in a flow space in which water flows so as to cause an underwater plasma discharge; and a gas supply module for supplying a gas to the storage space or the flow space such that bubbles are supplied underwater, as a discharge gas, to the electrode structure, wherein the electrode structure includes: a first electrode; a second electrode disposed opposite the first electrode; and a dielectric member disposed in a space between the first electrode and the second electrode.
    Type: Application
    Filed: June 2, 2020
    Publication date: December 8, 2022
    Applicant: Pure Platech Co., Ltd.
    Inventors: Kyoung Doo KANG, Kyoung Jun KO, Min Jae KIM, Seon Mi LEE
  • Patent number: 11271512
    Abstract: A motor driving device includes: a first motor and a second motor; a first power line for supplying driving power to the first motor; a second power line for supplying driving power to the second motor; a first inverter circuit configured to supply the driving power to the first power line; a second inverter circuit configured to supply the driving power to the second power line; transmission lines including a pair of a U-phase line and a U?-phase line, a pair of a V-phase line and a V?-phase line, and a pair of a W-phase line and a W?-phase line; and an impedance circuit impedance-matched to the transmission lines. Each of the transmission lines is arranged via an insulator.
    Type: Grant
    Filed: June 7, 2019
    Date of Patent: March 8, 2022
    Assignee: U-MHI PLATECH CO., LTD.
    Inventor: Takashi Takii
  • Publication number: 20220055547
    Abstract: A fastening structure for a vehicle includes an upper trim of which an outer clip inserted into a panel is formed thereon, and a lower trim of which an inner clip inserted into the outer clip is formed thereon.
    Type: Application
    Filed: August 18, 2021
    Publication date: February 24, 2022
    Applicants: HYUNDAI MOTOR COMPANY, KIA CORPORATION, A-SUNG PLATECH CO., LTD.
    Inventors: Han SHIN, Janghyun CHO, Kyusung PARK, Giung PARK
  • Patent number: 11159107
    Abstract: A motor driving apparatus includes a first motor group including a number N of individual servo motors, a second motor group including a number N of individual second servo motors driven synchronously with the servo motors, and an inverter control unit. The inverter control unit controls a first switching total value and a second switching total value to be reversed in positive/negative sign. The first switching total value is obtained by subtracting the number of semiconductor switching devices opened in circuit on low potential side from the number of semiconductor switching devices opened in circuit on first high potential side, corresponding to the first motor group. The second switching total value is obtained by subtracting the number of semiconductor switching devices opened in circuit on high potential side from the number of second switching elements opened in circuit on low potential side, corresponding to the second motor group.
    Type: Grant
    Filed: September 7, 2018
    Date of Patent: October 26, 2021
    Assignee: U-MHI PLATECH CO., LTD.
    Inventor: Takashi Takii
  • Patent number: 10766178
    Abstract: Provided is a screw that is for use in an injection molding machine and that makes it possible to benefit from the kneading effect of a multi-start screw while minimizing the received friction resistance. The screw for an injection molding machine is provided with a first stage 20 on the upstream side and a second stage 30 on the downstream side. The screw for an injection molding machine is characterized in that: the first stage 20 is provided with a compression section 22 comprising a main scraper 25 and an auxiliary scraper 26 having a smaller outer diameter than the main scraper 25; and the second stage 30 is provided with a multi-start screw section 31, said multi-start screw section being provided on the upstream side and comprising a plurality of scrapers, and a fin kneading section 32 provided downstream from the multi-start screw section.
    Type: Grant
    Filed: January 15, 2015
    Date of Patent: September 8, 2020
    Assignees: U-MHI PLATECH CO., LTD., MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Munehiro Nobuta, Naoki Toda, Toshihiko Kariya, Takeshi Yamaguchi, Kiyoshi Kinoshita
  • Patent number: 10710290
    Abstract: A mold platen includes a mold plate to which a mold is attached, a rear-surface plate provided opposite to the mold plate, coupling portions configured to be coupled to respective tie rods at four corners of the mold plate and the rear-surface plate, a cylindrical rib that is provided between the mold plate and the rear-surface plate and is located at a center part of the mold plate and the rear-surface plate, a diagonal reinforcing rib that is provided between the mold plate and the rear-surface plate and is configured to connect the cylindrical rib and each of the coupling portions, and a longitudinal/lateral reinforcing rib that is provided between the mold plate and the rear-surface plate and extends from the cylindrical rib along a position between the adjacent coupling portions.
    Type: Grant
    Filed: October 6, 2017
    Date of Patent: July 14, 2020
    Assignee: U-MHI PLATECH CO., LTD.
    Inventor: Naoki Kato
  • Patent number: 10525623
    Abstract: Provided is a mold opening/closing device that can prevent a ball screw shaft from reaching a risky speed while using a ball screw having a cantilever supporting structure. A mold clamping device according to the present invention is provided with: a ball screw having a ball screw shaft and a ball screw nut that meshes with the ball screw shaft; and a motor that drives the ball screw. One end of the ball screw shaft is supported by a fixation plate or a movable plate so as to be rotatable or non-rotatable, while being restricted in movement in an axial direction and thereby serving as a fixed end, and the other end thereof serves as a free end. Further, the mold clamping device is characterized in that a distance between the ball screw nut and the fixed end is shorter than a distance between the fixed plate and the movable plate.
    Type: Grant
    Filed: May 9, 2016
    Date of Patent: January 7, 2020
    Assignee: U-MHI PLATECH CO., LTD.
    Inventors: Shinichi Takahashi, Naoki Kato, Toshihiko Kariya
  • Patent number: 10493680
    Abstract: A temperature control method includes: a step of obtaining, by means of PID control, a first energization rate based on a first temperature difference between an actually measured temperature and a target temperature; a step of obtaining a second energization rate based on a second temperature difference between the ambient temperature of the environment in which a heating barrel is disposed and the target temperature; a step of obtaining a corrected energization rate on the basis of the result of comparison of the first energization rate and the second energization rate; and a step of controlling the electrical power to be supplied to a heater on the basis of the corrected energization rate. The corrected energization rate is set to any of predetermined first, second, and third conditions on the basis of the comparison result.
    Type: Grant
    Filed: November 25, 2015
    Date of Patent: December 3, 2019
    Assignee: U-MHI PLATECH CO., LTD.
    Inventors: Takashi Takii, Yasuhiro Kai
  • Patent number: 10486351
    Abstract: There is provided a screw of an injection molding machine that can eliminate uneven distribution of reinforcing fibers without giving an excessive shear force to the reinforcing fibers. A screw is provided inside a heating cylinder of an injection molding machine to which a resin pellet is fed on an upstream side in a conveyance direction of resin and to which reinforcing fibers are fed on a downstream side therein, and includes: a first stage at which the resin pellet which is fed is melted; and a second stage that continues to the first stage, and at which molten resin and the reinforcing fibers are mixed with each other. A second flight provided at the second stage includes: a large-diameter flight with a relatively large outer diameter; and a small-diameter flight with a relatively small outer diameter.
    Type: Grant
    Filed: June 9, 2014
    Date of Patent: November 26, 2019
    Assignees: U-MHI PLATECH CO., LTD., MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Toshihiko Kariya, Munehiro Nobuta, Naoki Toda, Kiyoshi Kinoshita, Takeshi Yamaguchi
  • Patent number: 10464246
    Abstract: An injection molding method includes: a plasticizing process of feeding a resin pellet and additive components to a heating cylinder including a screw that can rotate around a rotation axis and can advance and retreat along the rotation axis, and generating molten resin by rotating the screw in a normal direction; and an injection process of injecting to a cavity the molten resin containing the additive components. In the plasticizing process, retreat operation of forcibly retreating the screw is performed at a predetermined velocity by a predetermined stroke or a predetermined time.
    Type: Grant
    Filed: April 20, 2015
    Date of Patent: November 5, 2019
    Assignees: U-MHI PLATECH CO., LTD., MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Munehiro Nobuta, Naoki Toda, Toshihiko Kariya, Takeshi Yamaguchi, Kiyoshi Kinoshita
  • Patent number: 10338771
    Abstract: Provided is a control device for an injection molding machine, capable of reducing the load on a user when re-displaying a previously displayed screen. The control device (20) for the injection molding machine (1) controls the display of display images on a display unit (29). This control device (20) divides the display unit (29) into a first display area (31) and a second display area (32) and, if an instruction to scroll in the vertical direction is received when a first display image (P1) is displayed in the first display area (31) and a second display image (P2) is displayed in the second display area (32), synchronously scrolls the first display image (P1) and the second display image (P2) whilst maintaining the relative positions of the first display image (P1) and the second display image (P2).
    Type: Grant
    Filed: November 7, 2013
    Date of Patent: July 2, 2019
    Assignee: U-MHI PLATECH CO., LTD.
    Inventors: Yasuo Okochi, Takashi Takii, Toshihiko Kariya
  • Patent number: 10033234
    Abstract: A motor includes a stator that generates a rotating magnetic field; a rotor supported rotatably by a shaft within the stator; an outermost peripheral permanent magnet that is a permanent magnet embedded inside the rotor in an arced shape forming a convexity at the inner surface of the rotor; and an inner permanent magnet that is a permanent magnet embedded at the inside of the rotor in parallel to the outermost peripheral permanent magnet. The arc angle of the permanent magnets is greater than 90°, the thickness at the center of both inner permanent magnets is thinner than the thickness at the center of the outermost peripheral permanent magnet, and the thickness at the ends of both inner permanent magnets is thicker than the thickness at the ends of the outermost peripheral permanent magnet.
    Type: Grant
    Filed: May 7, 2014
    Date of Patent: July 24, 2018
    Assignees: U-MHI PLATECH CO., LTD., MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Mikito Sasaki, Shinichi Isobe
  • Patent number: 9821498
    Abstract: In an injection molding method, using a heating cylinder having on the front end thereof a discharge nozzle, a single axis screw is rotatable inside the heating cylinder, a fiber-supplying device fills reinforcing fiber into the heating cylinder, and injection molding is performed while supplying the reinforcing fiber and the resin starting material separately and supplying the reinforcing fiber on the front side of the resin starting material. The method includes a plasticization process for obtaining a specified amount of a kneaded product by retracting the screw while rotating in the normal direction to melt the resin starting material and knead reinforcing fiber into the melted resin starting material, and an injection process for discharging the kneaded product from the discharge nozzle by advancing the screw. Reinforcing fiber is supplied into the heating cylinder in the injection process.
    Type: Grant
    Filed: March 25, 2013
    Date of Patent: November 21, 2017
    Assignees: U-MHI PLATECH CO., LTD., MITSUBISHI HEAVY INDUSTRIES, LTD.
    Inventors: Ryoji Okabe, Toshihiko Kariya, Naoki Toda, Munehiro Nobuta
  • Patent number: 9807850
    Abstract: Disclosed herein is an apparatus for controlling an operation of a road stud. The apparatus includes a light emitting unit of the road stud, a power supply unit configured to supply power to the light emitting unit, an illumination sensor unit configured to apply a voltage corresponding to a peripheral illumination of the road stud, a reference-voltage generating unit configured to apply a reference voltage corresponding to a reference illumination of the road stud, a light emitting control unit configured to interrupt supply of power to the light emitting unit when the peripheral illumination of the road stud is equal to or more than the reference illumination, and configured to allow the supply of the power to the light emitting unit only when the peripheral illumination of the road stud is less than the reference illumination, and a road stud type-identification unit.
    Type: Grant
    Filed: August 25, 2016
    Date of Patent: October 31, 2017
    Assignee: PLATECH CO., LTD.
    Inventor: Jong Tai Park
  • Patent number: 9525096
    Abstract: The present invention relates to plating equipment and method for a solar cell wafer using electroplating and light-induced plating jointly. The plating equipment includes a jig allowing a wafer (1), that is a body to be plated, to be vertically immersed into a plating solution at a center of a plating bath (209), a first plating unit (200) comprising a plurality of anode members (210) symmetrically disposed on both sides of the plating bath (209) facing the wafer (1), the first plating unit performing electroplating; and a second plating unit (300) disposed in a light source receiving unit (320) physically blocked from the first plating unit (200), the second plating unit (300) being disposed at a rear side of the anode members (210) to perform light-induced plating by using an light emitting diode (LED) lamp (301) irradiating light onto the wafer (1).
    Type: Grant
    Filed: February 6, 2014
    Date of Patent: December 20, 2016
    Assignee: HOJIN PLATECH CO., LTD.
    Inventors: Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
  • Patent number: 9194053
    Abstract: Provided is a substrate carrier device for electroplating of a solar cell which simultaneously plates both surfaces of a wafer.
    Type: Grant
    Filed: April 5, 2013
    Date of Patent: November 24, 2015
    Assignee: HOJIN PLATECH CO., LTD.
    Inventors: Pan Soo Kim, Duk Haeng Lee, Woon Suk Jung
  • Patent number: D925855
    Type: Grant
    Filed: November 21, 2019
    Date of Patent: July 20, 2021
    Assignees: PLATECH CO., LTD
    Inventor: Chan Moon Park
  • Patent number: D1022363
    Type: Grant
    Filed: July 12, 2021
    Date of Patent: April 9, 2024
    Assignees: PLATECH CO., LTD
    Inventor: Chan Moon Park